1/4 STRUCTURE Silicon Monolithic Integrated Circuit PRODUCT CMOS-type Series Regulator ＢＵＸＸＴＤ３ＷＧ Series NAME ○ BLOCK DIAGRAM and APPLICATION CIRCUIT ○ PIN DESCRIPTION PIN No. VIN VIN 1 1 VREF Cin 5 GND 2 VOUT VOUT OCP Co TSD VSTBY 4 STBY 3 PIN NAME STBY CON Discharge VIN DESCRIPTION INPUT Pin 2 GND GROUND Pin 3 STBY OUTPUT CONTROL Pin (High: ON, Low: OFF) 4 N.C. 5 VOUT NO CONNECT OUTPUT Pin N.C. Cin･･･0.47μF (Ceramic) Co ･･･0.47μF (Ceramic) Fig.1 BLOCK DIAGRAM and APPLICATION CIRCUIT ○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃) PARAMETER Symbol Limit Unit Power Supply Voltage VMAX -0.3 ～ +6.5 V Power Dissipation Pd 540 (*1) mW Maximum Junction Temperature TjMAX +125 ℃ Operating Temperature Range Topr -40 ～ +85 ℃ Storage Temperature Range Tstg -55 ～ +125 ℃ (*1) Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6mm glass-epoxy PCB. ○ RECOMMENDED OPERATING RANGE (Not to exceed Pd) PARAMETER Symbol Limit Unit Power Supply Voltage VIN 1.7～5.5 V Maximum Output Current IMAX 200 mA REV. B 2/4 ○ OPERATING CONDITIONS PARAMETER Symbol MIN. TYP. MAX. Unit CONDITION Input Capacitor Cin 0.22 (*2) 0.47 - μF Ceramic capacitor recommended Output Capacitor Co 0.22 (*2) 0.47 - μF Ceramic capacitor recommended (*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time progresses characteristic. ○ ELECTRICAL CHARACTERISTICS (Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.) PARAMETER Limit Symbol MIN. TYP. MAX. Unit Conditions Overall Device VOUT×0.99 Output Voltage VOUT VOUT-25mV Operating Current Operating Current (STBY) VOUT×1.01 V VOUT+25mV IOUT=10μA, VOUT≧2.5V IOUT=10μA, VOUT＜2.5V IIN - 35 60 μA IOUT=0mA ISTBY - - 1.0 μA STBY=0V RR 45 70 - dB VRR=-20dBv, fRR=1kHz, IOUT=10mA - 280 540 mV 2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA) - 260 500 mV 2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA) - 240 460 mV 2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA) - 220 420 mV 3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA) Ripple Rejection Ratio Dropout Voltage VOUT VSAT Line Regulation VDL - 2 20 mV VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA Load Regulation VDLO - 10 80 mV IOUT=0.01mA to 100mA Over Current Protection (OCP) Limit Current ILMAX 220 400 700 mA Vo=VOUT*0.95 Short Current ISHORT 20 70 150 mA Vo=0V Discharge Resistor RDSC 20 50 80 Ω VIN=4.0V, STBY=0V, VOUT=4.0V STBY Pin Pull-down Current ISTB 0.1 0.6 2.0 μA ON VSTBH 1.2 - 5.5 V OFF VSTBL -0.3 - 0.3 V Standby Block STBY Control Voltage STBY=1.5V ●This product is not designed for protection against radioactive rays. (*3) VIN=2.5V for VOUT≦1.5V (*4) VIN=2.5V to 5.5V for VOUT≦1.5V ○ ELECTRICAL CHARACTERISTICS of each Output Voltage (Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.) Output Voltage PARAMETER 1.0V, 1.2V 1.5V 1.8V, 1.85V, 1.9V, 2.0V, 2.1V Maximum output current MIN. 80 200 60 200 200 REV. B TYP. 160 120 - MAX. - Unit Conditions mA VIN=1.7V VIN=2.1V VIN=1.8V VIN=2.2V VIN=VOUT+0.6V 3/4 ○ POWER DISSIPATION CURVES ○ DEVICE NAME and MARKING Pd (W) Device Name: a 0.8 Conditions : 0.6 Mounted on glass epoxy PCB. Size : 70mm×70mm×1.6mm 0.54 W Description 0.4 0.2 0 BUXXTD3WG 25 50 75 85 100 Ta (℃) 125 a Fig.2 Pd reduction (example) ○ PACKAGE DIMENSIONS (SSOP5) Marking Fig.3 Lot No. Package dimensions (Unit : mm) REV. B Marking XX Output Voltage 10 1.0V typ. F0 12 1.2V typ. F1 15 1.5V typ. F2 18 1.8V typ. F3 1J 1.85V typ. F4 19 1.9V typ. F5 20 2.0V typ. F6 21 2.1V typ. F7 25 2.5V typ. F8 26 2.6V typ. F9 27 2.7V typ. G0 28 2.8V typ. G1 2J 2.85V typ. G2 29 2.9V typ. G3 30 3.0V typ. G4 31 3.1V typ. G5 32 3.2V typ. G6 33 3.3V typ. G7 34 3.4V typ. G8 4/4 ○ OPERATION NOTES 1.) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2.) GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3.) Thermal design Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions. 4.) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result in damage to the IC. 5.) Operation in strong electromagnetic fields Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 6.) Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 7.) Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a voltage between 0.3 V and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8.) Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9.) Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 10.) Input/output capacitor Cout=0.47μF, Cin=0.47μF, Temp=+25℃ Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible (refer to figure 4). The 100 input capacitor helps to counteract increases in power supply impedance, and increases Unstable region stability in applications with long or winding power supply traces. The output capacitance 10 should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing ESR [Ω] ESR [Ω] value is directly related to the overall stability and transient response of the regulator, and 1 Stable region 0.1 appropriate capacitors for your application.. (Please refer the technical note, regarding ceramic capacitor of recommendation.) 0.01 0 50 100 IOUT [mA] IOUT [mA] Fig.4 Stable region (example) REV. B 150 200 Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). 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