SPICE MODEL: PDS835L PDS835L 8A LOW VF SCHOTTKY BARRIER RECTIFIER PowerDI ä5 NEW PRODUCT Features · Guard Ring Die Construction for Transient Protection D · · Low Forward Voltage Drop b2 · · · · High Forward Surge Current Capability For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Applications A2 L1 PowerDIä5 E E1 Lead Free Finish, RoHS Compliant (Note 1) L1 "Green" Molding Compound (No Br, Sb) e Qualified to AEC-Q101 Standards for High Reliability A2 b1 b1 Mechanical Data · · A D D2 b2 Case: PowerDIä5 Moisture Sensitivity: Level 1 per J-STD-020C · · · Polarity: See Diagram Terminals: Finish – Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 E2 E 1.05 1.15 0.33 0.43 b1 0.80 0.99 b2 1.70 1.88 D 3.90 4.05 3.05 NOM 6.40 5.30 e b1 LEFT PIN RIGHT PIN BOTTOMSIDE HEAT SINK 5.45 3.55 NOM E2 b1 6.60 1.84 NOM E1 L 0.75 0.95 L1 0.50 0.65 W 1.20 1.50 All Dimensions in mm Note: Pins Left & Right must be electrically connected at the printed circuit board. Maximum Ratings A A2 e L1 e3 Weight: 0.094 grams (approximate) Max E W Marking: See Page 3 Min D2 L Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 · · Dim @ TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current (See also figure 5) Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave Superimposed on Rated Load Operating Temperature Range Storage Temperature Range Thermal Characteristics Symbol Value Unit VRRM VRWM VR 35 V VR(RMS) 25 V IO 8 A IFSM 120 A Tj -65 to +125 °C TSTG -65 to +150 °C @ TA = 25°C unless otherwise specified Characteristic Thermal Resistance Junction to Soldering Point Symbol Typ Max Unit RqJS ¾ 3.0 °C/W Thermal Resistance Junction to Ambient Air (Note 2) RqJA 100 ¾ °C/W Thermal Resistance Junction to Ambient Air (Note 3) RqJA 65 ¾ °C/W Thermal Resistance Junction to Ambient Air (Note 4) RqJA 45 ¾ °C/W Notes: 1. 2. 3. 4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm. DS30488 Rev. 7 - 2 PowerDI is a trademark of Diodes Incorporated. 1 of 3 www.diodes.com PDS835L ã Diodes Incorporated @ TA = 25°C unless otherwise specified Symbol Min V(BR)R 35 Forward Voltage VF ¾ ¾ Reverse Leakage Current (Note 5) IR ¾ ¾ 0.05 7 Characteristic Reverse Breakdown Voltage (Note 5) IF, INSTANTANEOUS FORWARD CURRENT (A) Notes: Typ Max Unit ¾ ¾ V IR = 1mA 0.46 ¾ 0.51 0.41 V IF = 8A, TS = 25°C IF = 8A, TS = 125°C 1.4 35 mA Test Condition TS = 25°C, VR = 35V TS = 100°C, VR = 35V 5. Short duration test pulse used to minimize self-heating effect. 100 100 TJ = +25° C 10 10 Tj = 125°C 1 1 Tj = 100°C 0.1 0.1 Tj = 85°C 0.01 0.01 Tj = 25°C 0.001 TJ = -65° C 0.0001 0.001 Tj = -65°C 0.00001 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.0001 0.8 10 5 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics 15 20 25 30 35 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 2 Typical Reverse Characteristics 800 1000 f = 1 MHz 700 CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (mA) NEW PRODUCT Electrical Characteristics 100 Tj = 125°C 10 Tj = 100°C 1 Tj = +85°C 600 500 400 300 200 100 0 0.1 0 5 10 15 20 25 30 35 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics DS30488 Rev. 7 - 2 PowerDI is a trademark of Diodes Incorporated. 2 of 3 www.diodes.com 0 5 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Total Capacitance vs. Reverse Voltage PDS835L 6 Note 6 4 2 0 0 25 50 75 100 150 125 PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) IF, DC FORWARD CURRENT (A) 8 Note 2 4 IPK = 1 (DC) IAV 3 2 1 0 TA, AMBIENT TEMPERATURE (°C) Fig. 5 DC Forward Current Derating 0 1 2 3 4 5 6 7 8 9 10 IF(AV), AVERAGE FORWARD CURRENT (A) Fig. 6 Forward Power Dissipation 150 TA, DERATED AMBIENT TEMPERATURE (°C) NEW PRODUCT 10 Note 2 120 90 60 30 0 0 5 25 30 10 20 15 35 VR, DC REVERSE VOLTAGE (V) Fig. 7 Operating Temperature Derating Ordering Information Notes: 2. 3. 4. 6. 7. (Note 7) Device Packaging Shipping PDS835L-13 PowerDIä5 5000/Tape & Reel FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 18.8mm x 14.4mm. Anode pad dimensions 5.6mm x 3.0mm. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information S835L YYWWK S835L = Product type marking code = Manufacturers’ code marking YYWW = Date code marking YY = Last two digits of year ex: 04 for 2004 WW = Week code 01 to 52 K = Factory Designator DS30488 Rev. 7 - 2 PowerDI is a trademark of Diodes Incorporated. 3 of 3 www.diodes.com PDS835L