1/4 Structure Silicon Monolithic Integrated Circuit Product name Low voltage operation wide band 3-outputs video driver with LPF Type BH7606GU Function ・ ・ ・ ・ ・ ・ Built in 3-output video drivers for Y, PB and PR signal Built in 6dB AMP Built in standby function (0µA TYP) Built in LPF (Y : fc=27MHz, PB/PR : fc=15MHz) No output coupling capacitor required Small package 15-Bump WL-CSP(2.26x2.26x1.0[mm]) ※ Radiation resistance is not included in the design. ■Absolute Maximum Ratings （Ta=25℃） Parameter Symbol Limits Unit Condition CP_VCC Supply voltage Vcp 3.55 Ｖ CP_VCC - (CP_GND or V_GND) V_VCC Supply voltage Vv 3.55 V V_VCC - ( CP_GND or V_GND) V_VCC to CP_VCC voltage Vcc -0.3～+0.3 V V_VCC - CP_VCC V_GND to CP_GND voltage Vgg 0 V V_GND - CP_GND Input voltage 1 Vin1 -0.3~(V_VCC+0.3) V STBY Input voltage 2 Vin2 (VEE_IN)-0.3 ~(V_VCC+0.3) V Y_IN, PB_IN, PR_IN Power dissipation Pd 920 ｍW ＊ Storage temperature Tstg -55～+125 ℃ ＊ In case mounting on a (110mm × 100mm × 1.6mm) grass-epoxy PCB. ＊ Reduced by 9.2 mW/C at 25C or higher. ■Operating range （Ta=25℃） Parameter CP_VCC Supply voltage V_VCC Supply voltage Operating temperature Symbol Vcpo Vvo Topr REV. A Rating. 2.85 ~ 3.45 2.85 ~ 3.45 -40 ~ +85 Unit Ｖ Ｖ ℃ 2/4 ■Electrical characteristics 【Unless otherwise noted, Ta=25℃，CP_VCC=V_VCC=3V】 Parameter Limits Symbol Min. Typ. Max. Unit conditions ACTIVE Icc1 50 70 90 mA No signal STANDBY Icc2 － 0 2 μA Standby mode Y/PB/PR_OUT Voltage gain GV 5.5 6.0 6.5 dB Vin=1.0Vpp , f=100kHz Y/PB/PR_OUT Maximum output level Vomv 3.2 4.0 － Vp-p THD=1%, f=10kHz Y_OUT Frequency characteristics 1 Gf1Y -4.5 -1.5 1.0 dB Vin=1.0Vpp , f=27M/100kHz PB_OUT Frequency characteristics 1 Gf1PB -3.0 -1.0 1.0 dB Vin=1.0Vpp , f=15M/100kHz PR_OUT Frequency characteristics 1 Gf1PR -3.0 -1.0 1.0 dB Vin=1.0Vpp , f=15M/100kHz Y_OUT Frequency characteristics 2 Gf2Y － -26 -15 dB Vin=1.0Vpp , f=54M/100kHz PB_OUT Frequency characteristics 2 Gf2PB － -35 -28 dB Vin=1.0Vpp , f=54M/100kHz PR_OUT Frequency characteristics 2 Gf2PR － -35 -28 dB Vin=1.0Vpp , f=54M/100kHz Cross talk CT － -70 -50 dB Vin=1.0Vpp , f=4.43MHz Y/PB/PR_IN Input impedance RinV 100 150 200 kΩ Y/PB/PR_IN－V_GND Y/PB/PR_OUT Output DC offset Voff -100 0 100 mV Terminated 75Ω STBY Input voltage H VthH V_VCC -1.2 － V_VCC V ACTIVE mode STBY Input voltage L VthL 0.0 － 0.45 V STANDBY mode STBY Input impedance RinST 100 150 200 kΩ STBY－V_GND Circuit current ■Control pin settings Parameter STANDBY (B3) Status Operational mode H ACTIVE L STANDBY OPEN REV. A 3/4 ■Physical dimensions ・ Block diagram B3 Y B T S Stby H606 V_VCC D3 LOT No. Y_IN 27MHz LPF 6dB D4 PB_IN 15MHz LPF 6dB C4 PR_IN 15MHz LPF 6dB A3 NVCC CP_GND Charge Pump CP_VCC C_PLUS B4 A4 Fig.１. Physical dimensions（VCSP85H2） A2 Fig.2. Block diagram ■Pin assignment Pin name Symbol Pin name A1 VEE_OUT A2 C_MINUS C2 V_VCC A3 CP_GND C3 V_GND A4 C_PLUS C4 PR_IN B1 VEE_IN D1 PB_OUT - C1 PR_OUT - D2 Y_OUT B3 STBY D3 Y_IN B4 CP_VCC D4 PB_IN Table. 1. Pin assignment REV. A PR_OUT VEE_IN VEE_OUT （UNIT: mm） Symbol PB_OUT D2 D1 C1 V_GND C_MINUS C3 Y_OUT C2 B1 A1 4/4 ■Cautions on use (1) Absolute maximum ratings If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you think of a case in which absolute maximum ratings are exceeded, enforce fuses or other physical safety measures and investigate how not to apply the conditions under which absolute maximum ratings are exceeded to LSI. (2) VEE line Connect VEE_IN(B1) and VEE_OUT(A1) as shortly as possible on a board. (3) GND line Connect CP_GND(A3) and V_GND(C3) to board’s GND layer with thick line as shortly as possible. When every GND line’s common impedance becomes large, the noise characteristic sometimes deteriorates. (4) VCC line Short CP_VCC(B4) and V_VCC(C2) on the board, and supply voltage from the identical power. At the same time, place decoupling capacitor near the VCC pins. (5) Cross talk Board layout affects the cross talk. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (6) The noise characteristic of video signal Board layout affects the noise characteristic of video signal. Draw low impedance line such as the GND line in-between so the line will minimize interference among the video signals. (7) Thermal design Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in actual states of use. (8) Shorts between pins and miss-installation When mounting the LSI on a board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is miss-installed and the power is turned on, the LSI may be damaged. It also may be damaged if it is shorted by a foreign substance coming between pins of the LSI or between a pin and a power supply or a pin and GND. (9) Operation in strong magnetic fields Adequately evaluate use in a strong magnetic field, since there is a possibility of malfunction. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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