TC9350BFN-T00,TC9350BFN-T01 TOSHIBA CMOS Type Integrated Circuit Silicon Monolithic TC9350BFN-T00,TC9350BFN-T01 USB Mouse Controller IC The TC9350BFN is a USB 1.1 mouse controller IC. It can communicate with Agilent's ADNS-2610 optical mouse sensor. Features • Conforms to USB HID specification version 1.1 • Supports Agilent's ADNS-2610 optical mouse sensor. • The TC9350BFN-T00 enables the built-in pull-up resistors of the encoder input pins (PT3A, PT3B) when the mouse is operating. It is suitable for a mechanical encoder. (The pull-up resistors are disabled in suspend mode.) Weight: 0.07 g (typ.) • The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is suitable for an optical encoder (phototransistor and LED). • Input/output ports USB input/output driver: 2 pins (DP/DM) Switch input: 3 pins (SW1, SW2, SW3) Serial port clock output: 1 pin (SCK) Serial data input/output: 1 pin (SDIO) VDD control (for controlling the power supply for the ADNS-2610 optical mouse sensor): 1 pin (VCNT) Encoder input: 2 pins (PT3A, PT3B) LED driver: 1 pin (LED) • Operating voltage: 4.35 to 5.25 V • Operating temperature: 0 to 70°C • Operating frequency: 6 MHz • 0.6-µm CMOS monolithic IC • Small package: SSOP16: SSOP16-P-225-0.65B 1 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Pin Description Symbol I/O Pin No. Description SW1 I 15 Switch input pin 1 (left switch signal input pin). SW2 I 14 Switch input pin 2 (middle switch signal input pin). SW3 I 2 Switch input pin 3 (right switch signal input pin). SCK O 4 Serial port clock (output) pin. SDIO I/O 3 Serial data input and output pin. VCNT O 6 VDD (Optical Sensor) Control pin (for controlling the power supply for the ADNS-2610 optical mouse sensor). NU I 5 No use (please connect to GND). PT3A I 12 Encoder input pin A. PT3B I 13 Encoder input pin B. LED O 7 LED driver output. DM I/O 9 USB DM pin. DP I/O 10 USB DP pin. VDD ⎯ 11 Power supply pin. GND ⎯ 8 Ground pin. XOUT O 1 Ceramic resonator output pin. XIN I 16 Ceramic resonator input pin. Pin Assignment (top view) (Connect to GND) XOUT 1 16 XIN SW3 2 15 SW1 SDIO 3 14 SW2 SCK 4 13 PT3B NU 5 12 PT3A VCNT 6 11 VDD LED 7 10 DP GND 8 9 DM 2 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Pin Explanation Symbol Description VDD 5 V power supply. Guaranteed 4.35 to 5.25 V. GND Ground. XIN Connected to a 6-MHz ceramic resonator (ceramic resonator input pin). XOUT Connected to a 6-MHz ceramic resonator (ceramic resonator output pin). LED When the mouse is operating, the LED is always turned on by current drive with N-MOS turned on. The sink current is 50 mA maximum. Current drive is turned off in suspend mode. SW [1:3] Connected to the buttons (left, middle, and right) of the mouse. Pulled up to VDD by built-in resistors. To prevent chattering noise, the SW signals are not recognized until 15 ms after the first change in their state, allowing the signals to be sufficiently stabilized before entering the internal circuit. The pins are assigned to the mouse switches as follows: SW1: Left switch SW2: Middle switch SW3: Right switch SCK Serial port clock (output) pin. SDIO Serial data input and output pin. VCNT VDD control pin (for controlling the power supply for the ADNS-2610 optical mouse sensor) When the mouse is operating, the TC9350BFN supplies power to the optical mouse sensor via an external transistor by current drive with N-MOS turned on. In suspend mode, N-MOS is turned off, stopping power supply to the optical mouse sensor. NU No use pin. Please connect to GND. PT3A/B Encoder input pins. PT3A and PT3B are used as scroll pins. Data is sampled at intervals of 100 µs. The TC9350BFN-T00 enables the built-in pull-up resistors of the encoder input pins (PT3A, PT3B) when the mouse is operating. It is suitable for a mechanical encoder. (The pull-up resistors are disabled in suspend mode.) When using a mechanical encoder, it is recommended to use an external capacitor to reduce chattering and bouncing. In stable state, PT3A = PT3B. The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is suitable for an optical encoder (phototransistor and LED). DP, DM It connects with the both-directions data bus line of USB. Note: Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may damage the IC chip. When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to peripheral components. 3 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Symbol I/O Pin No. Description SW1 I 15 Switch input 1 (left). SW2 I 14 Switch input 2 (middle). Circuit VDD (Signal) (SW [1-3]) SW3 I 2 Switch input 3 (right). PT3A I 12 Encoder input pins A. GND VDD (PT3A/B) PT3B I 13 (Signal) Encoder input pins B. GND VDD SDIO I/O 3 (Signal) Serial data input and output. (SDIO) GND VDD SCK O 4 Serial port clock (output). (SCK) GND VDD LED O 7 LED driver output. (LED) GND VDD VCNT O 6 VDD Control pin. (Controling the power supply for the Optical Mouse Sensor). (VCNT) GND 4 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Symbol I/O Pin No. Description Circuit VDD (Signal) DM I/O 9 (Signal) USB DM pin. (DM) (Signal) (DP) GND VDD (Signal) (Signal) DP I/O 10 USB DP pin. (DP) (Signal) (DM) GND VDD ⎯ 11 Power supply. GND ⎯ 8 Ground. VDD XOUT O 1 Ceramic resonator out. (XIN) GND VDD XIN I 16 Ceramic resonator in. (XOUT) GND 5 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Block Diagram Resonator 6 MHz LED (1 pin) SDIO (1 pin) SCK (1 pin) (2 pin) Internal OSC Clock generator LED port 14 bit timer SDIO port SCK port USB data I/O port Switch input port Encoder input port VDD_CNTL port (4 pin) D+, D− Vbus/GND (3 pin) SW [1:3] (2 pin) PT3A/B (1 pin) VCNT 6 MHz 300 kHz Control logic Power on reset 6 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Example of Circuit TC9350BFN-T00 TR1 C RLED1 REB2 RB1 REB1 C Resonator (6 MHz) GND SLD SW3 SDIO SCK NU VCNT LED GND 1 16 2 15 3 14 13 4 12 5 11 6 7 10 8 9 C XIN SW1 SW2 3 PT3B 4 PT3A Image sensor SDIO SCK Wheel encoder LED_CNTL ADNS 2610 VDD 8 DP C DM OSC_IN Sur face 5 RB2 1 REFA OSC_OUT TR2 D+ XOUT 2 24 MHz D− 7.5 k VBUS LED1 7 VDD USB cable GND 6 C 7 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 TC9350BFN-T01 TR1 C RLED1 REB2 RB1 REB1 C Resonator (6 MHz) SLD SCK NU VCNT LED GND 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 C PhotoTr. (wheel) SW1 SW2 PT3B 3 4 Image sensor SDIO SCK LED_CNTL PT3A ADNS 2610 VDD 8 DP C DM OSC_IN Sur face 5 RB2 1 REFA OSC_OUT TR2 GND SDIO 1 2 24 MHz D+ SW3 XIN LED2 RLED2 D− 7.5 k VBUS XOUT LED1 7 VDD USB cable GND 6 C 8 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Tstg −40~ + 150 °C TA 0~ + 70 °C VDD −0.5~ + 5.5 V VIN −0.5~ VDD + 0.25 V DC output voltage at high impedance VOUT −0.5~ VDD + 0.25 V LED output pin current ILED 70 mA VCNT output pin current IVCNT 7 mA SDIO output pin current ISDIO 5 mA SCK output pin current ISCK 5 mA PD 100 mW VESD MIL: −2 k~ + 2 k V ILATCH 200 mA Storage temperature range Operating ambient temperature range Power supply voltage DC input voltage Power consumption Elector static destruction Latch up current Electrical Characteristics (Ta = 25°C) (1) General Characteristics Symbol Test Condition Min Typ. Max Unit 4.35 5.0 5.25 V Power supply voltage 2 VDD Power supply current (normal operation) IDD IC only. ⎯ ⎯ 5 mA Power supply current (suspend mode) ISB IC only. ⎯ ⎯ 250 µA Min Typ. Max Unit (2) USB interface Characteristics Symbol Test Condition Output High voltage VOH 2.8 ⎯ 3.6 V Output Low voltage VOL ⎯ ⎯ 0.3 V Differential signal input common mode range VCM 0.8 ⎯ 2.5 V A receiving part single end input threshold voltage VSE 0.8 ⎯ 2.0 V Data rising time TR C = 350 pF (10% to 90%) 75 ⎯ 300 ns Data falling time TF C = 350 pF (10% to 90%) 75 ⎯ 300 ns Rising/Falling matching TLRFM 80 ⎯ 125 % Output cross voltage VCRS 1.3 ⎯ 2.0 V Applied to pins DM, DP 9 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 (3) I/O Characteristics Symbol Test Condition Min Typ. Max Unit VOLLED ILED = 50 mA ⎯ ⎯ 0.8 V Output low voltage of VCNT VOLVCNT IVCNT = 5 mA ⎯ ⎯ 0.8 V Output high voltage of SDIO VOHSDIO ISDIO = −1 mA VDD − 0.8 ⎯ ⎯ V Output low voltage of SDIO VOLSDIO ISDIO = 1 mA ⎯ ⎯ 0.4 V Output high voltage of SCK VOHSCK ISCK = −1 mA VDD − 0.8 ⎯ ⎯ V Output low voltage of SCK VOLSCK ISCK = 1 mA ⎯ ⎯ 0.4 V Output low voltage of LED Input threshold voltage (SW) VITH1 25% ⎯ 75% VDD Input threshold voltage (PT) VITH2 30% ⎯ 70% VDD Input threshold voltage (SDIO) VITH3 30% ⎯ 70% VDD IIN −1 ⎯ 1 µA Leak current Applied to pins LED, VCNT, SDIO, SCK, SW1-3, PT3A/B 10 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Scrolling and the scroll count The following describes signal processing during scrolling: << Scroll signal processing >> “+1 count” (If the transition of PT3A precedes that of PT3B) (PT3A, PT3B) = (0,0) → (1,0) → (1,1) or (PT3A, PT3B) = (1,1) → (0,1) → (0,0) “−1 count” (If the transition of PT3B precedes that of PT3A) (PT3A, PT3B) = (0,0) → (0,1) → (1,1) or (PT3A, PT3B) = (1,1) → (1,0) → (0,0) PT3A : PT3B 0:0 0:1 1:0 PT3A : PT3B 1:1 −1 count +1 count +1 count 11 −1 count 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Package Dimensions Weight: 0.07 g (typ.) 12 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Marking (example) TC9350BFN-T00 50B–T0 215 A1 Type name Weekly code Lot code TC9350BFN-T01 50B–T1 215 A1 Type name Weekly code Lot code 13 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Appendix A. Recommended mounting of TC9350BFN Infrared or hot air reflow Preheat conditions: 140 to 160°C, 60 to 120 seconds Reflow conditions: (a) 240°C max., (b) 210°C min., within 30 seconds Soldering times: Maximum 2 times Temperature profile: (°C) Package surface temperature 240 210 160 140 60 to 120 seconds 30 seconds or less Time (in seconds) Solder flow (single-wave and double-wave) Preheat conditions: 140 to 160°C, 60 to 120 seconds Reflow conditions: 260°C max., within 10 seconds (For double-wave, the total time for primary wave and secondary wave must not exceed 10 seconds.) Reflow cannot be performed more than once. The following figure shows the recommended temperature profile. Temperatures described in mounting requirements are based on the solder bath temperature. The temperature profile indicates the maximum withstand temperature. The application must not cause the chip temperature to fall outside the profile range. (°C) Package surface temperature 260 160 140 60 to 120 seconds 10 seconds or less Time (in seconds) 14 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Appendix B. USB Descriptors Device Descriptor Offset Field Size Value (Hex) Description 0 bLength 1 12 Size of this descriptor in bytes. 1 bDescriptorType 1 01 Device descriptor type. 2 bcdUSB 2 0110 4 bDeviceClass 1 00 Not supported. 5 bDeviceSubClass 1 00 Not supported. 6 bDeviceProtocol 1 00 Protocol depends on selected interface. USB HID Specification Release 1.1. 7 bMaxPacketSize0 1 08 8 idVendor 2 0930 Vendor ID Maximum packet size on endpoint zero. 10 idProduct 2 6501 Product ID 12 bcdDevice 2 0000 (-T00) 0001 (-T01) 14 iManufacturer 1 01 Index of string descriptor describing manufacture. 15 iProduct 1 02 Index of string descriptor describing product. 16 iSerialNumber 1 00 Not supported. 17 bNumConfigurations 1 01 Number of possible configurations. Size Value (Hex) Device release number. Configuration Descriptor Offset Field Description 0 bLength 1 09 Size of this descriptor in bytes. 1 bDescriptorType 1 02 Configuration descriptor type. 2 wTotalLength 2 0022 4 bNumInterfaces 1 01 Number of interfaces supported by this configuration. 5 bConfigurationValue 1 01 Value to use as an argument to Set Configuration to select this configuration. 6 iConfiguration 1 00 Not supported. Total length of data returned for this configuration including interface, HID, and endpoint. 7 bmAttributes 1 A0 Bus powered and able to perform remote wakeup. 8 MaxPower 1 32 Max power String Descriptor Index Size (Character) Value (Hex) Description 0 2 0409 1 Max 8 TOSHIBA ASCII Character 2 Max 32 USB Wheel Mouse ASCII Character Language ID 15 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Interface Descriptor Offset Field Size Value (Hex) Description 0 bLength 1 09 Size of this descriptor in bytes. 1 bDescriptorType 1 04 Interface descriptor type. 2 bInterfaceNumber 1 00 Number of interface. 3 bAlternateSetting 1 00 Value used to select alternate setting. 4 bNumEndpoints 1 01 Number of endpoints. 5 bInterfaceClass 1 03 Class code (HID code assigned by USB). 6 bInterfaceSubClass 1 01 Boot interface subclass. 7 bInterfaceProtocol 1 02 Mouse. 8 iInterface 1 00 Not supported. Size Value (Hex) HID Descriptor Offset Field Description 0 bLength 1 09 Size of this descriptor in bytes. 1 bDescriptorType 1 21 HID descriptor type. 2 bcdHID 2 0110 4 bCountryCode 1 00 Country Code USA 5 bNumDescriptors 1 01 Number of report descriptors 6 bDescriptorType 1 22 Descriptor Type 7 wDescriptorLength 2 0034 Size Value (Hex) HID class specification release number. HID report Descriptor Length Endpoint Descriptor Offset Field Description 0 bLength 1 07 Size of this descriptor in bytes. 1 bDescriptorType 1 05 Endpoint descriptor type. 2 bEndpointAddress 1 81 The address of the endpoint. 3 bmAttributes 1 03 4 wMaxPacketSize 2 0004 6 bInterval 1 0A Interrupt endpoint. Maximum packet size. Interval for polling endpoint for data transfers. 16 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 HID Report Descriptor Offset 0 Field Usage page Size Value (Hex) Description 2 0501 Generic Desktop Mouse 2 Usage 2 0902 4 Collection 2 A101 Application 6 Usage 2 0901 Pointer 8 Collection 2 A100 Linked 10 Usage page 2 0509 Buttons 12 Usage 2 1901 Button 1 minimum 14 Usage maximum 2 2903 Button 3 16 Logical minimum 2 1500 Button open 18 Logical maximum 2 2501 Button close 20 Report count 2 9503 3 reports 22 Report size 2 7501 Each button report is 1bit. left = bit0, right = bit1, middle = bit2 24 Input 2 8102 Variable Data Bit Field with Absolute position 26 Report count 2 9501 1 report 28 Report size 2 7505 5 report bits for padding 30 Input 2 8101 Constant 32 Usage page 2 0501 Generic Desktop 34 Usage 2 0930 X 36 Usage 2 0931 Y 38 Usage 2 0938 Scroll 40 Logical minimum 2 1581 −127 42 Logical maximum 2 257F 127 44 Report size 2 7508 The x and y reports are 8bit 46 Report count 2 9503 3 reports 48 Input 2 8106 Variable, Relative 50 End collection 1 C0 51 End collection 1 C0 17 2004-01-20 TC9350BFN-T00,TC9350BFN-T01 Note: Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may damage the IC chip. When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to peripheral components. RESTRICTIONS ON PRODUCT USE 030619EAA • The information contained herein is subject to change without notice. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 18 2004-01-20