TOSHIBA TC9350BFN-T01

TC9350BFN-T00,TC9350BFN-T01
TOSHIBA CMOS Type Integrated Circuit Silicon Monolithic
TC9350BFN-T00,TC9350BFN-T01
USB Mouse Controller IC
The TC9350BFN is a USB 1.1 mouse controller IC.
It can communicate with Agilent's ADNS-2610 optical mouse
sensor.
Features
•
Conforms to USB HID specification version 1.1
•
Supports Agilent's ADNS-2610 optical mouse sensor.
•
The TC9350BFN-T00 enables the built-in pull-up resistors of
the encoder input pins (PT3A, PT3B) when the mouse is
operating. It is suitable for a mechanical encoder. (The pull-up
resistors are disabled in suspend mode.)
Weight: 0.07 g (typ.)
•
The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is
suitable for an optical encoder (phototransistor and LED).
•
Input/output ports
USB input/output driver: 2 pins (DP/DM)
Switch input: 3 pins (SW1, SW2, SW3)
Serial port clock output: 1 pin (SCK)
Serial data input/output: 1 pin (SDIO)
VDD control (for controlling the power supply for the ADNS-2610 optical mouse sensor): 1 pin (VCNT)
Encoder input: 2 pins (PT3A, PT3B)
LED driver: 1 pin (LED)
•
Operating voltage: 4.35 to 5.25 V
•
Operating temperature: 0 to 70°C
•
Operating frequency: 6 MHz
•
0.6-µm CMOS monolithic IC
•
Small package: SSOP16: SSOP16-P-225-0.65B
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TC9350BFN-T00,TC9350BFN-T01
Pin Description
Symbol
I/O
Pin No.
Description
SW1
I
15
Switch input pin 1 (left switch signal input pin).
SW2
I
14
Switch input pin 2 (middle switch signal input pin).
SW3
I
2
Switch input pin 3 (right switch signal input pin).
SCK
O
4
Serial port clock (output) pin.
SDIO
I/O
3
Serial data input and output pin.
VCNT
O
6
VDD (Optical Sensor) Control pin
(for controlling the power supply for the ADNS-2610 optical mouse sensor).
NU
I
5
No use (please connect to GND).
PT3A
I
12
Encoder input pin A.
PT3B
I
13
Encoder input pin B.
LED
O
7
LED driver output.
DM
I/O
9
USB DM pin.
DP
I/O
10
USB DP pin.
VDD
⎯
11
Power supply pin.
GND
⎯
8
Ground pin.
XOUT
O
1
Ceramic resonator output pin.
XIN
I
16
Ceramic resonator input pin.
Pin Assignment (top view)
(Connect to GND)
XOUT
1
16
XIN
SW3
2
15
SW1
SDIO
3
14
SW2
SCK
4
13
PT3B
NU
5
12
PT3A
VCNT
6
11
VDD
LED
7
10
DP
GND
8
9
DM
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TC9350BFN-T00,TC9350BFN-T01
Pin Explanation
Symbol
Description
VDD
5 V power supply. Guaranteed 4.35 to 5.25 V.
GND
Ground.
XIN
Connected to a 6-MHz ceramic resonator (ceramic resonator input pin).
XOUT
Connected to a 6-MHz ceramic resonator (ceramic resonator output pin).
LED
When the mouse is operating, the LED is always turned on by current drive with N-MOS turned on. The sink
current is 50 mA maximum. Current drive is turned off in suspend mode.
SW [1:3]
Connected to the buttons (left, middle, and right) of the mouse. Pulled up to VDD by built-in resistors.
To prevent chattering noise, the SW signals are not recognized until 15 ms after the first change in their state,
allowing the signals to be sufficiently stabilized before entering the internal circuit.
The pins are assigned to the mouse switches as follows:
SW1: Left switch
SW2: Middle switch
SW3: Right switch
SCK
Serial port clock (output) pin.
SDIO
Serial data input and output pin.
VCNT
VDD control pin (for controlling the power supply for the ADNS-2610 optical mouse sensor)
When the mouse is operating, the TC9350BFN supplies power to the optical mouse sensor via an external
transistor by current drive with N-MOS turned on. In suspend mode, N-MOS is turned off, stopping power
supply to the optical mouse sensor.
NU
No use pin. Please connect to GND.
PT3A/B
Encoder input pins. PT3A and PT3B are used as scroll pins. Data is sampled at intervals of 100 µs.
The TC9350BFN-T00 enables the built-in pull-up resistors of the encoder input pins (PT3A, PT3B) when the
mouse is operating. It is suitable for a mechanical encoder. (The pull-up resistors are disabled in suspend
mode.)
When using a mechanical encoder, it is recommended to use an external capacitor to reduce chattering and
bouncing. In stable state, PT3A = PT3B.
The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is
suitable for an optical encoder (phototransistor and LED).
DP, DM
It connects with the both-directions data bus line of USB.
Note:
Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may
damage the IC chip.
When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to
peripheral components.
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TC9350BFN-T00,TC9350BFN-T01
Symbol
I/O
Pin No.
Description
SW1
I
15
Switch input 1 (left).
SW2
I
14
Switch input 2 (middle).
Circuit
VDD
(Signal)
(SW [1-3])
SW3
I
2
Switch input 3 (right).
PT3A
I
12
Encoder input pins A.
GND
VDD
(PT3A/B)
PT3B
I
13
(Signal)
Encoder input pins B.
GND
VDD
SDIO
I/O
3
(Signal)
Serial data input and output.
(SDIO)
GND
VDD
SCK
O
4
Serial port clock (output).
(SCK)
GND
VDD
LED
O
7
LED driver output.
(LED)
GND
VDD
VCNT
O
6
VDD Control pin.
(Controling the power supply for the
Optical Mouse Sensor).
(VCNT)
GND
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TC9350BFN-T00,TC9350BFN-T01
Symbol
I/O
Pin No.
Description
Circuit
VDD
(Signal)
DM
I/O
9
(Signal)
USB DM pin.
(DM)
(Signal)
(DP)
GND
VDD
(Signal)
(Signal)
DP
I/O
10
USB DP pin.
(DP)
(Signal)
(DM)
GND
VDD
⎯
11
Power supply.
GND
⎯
8
Ground.
VDD
XOUT
O
1
Ceramic resonator out.
(XIN)
GND
VDD
XIN
I
16
Ceramic resonator in.
(XOUT)
GND
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TC9350BFN-T00,TC9350BFN-T01
Block Diagram
Resonator
6 MHz
LED (1 pin)
SDIO (1 pin)
SCK (1 pin)
(2 pin)
Internal
OSC
Clock
generator
LED port
14 bit timer
SDIO port
SCK port
USB data
I/O port
Switch input
port
Encoder
input port
VDD_CNTL
port
(4 pin)
D+, D−
Vbus/GND
(3 pin)
SW [1:3]
(2 pin)
PT3A/B
(1 pin)
VCNT
6 MHz
300 kHz
Control logic
Power on
reset
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TC9350BFN-T00,TC9350BFN-T01
Example of Circuit
TC9350BFN-T00
TR1
C
RLED1
REB2
RB1
REB1
C
Resonator (6 MHz)
GND
SLD
SW3
SDIO
SCK
NU
VCNT
LED
GND
1
16
2
15
3
14
13
4
12
5
11
6
7
10
8
9
C
XIN
SW1
SW2
3
PT3B
4
PT3A
Image
sensor
SDIO
SCK
Wheel encoder
LED_CNTL
ADNS
2610
VDD
8
DP
C
DM
OSC_IN
Sur face
5
RB2
1
REFA
OSC_OUT
TR2
D+
XOUT
2
24 MHz
D−
7.5 k
VBUS
LED1
7
VDD
USB cable
GND
6
C
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TC9350BFN-T00,TC9350BFN-T01
TC9350BFN-T01
TR1
C
RLED1
REB2
RB1
REB1
C
Resonator (6 MHz)
SLD
SCK
NU
VCNT
LED
GND
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
C
PhotoTr.
(wheel)
SW1
SW2
PT3B
3
4
Image
sensor
SDIO
SCK
LED_CNTL
PT3A
ADNS
2610
VDD
8
DP
C
DM
OSC_IN
Sur face
5
RB2
1
REFA
OSC_OUT
TR2
GND
SDIO
1
2
24 MHz
D+
SW3
XIN
LED2 RLED2
D−
7.5 k
VBUS
XOUT
LED1
7
VDD
USB cable
GND
6
C
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TC9350BFN-T00,TC9350BFN-T01
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Tstg
−40~ + 150
°C
TA
0~ + 70
°C
VDD
−0.5~ + 5.5
V
VIN
−0.5~
VDD + 0.25
V
DC output voltage at high impedance
VOUT
−0.5~
VDD + 0.25
V
LED output pin current
ILED
70
mA
VCNT output pin current
IVCNT
7
mA
SDIO output pin current
ISDIO
5
mA
SCK output pin current
ISCK
5
mA
PD
100
mW
VESD
MIL:
−2 k~ + 2 k
V
ILATCH
200
mA
Storage temperature range
Operating ambient temperature range
Power supply voltage
DC input voltage
Power consumption
Elector static destruction
Latch up current
Electrical Characteristics (Ta = 25°C)
(1) General
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
4.35
5.0
5.25
V
Power supply voltage 2
VDD
Power supply current
(normal operation)
IDD
IC only.
⎯
⎯
5
mA
Power supply current (suspend mode)
ISB
IC only.
⎯
⎯
250
µA
Min
Typ.
Max
Unit
(2) USB interface
Characteristics
Symbol
Test Condition
Output High voltage
VOH
2.8
⎯
3.6
V
Output Low voltage
VOL
⎯
⎯
0.3
V
Differential signal input common mode
range
VCM
0.8
⎯
2.5
V
A receiving part single end input
threshold voltage
VSE
0.8
⎯
2.0
V
Data rising time
TR
C = 350 pF (10% to 90%)
75
⎯
300
ns
Data falling time
TF
C = 350 pF (10% to 90%)
75
⎯
300
ns
Rising/Falling matching
TLRFM
80
⎯
125
%
Output cross voltage
VCRS
1.3
⎯
2.0
V
Applied to pins DM, DP
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TC9350BFN-T00,TC9350BFN-T01
(3) I/O
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
VOLLED
ILED = 50 mA
⎯
⎯
0.8
V
Output low voltage of VCNT
VOLVCNT
IVCNT = 5 mA
⎯
⎯
0.8
V
Output high voltage of SDIO
VOHSDIO
ISDIO = −1 mA
VDD
− 0.8
⎯
⎯
V
Output low voltage of SDIO
VOLSDIO
ISDIO = 1 mA
⎯
⎯
0.4
V
Output high voltage of SCK
VOHSCK
ISCK = −1 mA
VDD
− 0.8
⎯
⎯
V
Output low voltage of SCK
VOLSCK
ISCK = 1 mA
⎯
⎯
0.4
V
Output low voltage of LED
Input threshold voltage (SW)
VITH1
25%
⎯
75%
VDD
Input threshold voltage (PT)
VITH2
30%
⎯
70%
VDD
Input threshold voltage (SDIO)
VITH3
30%
⎯
70%
VDD
IIN
−1
⎯
1
µA
Leak current
Applied to pins LED, VCNT, SDIO, SCK, SW1-3, PT3A/B
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TC9350BFN-T00,TC9350BFN-T01
Scrolling and the scroll count
The following describes signal processing during scrolling:
<< Scroll signal processing >>
“+1 count” (If the transition of PT3A precedes that of PT3B)
(PT3A, PT3B) = (0,0) → (1,0) → (1,1) or (PT3A, PT3B) = (1,1) → (0,1) → (0,0)
“−1 count” (If the transition of PT3B precedes that of PT3A)
(PT3A, PT3B) = (0,0) → (0,1) → (1,1) or (PT3A, PT3B) = (1,1) → (1,0) → (0,0)
PT3A : PT3B
0:0
0:1
1:0
PT3A : PT3B
1:1
−1 count
+1 count
+1 count
11
−1 count
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Package Dimensions
Weight: 0.07 g (typ.)
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Marking (example)
TC9350BFN-T00
50B–T0
215
A1
Type name
Weekly code
Lot code
TC9350BFN-T01
50B–T1
215
A1
Type name
Weekly code
Lot code
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Appendix A. Recommended mounting of TC9350BFN
Infrared or hot air reflow
Preheat conditions: 140 to 160°C, 60 to 120 seconds
Reflow conditions: (a) 240°C max., (b) 210°C min., within 30 seconds
Soldering times: Maximum 2 times
Temperature profile:
(°C)
Package surface temperature
240
210
160
140
60 to 120 seconds
30
seconds
or less
Time (in seconds)
Solder flow (single-wave and double-wave)
Preheat conditions: 140 to 160°C, 60 to 120 seconds
Reflow conditions: 260°C max., within 10 seconds
(For double-wave, the total time for primary wave and secondary wave must not exceed 10 seconds.)
Reflow cannot be performed more than once.
The following figure shows the recommended temperature profile.
Temperatures described in mounting requirements are based on the solder bath temperature.
The temperature profile indicates the maximum withstand temperature. The application must not cause the
chip temperature to fall outside the profile range.
(°C)
Package surface temperature
260
160
140
60 to 120 seconds
10 seconds or less
Time (in seconds)
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Appendix B.
USB Descriptors
Device Descriptor
Offset
Field
Size
Value (Hex)
Description
0
bLength
1
12
Size of this descriptor in bytes.
1
bDescriptorType
1
01
Device descriptor type.
2
bcdUSB
2
0110
4
bDeviceClass
1
00
Not supported.
5
bDeviceSubClass
1
00
Not supported.
6
bDeviceProtocol
1
00
Protocol depends on selected interface.
USB HID Specification Release 1.1.
7
bMaxPacketSize0
1
08
8
idVendor
2
0930
Vendor ID
Maximum packet size on endpoint zero.
10
idProduct
2
6501
Product ID
12
bcdDevice
2
0000 (-T00)
0001 (-T01)
14
iManufacturer
1
01
Index of string descriptor describing manufacture.
15
iProduct
1
02
Index of string descriptor describing product.
16
iSerialNumber
1
00
Not supported.
17
bNumConfigurations
1
01
Number of possible configurations.
Size
Value (Hex)
Device release number.
Configuration Descriptor
Offset
Field
Description
0
bLength
1
09
Size of this descriptor in bytes.
1
bDescriptorType
1
02
Configuration descriptor type.
2
wTotalLength
2
0022
4
bNumInterfaces
1
01
Number of interfaces supported by this
configuration.
5
bConfigurationValue
1
01
Value to use as an argument to Set Configuration to select this
configuration.
6
iConfiguration
1
00
Not supported.
Total length of data returned for this configuration including
interface, HID, and endpoint.
7
bmAttributes
1
A0
Bus powered and able to perform remote wakeup.
8
MaxPower
1
32
Max power
String Descriptor
Index
Size (Character)
Value (Hex)
Description
0
2
0409
1
Max 8
TOSHIBA
ASCII Character
2
Max 32
USB Wheel Mouse
ASCII Character
Language ID
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Interface Descriptor
Offset
Field
Size
Value (Hex)
Description
0
bLength
1
09
Size of this descriptor in bytes.
1
bDescriptorType
1
04
Interface descriptor type.
2
bInterfaceNumber
1
00
Number of interface.
3
bAlternateSetting
1
00
Value used to select alternate setting.
4
bNumEndpoints
1
01
Number of endpoints.
5
bInterfaceClass
1
03
Class code (HID code assigned by USB).
6
bInterfaceSubClass
1
01
Boot interface subclass.
7
bInterfaceProtocol
1
02
Mouse.
8
iInterface
1
00
Not supported.
Size
Value (Hex)
HID Descriptor
Offset
Field
Description
0
bLength
1
09
Size of this descriptor in bytes.
1
bDescriptorType
1
21
HID descriptor type.
2
bcdHID
2
0110
4
bCountryCode
1
00
Country Code USA
5
bNumDescriptors
1
01
Number of report descriptors
6
bDescriptorType
1
22
Descriptor Type
7
wDescriptorLength
2
0034
Size
Value (Hex)
HID class specification release number.
HID report Descriptor Length
Endpoint Descriptor
Offset
Field
Description
0
bLength
1
07
Size of this descriptor in bytes.
1
bDescriptorType
1
05
Endpoint descriptor type.
2
bEndpointAddress
1
81
The address of the endpoint.
3
bmAttributes
1
03
4
wMaxPacketSize
2
0004
6
bInterval
1
0A
Interrupt endpoint.
Maximum packet size.
Interval for polling endpoint for data transfers.
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TC9350BFN-T00,TC9350BFN-T01
HID Report Descriptor
Offset
0
Field
Usage page
Size
Value (Hex)
Description
2
0501
Generic Desktop
Mouse
2
Usage
2
0902
4
Collection
2
A101
Application
6
Usage
2
0901
Pointer
8
Collection
2
A100
Linked
10
Usage page
2
0509
Buttons
12
Usage
2
1901
Button 1
minimum
14
Usage maximum
2
2903
Button 3
16
Logical minimum
2
1500
Button open
18
Logical maximum
2
2501
Button close
20
Report count
2
9503
3 reports
22
Report size
2
7501
Each button report is 1bit.
left = bit0, right = bit1, middle = bit2
24
Input
2
8102
Variable Data Bit Field with
Absolute position
26
Report count
2
9501
1 report
28
Report size
2
7505
5 report bits for padding
30
Input
2
8101
Constant
32
Usage page
2
0501
Generic Desktop
34
Usage
2
0930
X
36
Usage
2
0931
Y
38
Usage
2
0938
Scroll
40
Logical minimum
2
1581
−127
42
Logical maximum
2
257F
127
44
Report size
2
7508
The x and y reports are 8bit
46
Report count
2
9503
3 reports
48
Input
2
8106
Variable, Relative
50
End collection
1
C0
51
End collection
1
C0
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Note:
Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may
damage the IC chip.
When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to
peripheral components.
RESTRICTIONS ON PRODUCT USE
030619EAA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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