ROHM BH76071FJ

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Structure
Silicon Monolithic Integrated Circuit
Product name
4ch HD Video Drivers for DVD
BH76071FJ
Type
Outer dimensions
Fig.1
Block diagram
Fig.2
SOP-J14(Plastic Mold)
Function
●
●
●
●
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Built in 4-outputs video drivers for CVBS, PY, PB and PR
Enables two load drivers
Composite※1:Built in 6.75MHz LPF
Component※1:13.5MHz/30MHz LPF selectable
Built in MUTE function
※1 Composite is a name for CVBS, Component is a names for PY, PB and PR.
Absolute Maximum Ratings(Ta = 25℃)
※2
Parameter
Symbol
Ratings
Unit
Supply voltage
V
7.0
V
Power dissipation
Pd
Input voltage
VIN
-0.3~(VCC+0.3)
V
Storage temperature
Tstg
-55 ~ +125
℃
※2
820
mW
Reduced by 8.2mW/℃ at Ta = 25℃ or higher.
When mounting on a (l) 70mm x (w) 70mm x (t) 1.6mm PCB board.(Glass epoxy substrate, 1layer)
Operation Range
Parameter
Symbol
Range
Unit
Supply voltage
VCC
4.5 ~ 5.5
V
Operating temperature
Topr
-40 ~ +85
※ This product is not designed for protection against radioactive rays.
REV. A
℃
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■
(Unless otherwise noted, Ta=25℃, VCC=5.0V, RL=150Ω)
Electrical characteristics
Limits
Item
Symbol
Unit
Conditions
MIN.
TYP.
MAX.
ICC
32
45
58
mA
No signal, 30MHz LPF
Voltage gain(CVBS)
GV1
5.5
6.0
6.5
dB
Vin=1.0Vp-p, f=100kHz
Voltage gain(PY, PB,PR)
GV2
5.5
6.0
6.5
dB
Vin=0.7Vp-p, f=100kHz
Maximum output level
VOMV
2.6
2.9
-
Vp-p
THD=1.0% f=10kHz
Gf1675
-1.5
-0.5
0.5
dB
Vin=1.0Vp-p, f=6.75MHz/100kHz
Gf1135
-1.5
-0.5
0.5
dB
Vin=0.7Vp-p, f=13.5MHz/100kHz
Gf1300
-3.0
-1.0
1.0
dB
Gf2675
-
-48
-30
dB
Gf2135
-
-48
-30
dB
Gf2300
-
-35
-20
dB
Vin=0.7Vp-p, f=74.25MHz/100kHz
MT
-
-65
-55
dB
Vin=1.0Vp-p, f=4.43MHz
Cross talk
CT
-
-65
-55
dB
Vin=1.0Vp-p, f=4.43MHz
PB/PR_IN Input impedance
ZI4
100
150
200
kΩ
Input voltage H
VthH
2.0
-
VCC
V
High level input voltage
Input voltage L
VthL
0.0
-
0.8
V
Low level input voltage
Input impedance
Rin
100
150
200
kΩ
Between Control pin and GND
<Whole circuit>
VCC current
<VIDEO part>
6.75MHz LPF
Frequency characteristics 1
13.5MHz LPF
Frequency characteristics 1
30MHz LPF
Frequency characteristics 1
6.75MHz LPF
Frequency characteristics 2
13.5MHz LPF
Frequency characteristics 2
30MHz LPF
Frequency characteristics 2
MUTE attenuation
Vin=0.7Vp-p,
f=30MHz/100kHz
Vin=1.0Vp-p,
f=27MHz/100kHz
Vin=0.7Vp-p,
f=54MHz/100kHz
<Control pin (6,7,8PIN)>
■ Control Specifications
Pin
6pin (MUTE1)
7pin (MUTE2)
8pin (LPF_SEL)
Function
Composite output(CVBS_OUT) MUTE control ※3
L: MUTE
H: ACTIVE
Component outputs(PY/PB/PR_OUT) MUTE control ※3
L: MUTE
H: ACTIVE
LPF selector for Component
L: 13.5MHz LPF
H: 30MHz LPF
※3 At MUTE mode, each output terminals usually outputs the bias voltage at no signal.
REV. A
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■ Outer Dimentions
BH76071FJ
Lot No.
Fig.1. SOP-J14
■ Block Diagram
CVBS_IN
■ Pin Number / Pin Name
CLAMP
CVBS_OUT
6.75MHz
LPF
1
6dB
MUTE1
VREF
2
PY _IN
CLAMP
13.5MHz
LPF
30MHz
LPF
SD
5
MUTE1
6
MUTE2
Pin Name
No.
Pin Name
1
CVBS_IN
8
LPF_SEL
2
VREF
9
PR_OUT
12
3
PY_IN
10
PB_OUT
GND
4
PB_IN
11
GND
5
PR_IN
12
PY_OUT
6
MUTE1
13
VCC
7
MUTE2
14
CVBS_OUT
VCC
PY _OUT
6dB
HD
75Ω
MUTE2
BIAS
11
4
PR _IN
No.
14
13
REF
3
PB _IN
75Ω
BIAS
13.5MHz
LPF
30MHz
LPF
13.5MHz
LPF
30MHz
LPF
SD
PB _OUT
6dB
HD
SD
75Ω
MUTE2
6dB
HD
75Ω
MUTE2
10
PR _OUT
9
LPF_SEL
8
7
※ : Please use the impedance of the circuit connected
to the input terminals(1 and 3pin) at 1kΩ or less.
Fig.2.
Block diagram
REV. A
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■
Cautions for use
(1) Although we are confident recommending the sample application circuit, carefully check their characteristics
further when using them.
When modifying externally attached component constants before use, determine them so that
They have sufficient margins by taking into account variations in externally attached components and the Rohm IC,
not only for static characteristics but also including transient characteristics.
(2) Absolute maximum ratings
If the absolute maximum ratings for applied voltage and/or operation temperature are exceeded, LSI damage may
result. Therefore, do not apply voltage or use in a temperature that exceeds these absolute maximum ratings.
If it is possible that absolute maximum ratings will be exceeded, use a physical safety device such as a fuse and
make sure that no conditions that might exceed the absolute maximum ratings will be applied to the LSI IC.
(3) GND potential
Regardless of the operation mode, the voltage of the GND pin should be at least the minimum voltage.
Actually check whether or not the voltage at each pin, including transient phenomena, is less than the
GND pin voltage.
(4) Thermal design
The thermal design should be done using an ample margin that takes into consideration the allowable dissipation
under actual use conditions. Perform thermal design in which there are adequate margins by taking into account
the allowable power dissipation in actual states of use.
(5) Shorts between pins and mounting errors
When mounting LSI ICs onto the circuit board, make sure each LSI’s orientation and position is correct.
The ICs may become damaged if they are not mounted correctly when the power is turned on.
Similarly, damage may also result if a short occurs, such as when a foreign object is positioned between
pins in an IC, or between a pin and power supply or GND connection.
(6) Operation in strong electromagnetic field
When used within a strong electromagnetic field, evaluate carefully to avoid the risk of operation faults.
(7) Place the decoupling capacitor close to 13pin.
REV. A
Notice
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
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