DIODES S3J

S3A/B - S3M/B
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
A
Mechanical Data
SMB
B
Case: Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
Marking: Type Number & Date Code,
See Page 2
Ordering Information: See Page 2
C
D
J
Min
Max
Min
Max
A
3.30
3.94
5.59
6.22
B
4.06
4.57
6.60
7.11
C
1.96
2.21
2.75
3.18
D
0.15
0.31
0.15
0.31
E
5.00
5.59
7.75
8.13
G
0.10
0.20
0.10
0.20
H
0.76
1.52
0.76
1.52
J
2.00
2.62
2.00
2.62
G
E
H
SMC
Dim
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
Maximum Ratings and Electrical Characteristics
@ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@TT = 75°C
Symbo
S3
A/AB
S3
B/BB
S3
D/DB
S3
G/GB
S3
J/JB
S3
K/KB
S3
M/MB
Unit
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
VR(RMS)
30
70
140
280
420
560
700
V
IO
3.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
100
A
Forward Voltage
VFM
1.15
V
IRM
10
250
µA
CT
40
pF
RJT
10
°C/W
Tj, TSTG
-65 to +150
°C
Peak Reverse Current
at Rated DC Blocking Voltage
@ IF = 3.0A
@TA = 25°C
@ TA = 125 °C
Typical Total Capacitance (Note 1)
Typical Thermal Resistance Junction to Terminal
(Note 2)
Operating and Storage Temperature Range
Notes:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
DS16005 Rev. 8 - 2
1 of 2
S3A/B-S3M/B
Ordering Information
(Note 3)
Device*
Packaging
Shipping
S3xB-13
S3x-13
SMB
SMC
3000/Tape & Reel
Notes:
3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
*x = Device type, e.g. S3AB-13 (SMB package); S3A-13 (SMC Package).
Marking Information
XXXX
IAV, AVERAGE FORWARD CURRENT (A)
3.0
XXXX = Product type marking code, ex. ES1A
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year ex: 2 for 2002
WW = Week code 01 to 52
Resistive or
Inductive Load
2.5
2.0
1.5
1.0
0.5
0
25
50
75
100
125
150
IF, INSTANTANEOUS FORWARD CURRENT (A)
YWW
10
1.0
0.1
IF PULSE WIDTH = 300 µS
0.01
0
TT, TERMINAL TEMPERATURE (ºC)
Fig. 1 Forward Current Derating Curve
IR, INSTANTANEOUS REVERSE CURRENT (µA)
IFSM, PEAK FORWARD SURGE CURRENT (A)
Single Half-Sine-Wave
JEDEC Method
100
80
60
40
20
0
10
1.2
1.6
2.0
1000
100
Tj = 125°C
10
1.0
Tj = 25°C
0.1
0.01
0
20
40
60
80
100
120
140
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Forward Surge Current Derating Curve
DS16005 Rev. 8 - 2
0.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
120
1
0.4
2 of 2
S3A/B-S3M/B