SEMICONDUCTOR TECHNICAL DATA The MC10H131 is a MECL 10H part which is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in clock speed and propagation delay and no increase in power–supply current. L SUFFIX CERAMIC PACKAGE CASE 620–10 • Propagation Delay, 1.0 ns Typical • Power Dissipation, 235 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 MAXIMUM RATINGS Symbol Rating Unit Power Supply (VCC = 0) Characteristic VEE –8.0 to 0 Vdc Input Voltage (VCC = 0) VI 0 to VEE Vdc Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA 0 to +75 °C Tstg –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic LOGIC DIAGRAM S1 5 D1 7 CE1 6 ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° Characteristic Power Supply Current 25° Min Max Min Max Min Max Unit IE — 62 — 56 — 62 mA Input Current High Pins 6, 11 Pin 9 Pins 7, 10 Pins 4, 5, 12, 13 IinH Input Current Low High Output Voltage µA — — — — 310 390 285 465 — — — — 310 390 285 465 IinL 0.5 — 0.5 — 0.3 — µA RS TRUTH TABLE VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc R VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc AC PARAMETERS S L L Qn+1 Qn L H H H L L H H N.D. N.D. = Not Defined 1.6 1.6 0.8 0.7 1.7 1.7 0.8 0.7 1.8 1.8 Q2 14 Q2 15 CLOCKED TRUTH TABLE Rise Time tr 0.6 2.0 0.6 2.0 0.6 2.2 ns Fall Time tf 0.6 2.0 0.6 2.0 0.6 2.2 ns tset 0.7 — 0.7 — 0.7 — ns Hold Time thold 0.8 — 0.8 — 0.8 — ns Toggle Frequency ftog 250 — 250 — 250 — MHz C D L X Qn+1 Qn H L L H H H C = CE + CC A clock H is a clock transition from a low to a high state. ns 0.8 0.6 3 S2 12 High Input Voltage Set–up Time CE2 11 D2 10 530 660 485 790 tpd Q1 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 — — — — Low Output Voltage Propagation Delay Clock, CE Set, Reset 2 R1 4 CC 9 R2 13 75° Symbol Q1 DIP PIN ASSIGNMENT NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. VCC1 1 16 Q1 2 15 VCC2 Q2 Q1 3 14 Q2 R1 4 13 R2 S1 5 12 S2 CE1 6 11 CE2 D1 7 10 D2 VEE 8 9 CC Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 2–69 REV 5 MC10H131 APPLICATION INFORMATION The MC10H131 is a dual master–slave type D flip–flop. Asynchronous Set (S) and Reset (R) override Clock (CC) and Clock Enable (CE) inputs. Each flip–flop may be clocked separately by holding the common clock in the new low state and using the enable inputs for the clocking function. If the common clock is to be used to clock the flip–flop, the Clock Enable inputs must be in the low state. MOTOROLA In this case, the enable inputs perform the function of controlling the common clock. The output states of the flip–flop change on the positive transition of the clock. A change in the information present at the data (D) input will not affect the output information at any other time due to master slave construction. 2–70 MECL Data DL122 — Rev 6 MC10H131 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–71 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H131 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–72 *MC10H131/D* MC10H131/D MECL Data DL122 — Rev 6