SEMICONDUCTOR TECHNICAL DATA The MC10H175 is a quint D type latch with common reset and clock lines. This MECL 10KH part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay and no increase in power–supply current. • Propagation Delay, 1.2 ns Typical • Power Dissipation, 400 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 MAXIMUM RATINGS Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Symbol Rating Unit VEE VI –8.0 to 0 Vdc 0 to VEE Vdc 50 100 mA 0 to +75 °C –55 to +150 –55 to +165 °C °C Output Current — Continuous — Surge Iout Operating Temperature Range TA Tstg Storage Temperature Range — Plastic — Ceramic FN SUFFIX PLCC CASE 775–02 TRUTH TABLE ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 107 — 97 — 107 mA Input Current High Pins 5,6,7,9,10,12,13 Pin 11 IinH — — 565 1120 — — 335 660 — — 335 660 Input Current Low IinL VOH VOL 0.5 — 0.5 — 0.3 High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage VIH VIL µA — µA –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc –1.02 –0.84 –0.98 –0.81 –0.92 Set–up Time Hold Time Rise Time Fall Time tpd C1 Reset Qn+1 L H X X X X L L H X H X L L X H X H X X L L H H L H Qn Qn L L ns VCC1 1 16 VCC2 Q2 2 15 Q1 Q3 3 14 Q0 Q4 4 13 D2 D4 5 12 D1 0.6 0.7 1.0 1.6 1.9 2.2 0.6 0.7 1.0 1.6 2.0 2.3 0.6 0.8 1.0 1.7 2.1 2.4 tset thold 1.5 — 1.5 — 1.5 — ns 0.8 — 0.8 — 0.8 — ns C0 6 11 RESET tr tf 0.5 1.8 0.5 1.9 0.5 2.0 ns C1 7 10 D0 0.5 1.8 0.5 1.9 0.5 2.0 ns VEE 8 9 D3 NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 C0 DIP PIN ASSIGNMENT AC PARAMETERS Propagation Delay Data Clock Reset D 2–92 REV 5 MC10H175 APPLICATION INFORMATION outputs while the clock is low. The outputs are latched on the positive transition of the clock. While the clock is in the high state, a change in the information present at the data inputs will not affect the output information. THE RESET INPUT IS ENABLED ONLY WHEN THE CLOCK IS IN THE HIGH STATE. The MC10H175 is a high speed, low power quint latch. It features five D type latches with common reset and a common two–input clock. Data is transferred on the negative edge of the clock and latched on the positive edge. The two clock inputs are “OR”ed together. Any change on the data input will be reflected at the LOGIC DIAGRAM D0 10 D C C C C D4 5 D C0 6 C C1 7 15 Q1 Q 2 Q2 Q 3 Q3 Q 4 Q4 R D D3 9 Q R D D2 13 14 Q0 R D D1 12 Q R R RESET 11 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 MECL Data DL122 — Rev 6 2–93 MOTOROLA MC10H175 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M N S S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–94 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MECL Data DL122 — Rev 6 MC10H175 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 5405; Denver, Colorado 80217. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 2–95 MC10H175/D MOTOROLA