ONSEMI MC10H160L

MC10H160
12-Bit Parity
Generator-Checker
The MC10H160 is a 12–bit parity generator–checker. The output
goes high when an odd number of inputs are high providing the odd
parity function. Unconnected inputs are pulled to a logic low allowing
parity detection and generation for less than 12 bits. The MC10H160
is a functional pin duplication of the standard 10K family part with
100% improvement in propagation delay and no increase in
power–supply current.
• Propagation Delay, 2.5 ns Typical
• Power Dissipation, 320 mW Typical
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
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MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620A
1
16
PDIP–16
P SUFFIX
CASE 648
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
3
4
5
MC10H160L
AWLYYWW
MC10H160P
AWLYYWW
1
1
TRUTH TABLE
6
7
INPUT
9
10
Sum of
High Level
Inputs
2
11
12
PLCC–20
FN SUFFIX
CASE 775
OUTPUT
Pin 2
Even
Low
Odd
High
13
14
15
DIP
PIN ASSIGNMENT
A
WL
YY
WW
10H160
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC10H160L
CDIP–16
25 Units/Rail
IN11
MC10H160P
PDIP–16
25 Units/Rail
13
IN10
MC10H160FN
PLCC–20
46 Units/Rail
5
12
IN9
IN4
6
11
IN8
IN5
7
10
IN7
VEE
8
9
IN6
VCC1
1
16
VCC2
OUT
2
15
IN12
IN1
3
14
IN2
4
IN3
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
 Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 7
1
Publication Order Number:
MC10H160/D
MC10H160
MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
VI
Power Supply (VCC = 0)
Characteristic
–8.0 to 0
Vdc
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current – Continuous
– Surge
50
100
mA
TA
Tstg
Operating Temperature Range
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range – Plastic
– Ceramic
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.)
0°
Symbol
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
IE
Power Supply Current
–
88
–
78
–
88
mA
IinH
Input Current High
Pins 3,5,7,10,12,14
Pins 4,6,9,11,13,15
–
–
391
457
–
–
246
285
–
–
246
285
µA
0.5
–
0.5
–
0.3
–
µA
High Output Voltage
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
High Input Voltage
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
Propagation Delay
1.1
3.1
1.1
3.3
1.2
3.5
ns
Rise Time
0.55
1.5
0.55
1.6
0.75
1.7
ns
IinL
VOH
VOL
Input Current Low
VIH
VIL
AC PARAMETERS
tpd
tr
tf
Fall Time
0.55
1.5
0.55
1.6
0.75
1.7
ns
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts.
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2
MC10H160
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
G1
X
V
0.010 (0.250)
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
0.007 (0.180) M T L–M
H
S
N
S
Z
K1
K
C
E
F
0.007 (0.180) M T L–M
S
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L–M
S
N
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
N
S
MC10H160
B
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A–01
ISSUE O
A
A
16
9
1
8
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620–10.
E
F
M
C
L
K
T
N
16X
0.25 (0.010)
G
J
16X
T B
M
0.25 (0.010)
–A–
16
9
1
8
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
M
D
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
T A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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4
MC10H160/D