ONSEMI BAT54XV2T5G

BAT54XV2T1G
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
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Features
• Extremely Fast Switching Speed
• Low Forward Voltage − 0.35 V (Typ) @ IF = 10 mA
• S Prefix for Automotive and Other Applications Requiring Unique
•
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
30 VOLT
SILICON HOT−CARRIER
DETECTOR AND SWITCHING
DIODES
1
CATHODE
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating
Reverse Voltage
2
Symbol
Value
Unit
VR
30
V
Symbol
Max
Unit
PD
200
mW
1.57
mW/°C
1
2
ANODE
SOD−523
CASE 502
PLASTIC
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Forward Current (DC)
IF
200 Max
mA
Non−Repetitive Peak Forward
Current, tp < 10 msec
IFSM
600
mA
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle = 66%
IFRM
300
mA
Thermal Resistance,
Junction−to−Ambient
RJA
635
°C/W
TJ, Tstg
−55 to 125
°C
Junction and Storage Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
MARKING DIAGRAM
1
JVM G
G
JV
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Package
Shipping†
BAT54XV2T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
BAT54XV2T5G
SOD−523
(Pb−Free)
8000 / Tape &
Reel
SBAT54XV2T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 8
1
Publication Order Number:
BAT54XV2T1/D
BAT54XV2T1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
V(BR)R
30
−
−
V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT
−
7.6
10
pF
Reverse Leakage
(VR = 25 V)
IR
−
0.5
2.0
A
Forward Voltage
(IF = 0.1 mA)
VF
−
0.22
0.24
V
Forward Voltage
(IF = 1.0 mA)
VF
−
0.29
0.32
V
Forward Voltage
(IF = 10 mA)
VF
−
0.35
0.40
V
Forward Voltage
(IF = 30 mA)
VF
−
0.41
0.5
V
Forward Voltage
(IF = 100 mA)
VF
−
0.52
0.8
V
Reverse Recovery Time
(IF = IR = 10 mA, IR(REC) = 1.0 mA) Figure 1
trr
−
−
5.0
ns
trr
t
Reverse Breakdown Voltage
(IR = 10 A)
820 +10 V
2k
100 H
0.1 F
IF
t
tp
r
0.1 F
IF
10%
DUT
50 Output
Pulse
Generator
t
90%
50 Input
Sampling
Oscilloscope
VR
IR
INPUT SIGNAL
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
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2
BAT54XV2T1G
IR, REVERSE CURRENT (A)
1000
1 50°C
10
1 25°C
1.0
85°C
0.1
0.0
0.1
25°C
0.2
−40°C
−55°C
0.3
0.4
100
TA = 125°C
10
TA = 85°C
1.0
TA = 25°C
0.1
0.01
0.6
0.5
TA = 150°C
0
5
VF, FORWARD VOLTAGE (VOLTS)
10
12
10
8
6
4
2
0
20
Figure 3. Leakage Current
14
0
15
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
CT, TOTAL CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Total Capacitance
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3
25
30
25
30
BAT54XV2T1G
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
2X
2X
2X
BOTTOM VIEW
1.80
0.48
L
PACKAGE
OUTLINE
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
2X
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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BAT54XV2T1/D