S1A/B - S1M/B 1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features · · · · Glass Passivated Die Construction Low Forward Voltage Drop and High Current Capability Surge Overload Rating to 30A Peak Ideally Suited for Automated Assembly A Mechanical Data · · · · · · · · · SMA B Case: Molded Plastic Case Material - UL Flammability Rating Classification 94V-0 Moisture sensitivity: Level 1 per J-STD-020A Terminals: Solder Plated Terminal Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch SMA Weight: 0.064 grams (approx.) SMB Weight: 0.093 grams (approx.) Marking: Type Number, See Page 2 Ordering Information: See Page 2 Dim Min Max Min Max A 2.29 2.92 3.30 3.94 B 4.00 4.60 4.06 4.57 C 1.27 1.63 1.96 2.21 D 0.15 0.31 0.15 0.31 E 4.80 5.59 5.00 5.59 G 0.10 0.20 0.10 0.20 H 0.76 1.52 0.76 1.52 J 2.01 2.62 2.00 2.62 C D J H SMB G E All Dimensions in mm A, B, D, G, J, K, M Suffix Designates SMA Package AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package Maximum Ratings and Electrical Characteristics TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Symbol S1 A/AB S1 B/BB S1 D/DB S1 G/GB S1 J/JB S1 K/KB S1 M/MB Unit VRRM VRWM VR 50 100 200 400 600 800 1000 V VR(RMS) 35 70 140 280 420 560 700 V IO 1.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30 A Forward Voltage @ IF = 1.0A VFM 1.1 V @ TA = 25°C @ TA = 125°C IRM 5.0 100 mA Average Rectified Output Current Peak Reverse Leakage Current at Rated DC Blocking Voltage Typical Total Capacitance @ TT = 100°C (Note 1) Typical Thermal Resistance, Junction to Terminal (Note 2) Operating and Storage Temperature Range Notes: CT 10 pF RqJT 30 °C/W Tj, TSTG -65 to +150 °C 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink. DS16003 Rev. 8 - 2 1 of 2 S1A/B - S1M/B Ordering Information (Note 3) Device* Packaging Shipping S1x-7 S1xB-7 SMA SMB 5000/Tape & Reel 3000/Tape & Reel Notes: 3. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. * x = Device type, e.g. S1A-7 (SMA package); S1AB-7 (SMB package). Marking Information YWW XXX(X) XXX = Product type marking code, ex: S1A (SMA package) XXXX = Product type marking code, ex: S1AB (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52 IF, INSTANTANEOUS FORWARD CURRENT (A) IO, AVERAGE OUTPUT CURRENT (A) 1.0 0.8 0.6 0.4 0.2 Resistive or inductive load 0 40 60 80 100 120 140 160 10 1.0 0.1 Tj = 25°C PULSE WIDTH = 300ms 2% DUTY CYCLE 0.01 0 180 0.8 1.2 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics TT, TERMINAL TEMPERATURE (°C) Fig. 1 Forward Current Derating Curve 30 IFSM, PEAK FORWARD SURGE CURRENT (A) 0.4 1000 8.3ms Single half sine-wave JEDEC Method 25 100 Tj = 125°C 20 10 15 1.0 Tj = 25°C 10 0.1 5 0.01 1 10 100 NUMBER OF CYCLES @ 60Hz Fig. 3 Typical Forward Characteristics DS16003 Rev. 8 - 2 0 40 80 120 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 4 Typical Reverse Characteristics 2 of 2 S1A/B - S1M/B