1/4 Structure Silicon Monolithic Products USB High side switch IC Type Features BD2221G Single channel of low ON resistance (Typ = 160mΩ) Nch power MOSFET built in 500mA Continuous current load Over current detection （Output off-latch operation） Under voltage lockout (UVLO) Thermal shutdown (TSD) Soft start function Open drain error flag output Active “Low” control logic Reverse-current protection when power switch off SSOP5 Package ◇Absolute maximum ratings (Ta=25°C) Parameter Symbol Rating Unit Supply voltage VIN -0.3 ~ 6.0 V Enable voltage V/EN -0.3 ~ 6.0 V /OC voltage V/OC -0.3 ~ 6.0 V /OC current I/OC ~5 mA OUT voltage VOUT -0.3 ~ 6.0 V Storage temperature TSTG -55 ~ 150 °C Power dissipation PD 675 *1 mW *1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW / °C for operating above Ta=25°C. * This product is not designed for protection against radioactive rays. ◇Operating conditions Parameter Symbol MIN TYP MAX Unit VIN 2.7 5.0 5.5 V Operating temperature TOPR -40 - 85 °C Continuous output current IOUT 0 - 500 mA Operating voltage REV. A 2/4 ◇Electric characteristics (unless otherwise specified VIN = 5.0V, Ta = 25°C, CIN=1μF, COUT=1μF) Spec Parameter Symbol Condition Unit Min. Typ. Max. DC characteristics Operating Current IDD - 110 160 μA V/EN = 0V, VOUT = Open Standby Current ISTB - 0.01 5 μA V/EN = 5V, VOUT = Open 2.0 - - V High input /EN input voltage V/EN - - 0.8 V Low input /EN input current I/EN -1.0 0.01 1.0 μA V/EN =0V or 5V ON resistance RON - 160 210 mΩ IOUT = 50mA Switch leak current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V Reverse leak current IREV - - 1.0 μA VOUT = 5.5V, VIN = 0V Over current threshold ITH 0.5 - 1.0 A Output LOW voltage ISC 0.35 - - A VOUT = 0V , COUT=47μF (RMS) V/OC - - 0.4 V I/OC = 0.5mA UVLO VTUVH 2.1 2.3 2.5 V Increasing VIN Threshold VTUVL 2.0 2.2 2.4 V Decreasing VIN Output rise time TON1 - 1 6 ms RL = 20Ω Output rise delay time TON2 - 1.5 10 ms RL = 20Ω Output fall time TOFF1 - 1 20 μs RL = 20Ω Output fall delay time TOFF2 - 3 40 μs RL = 20Ω Blanking time TBLANK 10 15 20 ms /OC output Low voltage AC characteristics ◇Over current protection, shutdown timing ◇Timing chart at output rise / fall time TBLANK TBLANK TOFF1 TON1 Output VOUT 90% Current Switch ON OFF 10% 10% ON 90% status TOFF2 /OC TON2 output V/EN V/EN 50% REV. A 50% 3/4 ◇Block diagram GND Delay Counter OCD S Q /OC R Charge pump UVLO TSD /EN VIN VOUT ◇Pin description Pin No. Pin Name Function 1 VIN Power supply input. Input terminal to switch and power supply input terminal of the internal circuit. 2 GND Ground. 3 /EN 4 /OC 5 VOUT Enable input. Power switch on at Low level. Over current output. Low level at over current detection. Open drain output. Switch output. DY ◇Package Lot No. SSOP5 (Unit : mm) REV. A 4/4 ●Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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