ONSEMI RB520S30T1G

RB520S30T1G,
RB520S30T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
•
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.6 V (max) @ IF = 200 mA
Low Reverse Current
ESD Rating: Class 3B per Human Body Model
Class C per Machine Model
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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30 VOLT SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
VR
30
Vdc
Forward Current DC
IF
200
mA
SOD−523
CASE 502
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
1
Symbol
Max
Unit
PD
200
mW
1.57
mW/°C
Thermal Resistance, Junction−to−Ambient
RJA
635
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
5J M G
G
2
5J = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
1. FR−5 Minimum Pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Reverse Leakage
(VR = 10 V)
IR
−
−
1.0
A
Forward Voltage
(IF = 200 mA)
VF
−
−
0.60
Vdc
Characteristic
ORDERING INFORMATION
Device
Package
Shipping†
RB520S30T1G
SOD−523
(Pb−Free)
4 mm Pitch
3000/Tape & Reel
RB520S30T5G
SOD−523
(Pb−Free)
4 mm Pitch
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
July, 2011 − Rev. 9
1
Publication Order Number:
RB520S30T1/D
RB520S30T1G, RB520S30T5G
820 +10 V
2k
0.1 F
IF
100 H
t
tp
r
0.1 F
trr
10%
DUT
50 Output
Pulse
Generator
IF
t
90%
50 Input
Sampling
Oscilloscope
IR
VR
INPUT SIGNAL
t
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
200
1000
TA = 150°C
IR, REVERSE CURRENT (A)
100
150°C
10
125°C
1.0
0.1
0.0
85°C
25°C
−40°C
−55°C
TA = 125°C
10
1.0
TA = 85°C
0.1
0.01
TA = 25°C
0.001
0.1
0.2
0.3
0.4
0
0.6
0.5
5
10
15
20
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
14
12
CT, TOTAL CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
10
8
6
4
2
0
0
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Total Capacitance
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2
25
30
25
30
RB520S30T1G, RB520S30T5G
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
2X
2X
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
2X
L
PACKAGE
OUTLINE
L2
BOTTOM VIEW
1.80
0.48
2X
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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3
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
RB520S30T1/D