MC10H160 12-Bit Parity Generator-Checker The MC10H160 is a 12–bit parity generator–checker. The output goes high when an odd number of inputs are high providing the odd parity function. Unconnected inputs are pulled to a logic low allowing parity detection and generation for less than 12 bits. The MC10H160 is a functional pin duplication of the standard 10K family part with 100% improvement in propagation delay and no increase in power–supply current. • Propagation Delay, 2.5 ns Typical • Power Dissipation, 320 mW Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620A 1 16 PDIP–16 P SUFFIX CASE 648 LOGIC DIAGRAM VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 3 4 5 MC10H160L AWLYYWW MC10H160P AWLYYWW 1 1 TRUTH TABLE 6 7 INPUT 9 10 Sum of High Level Inputs 2 11 12 PLCC–20 FN SUFFIX CASE 775 OUTPUT Pin 2 Even Low Odd High 13 14 15 DIP PIN ASSIGNMENT A WL YY WW 10H160 AWLYYWW = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping MC10H160L CDIP–16 25 Units/Rail IN11 MC10H160P PDIP–16 25 Units/Rail 13 IN10 MC10H160FN PLCC–20 46 Units/Rail 5 12 IN9 IN4 6 11 IN8 IN5 7 10 IN7 VEE 8 9 IN6 VCC1 1 16 VCC2 OUT 2 15 IN12 IN1 3 14 IN2 4 IN3 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). Semiconductor Components Industries, LLC, 2000 May, 2000 – Rev. 7 1 Publication Order Number: MC10H160/D MC10H160 MAXIMUM RATINGS Symbol Rating Unit VEE VI Power Supply (VCC = 0) Characteristic –8.0 to 0 Vdc Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current – Continuous – Surge 50 100 mA TA Tstg Operating Temperature Range 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range – Plastic – Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.) 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit IE Power Supply Current – 88 – 78 – 88 mA IinH Input Current High Pins 3,5,7,10,12,14 Pins 4,6,9,11,13,15 – – 391 457 – – 246 285 – – 246 285 µA 0.5 – 0.5 – 0.3 – µA High Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc Low Output Voltage –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Propagation Delay 1.1 3.1 1.1 3.3 1.2 3.5 ns Rise Time 0.55 1.5 0.55 1.6 0.75 1.7 ns IinL VOH VOL Input Current Low VIH VIL AC PARAMETERS tpd tr tf Fall Time 0.55 1.5 0.55 1.6 0.75 1.7 ns 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. http://onsemi.com 2 MC10H160 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 G1 X V 0.010 (0.250) S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S 0.007 (0.180) M T L–M H S N S Z K1 K C E F 0.007 (0.180) M T L–M S 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L–M S N S VIEW S SEATING PLANE NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– N S MC10H160 B CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A–01 ISSUE O A A 16 9 1 8 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620–10. E F M C L K T N 16X 0.25 (0.010) G J 16X T B M 0.25 (0.010) –A– 16 9 1 8 PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M M D SEATING PLANE DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 T A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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