VLMW32.. Vishay Semiconductors Power SMD LED PLCC-4 FEATURES • High efficient INGaN technology • Angle of half intensity ϕ = ± 60° • Available in 8 mm tape e3 • Luminous intensity, color and forward voltage categorized per packing unit • Luminous intensity ratio per packing unit IVmax/IVmin ≤ 1.6 • ESD-withstand voltage: up to 1 kV according to JESD22-A114-B • Lead (Pb)-free device • Preconditioning: according to Jedec Level 2a • Compatible with IR-Reflow, vapor phase and wave soldering processes according to CECC 00802 and J-STD-020C • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC • Automotive qualified AEC-Q101 19210_1 DESCRIPTION The VLMW32.. white LED is an advanced product in terms of heat dissipation. The leadframe profile of this PLCC-4 SMD package is optimized to reduce the thermal resistance. This allows higher drive current and doubles the light output compared to Vishay’s high intensity SMD LED in PLCC-2 standard package. APPLICATIONS • Camera flash light • Signal and symbol luminaire • Marker lights • Interior and exterior automotive lighting (brake lights, turn lights, backlighting, side markers) • Indicator lighting PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: PLCC-4 • Product series: SMD Power • Angle of half intensity: ± 60° PARTS TABLE PART COLOR, LUMINOUS INTENSITY TECHNOLOGY WAVELENGTH VLMW32T2V1-5K8L-08 White, IV = (355 to 900) mcd InGaN/TAG on SiC VLMW32T2V1-5K8L-18 White, IV = (355 to 900) mcd InGaN/TAG on SiC VLMW32U2V2-5K8L-08 White, IV = (560 to 1120) mcd InGaN/TAG on SiC VLMW32U2V2-5K8L-18 White, IV = (560 to 1120) mcd InGaN/TAG on SiC VLMW32T1V2-5K8L-08 White, IV = (280 to 1120) mcd InGaN/TAG on SiC VLMW32T1V2-5K8L-18 White, IV = (280 to 1120) mcd InGaN/TAG on SiC VLMW32U2AA-5K8L-08 White, IV = (560 to 1400) mcd InGaN/TAG on SiC VLMW32U2AA-5K8L-18 White, IV = (560 to 1400) mcd InGaN/TAG on SiC VLMW32V2AB-5K8L-08 White, IV = (900 to 1800) mcd InGaN/TAG on SiC VLMW32V2AB-5K8L-18 White, IV = (900 to 1800) mcd InGaN/TAG on SiC Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 1 VLMW32.. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMW32.. PARAMETER TEST CONDITION SYMBOL VALUE VR 5 V Tamb ≤ 65 °C IF 30 mA tp ≤ 10 µs IFSM 0.1 A Power dissipation PV 127 mW Junction temperature Reverse voltage2) DC Forward current Surge forward current UNIT Tj 100 °C Operating temperature range Tamb - 40 to + 100 °C Storage temperature range Tstg - 40 to + 100 °C t ≤ 5s Tsd 260 °C mounted on PC board (pad design see page 6) RthJA 270 K/W Soldering temperature Thermal resistance junction/ambient Note: 1) T amb = 25 °C, unless otherwise specified 2) Driving the LED in reverse direction is suitable for a short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMW32.., WHITE PARAMETER Luminous intensity Luminous Flux TEST CONDITION IF = 30 mA IF = 30 mA Chromaticity coordinate x, y acc. to CIE 1931 IF = 30 mA Angle of half intensity Forward voltage PART SYMBOL MIN MAX UNIT VLMW32T2V1-5K8L IV 355 TYP. 900 mcd VLMW32U2V2-5K8L IV 560 1120 mcd VLMW32T1V2-5K8L IV 280 1120 mcd VLMW32U2AA-5K8L IV 560 1400 mcd VLMW32V2AB-5K8L IV 900 1800 mcd mlm VLMW32T2V1-5K8L φV 1100 2800 VLMW32U2V2-5K8L φV 1700 3500 mlm VLMW32T1V2-5K8L φV 860 3500 mlm VLMW32U2AA-5K8L φV 1736 4340 mlm VLMW32V2AB-5K8L φV 2790 5580 mlm x y 0.33 0.33 IF = 30 mA ϕ ± 60 IF = 30 mA VF 3.7 deg 4.2 V Reverse voltage IR = 10 µA VR Temperature coefficient of VF IF = 20 mA TCVF -4 mV/K Temperature coefficient of IV IF = 20 mA TCIV - 0.5 %/K 5 V Note: 1) Tamb = 25 °C, unless otherwise specified www.vishay.com 2 Document Number 81619 Rev. 1.1, 20-Jul-07 VLMW32.. Vishay Semiconductors LUMINOUS INTENSITY CLASSIFICATION GROUP LIGHT INTENSITY (MCD) CROSSING TABLE VISHAY OSRAM NICHIA STANDARD MIN MAX VLMW32T2V1 LWE67C-T2V1 NSCW021T T1 280 355 VLMW32U2V2 LWE67C-U2V2 NSCW021T T2 355 450 VLMW32T1V2 LWE67C-T1V2 NSCW021T U1 450 560 VLMW32U2AA LWE6SC-U2AA NSCW021T U2 560 710 VLMW32V2AB LWE6SC-V2AB NSCW021T V1 710 900 V2 900 1120 AA 1120 1400 AB 1400 1800 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. CHROMATICITY COORDINATED GROUPS FOR WHITE SMD LED 5L 5K 6L 6K X Y X Y 0.291 0.268 0.330 0.330 0.285 0.279 0.330 0.347 0.307 0.312 0.347 0.371 0.310 0.297 0.345 0.352 0.296 0.259 0.330 0.310 0.291 0.268 0.330 0.330 0.310 0.297 0.338 0.342 0.313 0.284 0.352 0.344 0.310 0.297 0.345 0.352 0.307 0.312 0.347 0.371 0.330 0.347 0.367 0.401 0.330 0.330 0.364 0.380 0.313 0.284 0.352 0.344 0.310 0.297 0.338 0.342 0.330 0.330 0.364 0.380 0.330 0.310 0.360 0.357 7L 7K 8L 8K Note: Chromaticity coordinate groups are tested at a current pulse direction of 25 ms and a tolerance of ± 0.01. Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 3 VLMW32.. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 100 IV rel - Relative Luminous Intensity 40 I F - Forward Current (mA) 35 30 25 20 15 10 5 90 80 70 60 50 40 30 20 10 0 400 450 500 550 600 650 700 750 800 0 0 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 19034_1 Figure 1. Forward Current vs. Ambient Temperature Figure 4. Relative Intensity vs. Wavelength 2.0 I Vrel - Relative Luminous Intensity I Vrel - Relative Luminous Intensity 10 1 0.1 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.01 1 10 I F - Forward Current (mA) 16194 100 10 0.345 white 0.340 X 0.335 0.330 Y 0.325 0.320 0.315 2.5 3.0 3.5 4.0 4.5 0 5.0 V F - Forward Voltage (V) Figure 3. Forward Current vs. Forward Voltage www.vishay.com 4 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) Figure 5. Rel. Luminous Intensity vs. Ambient Temperature f - Chromaticitycoordinante shift (x,y) I F - Forward Current (mA) 100 1 2.0 0 10 20 16197 Figure 2. Relative Luminous Intensity vs. Forward Current 19035 λ - Wavelength (nm) 16196 16198 10 20 30 40 50 60 IF - Forward Current (mA) Figure 6. Chromaticity Coordinate Shift vs. Forward Current Document Number 81619 Rev. 1.1, 20-Jul-07 VLMW32.. Vishay Semiconductors 3.95 0.400 New color grouping white 8L 3.85 8K 0.350 3.80 7L 7K 3.75 Y-par VF - Forward Voltage (V) 3.90 3.70 3.65 6L 6K 0.300 5L 5K 3.60 0.250 3.55 3.50 3.45 0 10 20 0.200 0.250 0.270 0.290 0.310 0.330 0.350 0.370 30 40 50 60 70 80 90 100 T amb - Ambient Temperature (°C) 16199 X-par 19784_3 Figure 9. White Grouping SMD Figure 7. Forward Voltage vs. Ambient Temperature 10° 20° Δ VF - Change of Forward Voltage (mV) 0° IV rel - Relative Luminous Intensity 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 95 10319 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 600 500 30 mA 400 20 mA 300 200 100 10 mA 0 - 100 - 200 - 300 - 50 - 25 0 25 50 75 100 Tamb - Ambient Temperature (°C) 19036 Figure 10. Change of Forward Voltage vs. Ambient Temperature Figure 8. Rel. Luminous Intensity vs. Angular Displacement TAPING Dimensions in millimeters Anode 3.5 3.1 Cathode 2.2 2.0 4.0 3.6 5.75 5.25 3.6 3.4 Cathode 8.3 7.7 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 0.25 2.05 1.95 18596 Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 5 VLMW32.. Vishay Semiconductors RECOMMENDED PAD DESIGN Dimensions in millimeters (Wave-Soldering), RthJA = 270 K/W 16260 RECOMMENDED PAD DESIGN Dimensions in millimeters (Reflow-Soldering), RthJA = 270 K/W 16261 www.vishay.com 6 Document Number 81619 Rev. 1.1, 20-Jul-07 VLMW32.. Vishay Semiconductors OPTIONAL PAD DESIGN Dimensions in millimeters (Wave-Soldering), RthJA = 290 K/W 16262 OPTIONAL PAD DESIGN Dimensions in millimeters (Reflow-Soldering), RthJA = 290 K/W 16263 Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 7 VLMW32.. Vishay Semiconductors PACKAGE DIMENSIONS in millimeters Mounting Pad Layout 1.2 4 2.6 (2.8) area covered with solder resist 4 1.6 (1.9) 20541 METHOD OF TAPING/POLARITY AND TAPE AND SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. REEL REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) 4.5 3.5 2.5 1.5 Adhesive Tape 10.0 9.0 120° 13.00 12.75 63.5 60.5 Identification Label: Vishay Type Group Tape Code Production Code Quantity Blister Tape 14.4 max. 180 178 94 8665 Figure 12. Reel dimensions - GS08 Component Cavity 94 8670 REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERED TAPING OF VLM.3... 2.2 2.0 3.5 3.1 10.4 8.4 120° 5.75 5.25 3.6 3.4 4.5 3.5 4.0 3.6 2.5 1.5 8.3 7.7 13.00 12.75 62.5 60.0 Identification 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 0.25 2.05 1.95 94 8668 Figure 11. Tape dimensions in mm for PLCC-x www.vishay.com 8 Label: Vishay Type Group Tape Code Production Code Quantity 321 329 14.4 max. 18857 Figure 13. Reel dimensions - GS18 Document Number 81619 Rev. 1.1, 20-Jul-07 VLMW32.. Vishay Semiconductors SOLDERING PROFILE BARCODE-PRODUCT-LABEL EXAMPLE: IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a 300 106 max. 260 °C 245 °C 255 255°C°C 240 °C 217 °C 250 A H 200 T[°C] max. 30 s 150 37 max. 100 s max. 120 s 100 max. Ramp Down 6 °C/s max. Ramp Up 3 °C/s 50 B C D E F G 19795 0 0 50 100 150 250 200 300 t [s] 19470-3 max. 2 cycles allowed Figure 14. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) TTW Soldering 300 948626-1 (acc. to CECC00802) 5s Lead Temperature Temperature (°C) 250 200 second wave 235 °C...260 °C first wave full line: typical dotted line: process limits ca. 2 K/s ca. 200 K/s 150 A) Type of component B) Manufacturing plant C) SEL - Selection Code (Bin): e.g.: V1 = Code for Luminous Intensity Group 5L = Code for Chrom. Coordinate Group D) Date Code year/week E) Day Code (e. g. 1: Monday) F) Batch No. G) Total quantity H) Company code 100 °C...130 °C 100 ca. 5 K/s 2 K/s 50 forced cooling 0 0 50 100 150 200 250 Time (s) Figure 15. Double wave soldering of opto devices (all packages) Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 9 VLMW32.. Vishay Semiconductors DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. L E V E L CAUTION This bag contains MOISTURE –SENSITIVE DEVICES 2a 1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260°C) must be: a) Mounted within 672 hours at factory condition of < 30°C/60%RH or b) Stored at <10% RH. Aluminum bag Label 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23°C + 5°C or b) 2a or 2b is not met. 4. If baking is required, devices may be baked for: 192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen) or o or 96 hours at 60±5 Cand <5%RH For all device containers 24 hours at 100±5°C Not suitable for reels or tubes Reel 15973 Bag Seal Date: ______________________________ (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113 19786 Example of JESD22-A112 Level 2a label FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 hours under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C + 5 °C and < 5 % RH for all device containers or 24 hours at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC Standard JESD22-A112 Level 2a label is included on all dry bags. www.vishay.com 10 Document Number 81619 Rev. 1.1, 20-Jul-07 VLMW32.. Vishay Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 81619 Rev. 1.1, 20-Jul-07 www.vishay.com 11 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1