DIODES PDS3100

SPICE MODEL: PDS3100
PDS3100
3A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER
PowerDI ä5
NEW PRODUCT
Features
·
Guard Ring Die Construction for
Transient Protection
·
·
·
Low Power Loss, High Efficiency
·
·
·
High Forward Surge Current Capability
Low Reverse Leakage Current
D
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
b2
·
·
·
·
·
A2
L1
E
Lead Free Finish, RoHS Compliant (Note 1)
E1
"Green" Molding Compound (No Br, Sb)
L1
Mechanical Data
·
·
PowerDIä5
A
LEFT PIN
RIGHT PIN
Case: PowerDIä5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
e
BOTTOMSIDE
b1
HEAT SINK
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
A2
b1
Min
Max
A
1.05
1.15
A2
0.33
0.43
b1
0.80
0.99
b2
1.70
1.88
D
3.90
4.05
3.05 NOM
D2
D
D2
b2
6.40
E
5.30
E1
E2
Terminals: Finish – Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208 e3
W
Polarity: See Diagram
E
e
b1
Marking: See Page 3
b1
5.45
3.55 NOM
E2
L1
6.60
1.84 NOM
e
L
Moisture sensitivity: Level 1 per J-STD-020C
L
0.75
0.95
L1
0.50
0.65
W
1.20
1.50
All Dimensions in mm
Weight: 0.093 grams (approx.)
Maximum Ratings
Dim
@ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
(See also Figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Thermal Characteristics
Symbol
Value
Unit
VRRM
VRWM
VR
100
V
VR(RMS)
70
V
IO
3
A
IFSM
90
A
Tj
-65 to +150
°C
TSTG
-65 to +150
°C
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Typ
Max
Unit
Thermal Resistance Junction to Soldering Point
RqJS
¾
6.0
°C/W
Thermal Resistance Junction to Ambient Air (Note 2)
RqJA
¾
¾
°C/W
Thermal Resistance Junction to Ambient Air (Note 3)
RqJA
¾
¾
°C/W
Thermal Resistance Junction to Ambient Air (Note 4)
RqJA
¾
¾
°C/W
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30487 Rev. 4 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDS3100
ã Diodes Incorporated
@ TA = 25°C unless otherwise specified
Symbol
Min
V(BR)R
100
Forward Voltage
VF
¾
¾
¾
¾
Reverse Current (Note 5)
IR
¾
¾
2
0.5
Characteristic
Reverse Breakdown Voltage (Note 5)
Notes:
Typ
Max
Unit
¾
¾
V
IR = 0.2mA
0.71
0.61
0.78
0.68
0.75
0.65
0.83
0.75
V
IF = 3A, Tj = 25°C
IF = 3A, Tj = 100°C
IF = 6A, Tj = 25°C
IF = 6A, Tj = 100°C
200
20
mA
mA
Test Condition
Tj = 25°C, VR = 100V
Tj = 100°C, VR = 100V
5. Short duration test pulse used to minimize self-heating effect.
10
IF, INSTANTANEOUS FORWARD CURRENT (mA)
100000
Tj = +25°C
1
10000
1000
0.1
Tj = 150°C
100
Tj = 125°C
10
0.01
Tj = 100°C
1
Tj = 85°C
0.001
0.1
Tj = 25°C
Tj = -65°C
Tj = -65°C
0.01
0
0.0001
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
0
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Fig. 1 Typical Forward Characteristics
40
20
60
80
300
10
f = 1MHz
Tj = +150°C
1.0
Tj = +125°C
Tj = +100°C
0.1
Tj = +85°C
250
200
150
100
50
0
0.01
20
0
40
60
80
100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
DS30487 Rev. 4 - 2
PowerDI is a trademark of Diodes Incorporated.
100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
CT, TOTAL CAPACITANCE (pF)
IR, INSTANTANEOUS REVERSE CURRENT (mA)
NEW PRODUCT
Electrical Characteristics
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0
5
10
15
20
25
30
35
40
VR, REVERSE VOLTAGE (V)
Fig. 4 Typical Total Capacitance vs. Reverse Voltage
PDS3100
PF, FORWARD POWER DISSIPATION (W)
IF, DC FORWARD CURRENT (A)
3.5
3
2.5
2
Note 6
1.5
1
Note 2
0.5
4
IPK
= 1 (DC)
IAV
3
2
1
0
0
0
120
60
90
30
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 DC Forward Current Derating
0
150
1
2
3
4
5
6
7
IF, FORWARD CURRENT (A)
Fig. 6 Forward Power Dissipation
200
TA, DERATED AMBIENT TEMPERATURE (°C)
NEW PRODUCT
4
180
Note 2
160
140
120
100
80
60
40
20
0
0
25
50
75
100
VR, DC REVERSE VOLTAGE (V)
Fig. 7 Operating Temperature Derating
Ordering Information
Notes:
1.
2.
3.
4.
5.
6.
7.
(Note 7)
Device
Packaging
Shipping
PDS3100-13
PowerDIä5
5000/Tape & Reel
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
Short duration test pulse used to minimize self-heating effect.
Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 18.8mm x 14.4mm. Anode pad dimensions 5.6mm x 3.0mm.
For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
S3100
YYWWK
S3100 = Product type marking code
= Manufacturers’ code marking
YYWW = Date code marking
YY = Last digit of year ex: 4 for 2004
WW = Week code 01 to 52
K = Factory Designator
DS30487 Rev. 4 - 2
PowerDI is a trademark of Diodes Incorporated.
3 of 3
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PDS3100