DIODES 2N7002E

SPICE MODEL: 2N7002E
2N7002E
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT
TRANSISTOR
NEW PRODUCT
Features
·
·
·
·
·
·
Low On-Resistance: RDS(ON)
SOT-23
Low Gate Threshold Voltage
Dim
Min
Max
A
0.37
0.51
B
1.20
1.40
C
2.30
2.50
D
0.89
1.03
E
0.45
0.60
G
1.78
2.05
H
2.80
3.00
J
0.013
0.10
Terminals: Solderable per MIL-STD-202, Method 208
K
0.903
1.10
Lead Free Plating (Matte Tin Finish annealed
L
0.45
0.61
over Alloy 42 leadframe).
M
0.085
0.180
Terminal Connections: See Diagram
a
0°
8°
Low Input Capacitance
A
Fast Switching Speed
D
Low Input/Output Leakage
B
Lead Free/RoHS Compliant (Note 2)
G
Mechanical Data
·
·
·
·
·
·
·
·
·
·
TOP VIEW
C
S
D
E
G
H
Case: SOT-23
Case Material: UL Flammability Classification Rating 94V-0
K
Moisture sensitivity: Level 1 per J-STD-020C
J
M
L
Marking (See Page 2): K7B
All Dimensions in mm
Ordering & Date Code Information: See Page 2
Weight: 0.008 grams (approx.)
Maximum Ratings
@ TA = 25°C unless otherwise specified
Symbol
Value
Units
Drain-Source Voltage
Characteristic
VDSS
60
V
Drain-Gate Voltage RGS £ 1.0MW
VDGR
60
V
Gate-Source Voltage
Continuous
Pulsed
VGSS
±20
±40
V
Drain Current
Continuous
ID
240
mA
Pd
300
mW
RqJA
417
°C/W
Tj, TSTG
-55 to +150
°C
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Note: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
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2N7002E
ã Diodes Incorporated
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
BVDSS
60
Test Condition
70
¾
V
VGS = 0V, ID = 10mA
µA
VDS = 60V, VGS = 0V
OFF CHARACTERISTICS (Note 3)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
@ TC = 25°C
@ TC = 125°C
IDSS
¾
¾
1.0
500
IGSS
¾
¾
±10
nA
VGS = ±15V, VDS = 0V
VGS(th)
1.0
¾
2.5
V
VDS = VGS, ID = 250mA
RDS (ON)
¾
¾
1.6
2.0
3
4
W
VGS = 10V, ID = 250mA
VGS = 4.5V, ID = 200mA
ID(ON)
0.8
1.0
¾
A
VGS = 10V, VDS = 7.5V
gFS
80
¾
¾
mS
Input Capacitance
Ciss
¾
22
50
pF
Output Capacitance
Coss
¾
11
25
pF
Reverse Transfer Capacitance
Crss
¾
2.0
5.0
pF
Turn-On Delay Time
tD(ON)
¾
7.0
20
ns
Turn-Off Delay Time
tD(OFF)
¾
11
20
ns
Gate-Body Leakage
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
Static Drain-Source On-Resistance
@ Tj = 25°C
On-State Drain Current
Forward Transconductance
VDS =10V, ID = 0.2A
DYNAMIC CHARACTERISTICS
VDS = 25V, VGS = 0V
f = 1.0MHz
SWITCHING CHARACTERISTICS
Ordering Information
Notes:
VDD = 30V, ID = 0.2A,
RL = 150W, VGEN = 10V,
RGEN = 25W
(Note 4)
Device
Packaging
Shipping
2N7002E-7-F
SOT-23
3000/Tape & Reel
3. Short duration test pulse used to minimize self-heating effect.
4. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
K7B
YM
NEW PRODUCT
Electrical Characteristics
K7B = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: P = 2003
M = Month ex: 9 = September
Date Code Key
Year
2003
2004
2005
2006
2007
2008
2009
Code
P
R
S
T
U
V
W
Month
Jan
Feb
March
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
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2N7002E
0.6
10V
TA = -55°C
1.6
ID, DRAIN CURRENT (A)
ID, DRAIN-SOURCE CURRENT (A)
2.0
VGS = 10V
9.0V
8.0V
7.0V
6.5V
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.1V
0.8
5.5V
5.0V
0.4
TA = 25°C
1.2
TA = 125°C
0.8
0.4
0.2
2.1V
0
0
0
1
0
3
2
1
4
5
6
7
VGS, GATE TO SOURCE VOLTAGE (V)
Fig. 2 Drain Current vs. Gate-Source Voltage
5
RDS(ON), DRAIN-SOURCE-ON-RESISTANCE (W)
RDS(ON), - DRAIN-SOURCE-ON-RESISTANCE (W)
3
2
5
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 On-Region Characteristics
4
3
ID = 250mA
2
ID = 75mA
1
0
5
4
3
VGS = 4.5V
2
VGS = 10V
1
0
0
2
4
6
8
10
0
0.2
VGS - GATE TO SOURCE VOLTAGE (V)
Fig. 3 On Resistance vs.
Gate to Source Voltage
0.6
0.4
0.8
1.0
ID, DRAIN CURRENT (A)
Fig. 4 On Resistance vs.
Drain Current
5
PD, POWER DISSIPATION (mW)
350
4
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (W)
NE W PRODUCT
1.0
3
VGS= 4.5V @ 200mA
2
VGS= 10V @ 250mA
1
300
250
200
150
100
50
0
0
-75
-50 -25
0
25
50
75
100 125
150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance vs. Junction Temperature
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0
25
50
75
100
125
150
175
200
TA, AMBIENT TEMPERATURE (°C)
Fig. 6, Max Power Dissipation vs
Ambient Temperature
2N7002E
IMPORTANT NOTICE
Diodes, Inc. and its subsidiaries reserve the right to make changes without further notice to any product herein to make corrections, modifications, enhancements, improvements, or other changes. Diodes, Inc. does not assume any liability arising out of the application or use of any product described herein;
neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such
use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
The products located on our website at www.diodes.com are not recommended for use in life support systems where a failure or malfunction of the
component may directly threaten life or cause injury without the express written approval of Diodes Incorporated.
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2N7002E