SEMICONDUCTOR TECHNICAL DATA The MC10H125 is a quad translator for interfacing data and control signals between the MECL section and saturated logic section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power–supply current. Outputs of unused translators will go to low state when their inputs are left open. L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 • Propagation Delay, 2.5 ns Typical • Voltage Compensated • Improved Noise Margin 150 mV • MECL 10K–Compatible (Over Operating Voltage and Temperature Range) FN SUFFIX PLCC CASE 775–02 MAXIMUM RATINGS Symbol Rating Unit Power Supply (VCC = 5.0 V) Characteristic VEE –8.0 to 0 Vdc Power Supply (VEE = –5.2 V) VCC 0 to +7.0 Vdc Input Voltage (VCC = 5.0 V) VI 0 to VEE Vdc Operating Temperature Range TA 0 to +75 °C Tstg –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic LOGIC DIAGRAM 2 0° Characteristic Negative Power Supply Drain Current Positive Power Supply pp y Drain C Current Input Current 25° 6 Symbol Min Max Min Max Min Max Unit IE — 44 — 40 — 44 mA ICCH ICCL — 63 — 63 — 63 mA — 40 — 40 — 40 mA IinH — 225 — 145 — 145 µA 10 12 11 14 ICBO — 1.5 — 1.0 — 1.0 µA High Output Voltage IOH = –1.0 mA VOH 2.5 — 2.5 — 2.5 — Vdc Low Output Voltage IOL = +20 mA VOL — 0.5 — 0.5 — 0.5 Vdc High Input Voltage(1) VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage(1) VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Short Circuit Current IOS 60 150 60 150 50 150 mA Reference Voltage VBB –1.38 –1.27 –1.35 –1.25 –1.31 –1.19 Vdc VCMR — — –2.85 to +0.3 VPP 1 VBB* GND = PIN 16 VCC ( +5.0 VDC)= PIN 9 VEE ( –5.2 VDC) = PIN 8 *VBB to be used to supply bias to the MC10H125 only and bypassed (when used) with 0.01 µF to 0.1 µF capacitor to ground (0 V). VBB can source < 1.0 mA. DIP PIN ASSIGNMENT V 150 13 15 Typical Input Sensitivity (4) 5 7 75° Input Leakage Current Common Mode Range (3) 4 3 ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%; VCC = 5.0 V ± 5.0 %) (See Note) mV AC PARAMETERS VBB 1 16 GND AIN 2 15 DIN tpd 0.8 3.3 0.85 3.35 0.9 3.4 ns AIN 3 14 DIN Rise Time(5) tr 0.3 1.2 0.3 1.2 0.3 1.2 ns AOUT 4 13 DOUT Fall Time(5) tf 0.3 1.2 0.3 1.2 0.3 1.2 ns BOUT 5 12 COUT BIN 6 11 CIN BIN 7 10 CIN VEE 8 9 VCC Propagation Delay NOTES: 1. When VBB is used as the reference voltage. 2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. 3. Differential input not to exceed 1.0 Vdc. 4. 150 mVp–p differential input required to obtain full logic swing on output. 5. 1.0 V to 2.0 V w/25 pF into 500 W. Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 9/96 Motorola, Inc. 1996 2–29 REV 6 MC10H125 APPLICATION INFORMATION The MC10H125 incorporates differential inputs and Schottky TTL “totem pole” outputs. Differential inputs allow for use as an inverting/non–inverting translator or as a differential line receiver. The VBB reference voltage is available on Pin 1 for use in single–ended input biasing. The outputs of the MC10H125 go to a low–logic level whenever the inputs are left floating, and a high–logic MOTOROLA output level is achieved with a minimum input level of 150 mVp–p. An advantage of this device is that MECL–level information can be received, via balanced twisted pair lines, in the TTL equipment. This isolates the MECL–logic from the noisy TTL environment. Power supply requirements are ground, +5.0 volts and –5.2 volts. 2–30 MECL Data DL122 — Rev 6 MC10H125 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–31 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H125 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–32 *MC10H125/D* MC10H125/D MECL Data DL122 — Rev 6