INTEGRATED CIRCUITS DATA SHEET TDA3857 Quasi-split sound processor with two FM demodulators Product specification File under Integrated Circuits, IC02 June 1994 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 FEATURES • Quasi-split sound processor for all FM standards e. g. B/G • Reducing of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (recommended for NICAM) • Automatic muting of the AF2 signal by the input level • Stereo matrix correction • Layout-compatible with TDA3856 (24 pins) and TDA3858 (32 pins). GENERAL DESCRIPTION Symmetrical IF inputs. Gain controlled wideband IF amplifier. AGC generation due to peak sync. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP supply voltage (pin 19) 4.5 5 8.8 V IP supply current − 60 72 mA Vi IF IF input sensitivity (−3 dB) − 70 100 µV Vo AF audio output signal (RMS value) − 1 − V THD total harmonic distortion − 0.5 − % S/N (W) weighted signal-to-noise ratio − 68 − dB ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA3857 20 DIL plastic SOT146(1) Note 1. SOT 146-1; 1996 November 28. June 1994 2 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators Fig.1 Block diagram (standard B/G). June 1994 3 TDA3857 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 PINNING SYMBOL PIN DESCRIPTION FMIF1 1 IF difference input 1 for B/G standard (38.9 MHz) CAGC 2 charge capacitor for AGC MATR 3 input for stereo matrix correction FM2R1 4 reference circuit for FM2 (5.74 MHz) FM2R2 5 reference circuit for FM2 (5.74 MHz) AF2 6 AF2 output (AF out of 5.74 MHz) AF1 7 AF1 output (AF out of 5.5 MHz) FM1R1 8 reference circuit for FM1 (5.5 MHz) FM1R2 9 reference circuit for FM1 (5.5 MHz) VC-R1 10 reference circuit for the vision carrier (38.9 MHz) VC-R2 11 reference circuit for the vision carrier (38.9 MHz) TRACK 12 DC output level for tracking FM1I 13 intercarrier input for FM1 (5.5 MHz) CAF1 14 DC decoupling capacitor for FM1 demodulator (AF1) ICO 15 intercarrier output signal (5.5/5.74 MHz) CAF2 16 DC decoupling capacitor for FM2 demodulator (AF2) FM2I 17 intercarrier input for FM2 (5.74 MHz) GND 18 ground (0 V) VP 19 +5 to +8 V supply voltage FMIF2 20 IF difference input 2 for B/G standard (38.9 MHz) June 1994 4 Fig.2 Pin configuration. Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators has to be adapted to other TV transmission standards if necessary, according to the formula FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all FM standards (e. g. B/G). C s = C p ( f vc ⁄ f sc ) 2 – C p The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. B/G standard AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Intercarrier buzz fine tuning with 250 kHz square wave video modulation Muting With no sound carrier SC2 at pin 17, AF2 output is muted. The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 17, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 1 and 20 generate noise at pin 17, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 17 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with ‘TV-demodulator AMF2’ (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with ∆f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB. Sound carrier notch filter for an improved intercarrier buzz The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and June 1994 TDA3857 5 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltage (pin 19) − 8.8 V VI voltage (pins 1, 6, 7, 13, 15, 17 and 20) 0 VP V Ptot total power dissipation 0 635 mW Tstg storage temperature −25 +150 °C Tamb operating ambient temperature 0 +70 °C VESD electrostatic handling (note 1) ±500 − V all pins except pins 1 and 20 pins 1 and 20 +400 − V −500 − V Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. CHARACTERISTICS VP = 5 V and Tamb = +25 °C; measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pin 19) 4.5 5 8.8 V IP supply current (pin 19) 48 60 72 mA IF amplifier (pins 1 and 20) RI input resistance 1.8 2.2 − kΩ CI input capacitance − 2.0 2.6 pF VI DC input voltage − 1.75 − V Vi IF (RMS) maximum input signal (RMS value, pins 1-20) Vo = +1 dB 70 100 − mV input signal sensitivity (RMS value) −3 dB intercarrier signal reduction at pin 15 − 70 100 µV ∆Gv IF gain control 60 63 − dB V2 voltage for gain control (pin 2) 1.7 − 2.6 V B IF bandwidth −3 dB 50 70 − MHz fo = 38.9 MHz − 270 − mV − 4 − kΩ − 0.247 − µH − 68 − pF Resonance amplifier (pins 10-11) Vo (p-p) vision carrier amplitude (peak-to-peak value) R10-11 operating resistance L inductance C capacitance June 1994 Figs 3 and 4 6 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators SYMBOL PARAMETER CONDITIONS MIN. TDA3857 TYP. MAX. UNIT − 40 − VP − 1 − V output signal for 5.5 MHz (RMS value) 71 95 125 mV output signal for 5.74 MHz (RMS value) 32 43 56 mV −1 dB 6 8.5 − MHz −3 dB 7 10 − MHz QL Q-factor of resonance circuit V10, 11 DC voltage (pins 10 and 11) Qo = 90 − Intercarrier mixer output (pin 15) Vo (RMS) B IF bandwidth VVID/V15 residual video AM on intercarrier note 1 − 3 10 % VVC (RMS) residual vision carrier (RMS value) 1st/2nd harmonic (38.9/77.8 MHz) − 0.5 1 mV R15 output resistance (emitter follower) 1 mA emitter current − 30 − Ω Io allowable AC output current (pin 15) − − ±0.7 mA I15 allowable DC output current − − −2 mA V15 DC voltage LC-circuit at pin 10, 11 adjusted to minimum video content at pin 15 1.5 1.75 2.0 V −3 dB AF signal − 300 450 µV 200 − − mV Limiting amplifiers (pins 13 and 17) Vi (RMS) minimum input signal (RMS value) maximum input signal (RMS value) R13, 17 input resistance 450 560 700 Ω V13, 17 DC voltage − 0 − V Vi (RMS) level detector threshold for no muting (RMS value, pin 17) 0.8 1.2 1.7 mV ∆Vi hysteresis of level detector 4 7 12 dB only 5.74 MHz channel FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation ∆f = ±50 kHz) at pins 13 and 17 without ceramic filters, Rs = 50 Ω. De-emphasis 50 µs. QL-factor = 11 for resonant circuits at pins 4-5 and 8-9 (including IC). VIC (RMS) intercarrier signals (RMS values, pins 4-5 and 8-9) − 100 − mV V DC voltage (pins 4, 5, 8 and 9) − 1.8 − V Vo (RMS) AF output signals (RMS values, pins 6 and 7) 0.84 0.95 1.07 V ∆Vo difference of AF signals between channels (pins 6 and 7) − − 1 dB R6, 7 output resistance 75 100 130 Ω V6, 7 DC voltage 1.8 2.1 2.4 V June 1994 note 2 7 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators SYMBOL I6, 7 (M) PARAMETER allowed AC current of emitter output (peak value) CONDITIONS note 3 MIN. − TDA3857 TYP. − MAX. UNIT ±1.5 mA I6, 7 maximum allowed DC output current − − −2 mA THD total harmonic distortion − 0.5 1.0 % Vo (RMS) AF output signal (RMS value) 1.25 − − V THD = 1.5% αAM AM suppression 1 kHz; m = 0.3 48 54 − dB S/N(W) weighted signal-to-noise ratio CCIR468-3 64 68 − dB B AF bandwidth (−3 dB) lower limit − − 20 Hz upper limit 100 − − kHz 60 70 − dB minimum output signal − 0 − V maximum output signal − 5 − V −1.5 −2.5 − dB αCR crosstalk attenuation (pins 6-7) V3 adjustment voltage for AF2 note 4 ∆GAF2min gain for minimum Vout V3 = 0 V ∆GAF2max gain for maximum Vout V3 = 5 V V14, 16 DC voltage (pins 14 and 16) 1.0 1.5 − dB − 1.8 − V Tracking Automatic Frequency Control (AFC) of the vision carrier reference circuit VP − 3.3 − VP − 1 V black picture − 9 − white test picture − 4 − 50% grey picture − 6 − black picture − −8 − mV/kHz white test picture − −3 − mV/kHz 50% grey picture − −5.5 − mV/kHz 70 − − dB − 5 25 mV Vo 12 tracking output voltage (pin 12) FTR tracking reducing factor for S note 5 AFC steepness (open loop) for AF signal switches input signals: FM intercarrier into pin 13 see part FM demodulator no signal in pin 17 (AF2) the output signals are related to the signals described in the demodulator part. Vo/Vomute AF2 mute attenuation (pin 6) dV6 DC jump at the AF2 output June 1994 switching to Mute 8 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators SYMBOL PARAMETER CONDITIONS MIN. TDA3857 TYP. MAX. UNIT AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 1, 20) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator part. (S+N)/N(W) weighted signal-to-noise ratio CCIR468-3; de-emphasis 50 µs black picture fi = 5.5 MHz 59 63 − dB 2T/20T pulses with white bar fi = 5.5 MHz 57 61 − dB 6 kHz sine wave, B/W-modulated fi = 5.5 MHz 52 56 − dB 250 kHz square wave, B/W-modulated fi = 5.5 MHz 50 54 − dB black picture fi = 5.742 MHz 57 61 − dB 2T/20T pulses with white bar fi = 5.742 MHz 55 59 − dB 6 kHz sine wave, B/W-modulated fi = 5.742 MHz 50 54 − dB 250 kHz square wave, B/W-modulated fi = 5.742 MHz 48 52 − dB 30 40 − dB Ripple rejection of the AF outputs RR ripple rejection Vripple on VP / Vripple on Vout VR(p-p) = 200 mV; fR = 70 Hz Notes to the characteristics 1. Spurious intercarrier AM: M = (A − B)/A (A = signal at sync; B = signal with 100% picture modulation). 2. AF signal can be adjusted by V3. 3. For larger current: RL > 2.2 kΩ (pin 6 or 7 to GND) in order to increase the bias current of the output emitter follower. 4. If not used, pin 3 should not be connected. 5. Automatic Frequency Control (AFC) of the vision carrier reference circuit (pins 10 and 11) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at deviation ∆fVC specifies the ratio of spurious signals with/without tracking function. June 1994 9 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 (1) CP = 47 pF with optional use of tracking (because of Co of the varicaps). Fig.3 Test and application circuit for standard B/G (for application SAW-filters must be used). (1) simple resonant circuit (2) resonant circuit with CP = 68 pF CS = CP (fVC/fSC)2 − CP CS = 27 pF (see Fig.3) Fig.4 Frequency response of the 38.9 MHz reference circuit. June 1994 10 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators APPLICATION INFORMATION Fig.5 Internal circuits (continued in Fig.6). June 1994 11 TDA3857 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators Fig.6 Internal circuits (continued from Fig.5). June 1994 12 TDA3857 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 PACKAGE OUTLINE DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 11 20 pin 1 index E 1 10 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 inches 0.17 0.020 0.13 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 D e e1 L ME MH w Z (1) max. 6.40 6.22 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 2.0 0.25 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.078 (1) E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 June 1994 REFERENCES IEC JEDEC EIAJ SC603 13 EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-05-24 Philips Semiconductors Product specification Quasi-split sound processor with two FM demodulators TDA3857 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 14