TOSHIBA TPS851_07

TPS851
TOSHIBA Photo-IC
Silicon Epitaxial Planar
TPS851
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS851 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
TOSHIBA
―
circuit in a single chip.
Weight: 0.0054 g (typ.)
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent output linearity.
With its ultra-compact surface-mount package, this photo-IC can be used as the power-saving control for
domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption
to be achieved.
•
Ultra-compact and light surface-mount package: 2.0 × 2.1 × 0.7 mm
•
Excellent output linearity of illuminance
•
Little fluctuation in light current and high level of sensitivity
: IL = 37 μA to 74 μA @EV = 100 lx using fluorescent light
: Light current variation width: ×1.67 (when light current classification is specified.)
: Little temperature fluctuation
•
Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.)
•
Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.7 V to 5.5 V
•
Lead(Pb)-Free
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
VCC
−0.5 to 7
V
Output voltage
VOUT
<
= VCC
V
Light current
IL
5
mA
Permissible power dissipation
P
35
mW
Operating temperature range
Topr
−30 to 85
°C
Storage temperature range
Tstg
−40 to 100
°C
Tsol
260
°C
Soldering temperature range
(Note 1)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
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TPS851
Electrical and Optical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Supply voltage
VCC
⎯
2.7
⎯
5.5
ς
Supply current
ICC
⎯
620
⎯
μA
⎯
62
⎯
μA
3.7
⎯
7.4
μA
37
⎯
74
μA
⎯
1.2
1.7
⎯
⎯
0.17
μA
2.2
2.35
⎯
V
nm
Light current (1)
IL (1)
Light current (2)
IL (2)
Light current (3)
IL (3)
Light current ratio
IL (1)
IL (3)
Dark current
ILEAK
VCC = 3 V, EV = 1000 lx
RL = 1 kΩ
(Note 2)
VCC = 3 V, EV = 100 lx
(Note 2), (Note 4)
VCC = 3 V, EV = 10 lx
(Note 3), (Note 4)
VCC = 3 V, EV = 100 lx
(Note 3), (Note 4)
⎯
VCC = 3.3 V, EV = 0
VCC = 3 V, RL = 150 kΩ, EV = 100 lx
Saturation output voltage
VO
Peak sensitivity wavelength
λp
⎯
⎯
600
⎯
Rise time
tr
VCC = 3 V, RL = 5 kΩ
⎯
0.07
1
Fall time
tf
⎯
0.4
2
Switching time
(Note 3)
(Note 5)
ms
Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
IL (3) classification IL A: 37 μA to 62 μA
Note 4: Light current measurement circuit
Light
source
VCC
IL
TPS851
OUT
A
Note 5: Rise time/fall time time measurement method
Pulse drive
IF
VCC
White LED
TPS851
1.5 V
OUT
90%
RL
VOUT
GND
2
10%
tr
tf
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TPS851
Package Dimensions
Unit: mm
Tolerance: ±0.1
( ): Reference value
: Light-receiving area
Size of light-receiving area:
(□0.35 mm)
Center of
sensitive area
Pin connection
1. VCC
2. GND
3. NC
4. NC
5. OUT
Weight: 0.0054 g (typ.)
Block Diagram
1. VCC
Current
amp
5. OUT
2. GND
3. NC
4. NC
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TPS851
Handling Precautions
At power-on in darkness, the internal circuit takes about 100 μs to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1)
(2)
(3)
To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)
Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer
Mounting Precautions
(1)
(2)
(3)
Do not apply stress to the resin at high temperature.
The resin part is easily scratched, so avoid friction with hard materials.
When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
Reflow soldering
• Package surface temperature: 260°C (max)
•
Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
Temperature (°C) →
(1)
260°C max
230°C
190°C
180°C
Preheating part
60 s to 120 s
30 s to 50 s Heating part
Time (s) →
•
Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
•
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 60% RH or lower
•
Do not perform flow soldering.
•
Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
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TPS851
(2)
Recommended soldering pattern
0.65
Unit: mm
0.8
1.9
0.65
0.4
(3)
Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Packing Specification
(1)
(2)
Packing quantity
Reel (minimum packing quantity)
3,000 devices
Carton
5 reels (15,000 devices)
Packing format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
•
Carton specification
Label
Carton dimensions
(W) 81 mm × (L) 280 mm × (H) 280 mm
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TPS851
Tape Packing Specifications
Reel dimensions
Reel material: Plastic
Unit: mm
11.4
9.0
φ180
5.0
φ60
(1)
Enlarged view of reel center
5.0
φ21 ± 0.8
2 ± 0.5
120°
φ13 ± 0.2
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TPS851
(2)
φ1.5
Tape dimensions
Tape material: Plastic (anti-electrostatic)
4.0 ± 0.1
+ 0.1
−0
0.18
2.0 ± 0.1
Unit: mm
Tolerance: ±0.2
B
4.0
2.3 ± 0.05
A’
8.0
A
3.5 ± 0.1
1.75
(feed hole)
B’
φ1.1
(pocket hole)
0.85 ± 0.05
Cross-section between B and B’
2.2 ± 0.05
Cross-section between A and A’
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TPS851
Reel Label
The label markings may include product number, tape type and quantity.
Sensor hole
P/N
TYPE
ADDC
TPS851
Q’TY
3,000 pcs.
NOTE
Position of label
Leader and Trailer Sections of Tape
Empty trailer section:
at least 10 empty device slots
Empty leader section:
at least 100 mm of carrier tape
Cover tape: 300 mm (min)
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TPS851
P – Ta
ILEAK – Ta
(typ.)
1
40
VCC = 3 V
30
(μA)
25
Dark current ILEAK
Power dissipation P (mW)
35
20
15
10
0.1
0.01
0.001
5
0
0
20
40
60
80
0.0001
20
100
40
80
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
IL – EV
60
(typ.)
Relative IL – Ta
10000
(typ.)
1.40
VCC = 3 V
EV = 100 lx
using fluorescent light
1.20
Relative light current
Light current IL (μA)
1000
100
1.00
0.80
10
0.60
−40
1
10
100
1000
0
20
40
60
80
100
Ambient temperature Ta (°C)
Ta = 25°C
VCC = 3 V
A light source
Fluorescent light
0.1
1
−20
VO – EV
10000
(typ.)
10
Luminance EV (lx)
Relative IL – VCC
1
(typ.)
Output voltage VO
(V)
1.6
Relative light current
1.2
0.8
0.1
0.01
Ta = 25°C
VCC = 3 V
Fluorescent light
Fluorescent light
A light source
A light source
0.001
0.4
Ta = 25°C
0
2
3
4
Supply voltage
5
VCC
6
0.0001
1
7
(V)
10
100
RL = 1 kΩ
RL = 7.5 kΩ
RL = 1 kΩ
RL = 7.5 kΩ
1000
10000
Luminance EV (lx)
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TPS851
ICC – EV
(typ.)
Relative ICC – Ta
1.40
Relative consumption current
10000
Consumption current ICC
(μA)
1000
100
10
0.1
1
10
100
1000
VCC = 3 V
EV = 100 lx
using fluorescent light
RL = 1 kΩ
1.00
0.80
0.60
−40
Ta = 25°C
VCC = 3 V
Using the A light source
RL = 250 Ω
RL = 1000 Ω
RL = 5000 Ω
1
1.20
(typ.)
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
10000
Luminance EV (lx)
Switching Characteristics
(non-saturating operation)
Switching Characteristics
(saturating operation)
(typ.)
Ta = 25°C
VCC = 3 V
VOUT >
=2V
Using white LED
Ta = 25°C
VCC = 3 V
VOUT = 1.5 V
Using white LED
300
300
100
100
30
30
tf
Switching time (μs)
Switching time (μs)
(typ.)
1000
1000
td
10
tr
tf
10
ts
3
3
td
tr
ts
1
0.1
0.3
1
Load resistance RL
3
1
10
(kΩ)
0.3
0.1
0.1
0.3
1
Load resistance RL
10
3
10
(kΩ)
2007-10-01
TPS851
Switching Time Measurement Circuit and Waveforms
Pulse drive
IF
VCC
td
White LED
TPS851
ts
1.5 V
OUT
90%
RL
VOUT
GND
Spectral Response
10%
tr
tf
Radiation Pattern
(typ.)
100
Ta = 25°C
Luminosity
angle
30°
80
20°
10°
0°
10°
(typ.)
Ta = 25°C
20°
30°
Relative sensitivity
40°
40°
50°
60
50°
60°
60°
70°
40
80°
90°
20
0
200
70°
400
600
800
1000
80°
0
0.2
0.4
0.6
0.8
90°
1.0
1200
Wavelength λ (nm)
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TPS851
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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