MC10H121 4-Wide OR-AND/OR-AND Gate The MC10H121 is a basic logic building block providing the simultaneous OR–AND/OR–AND–Invert function, useful in data control and digital multiplexing applications. This MECL 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power– supply current. • Propagation Delay, 1.0 ns Typical • Power Dissipation 100 mW/Gate Typical (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620A MC10H121L AWLYYWW 1 16 PDIP–16 P SUFFIX CASE 648 LOGIC DIAGRAM 4 5 MC10H121P AWLYYWW 1 1 6 7 PLCC–20 FN SUFFIX CASE 775 9 2 3 10 11 A WL YY WW 12 13 14 10H121 AWLYYWW = Assembly Location = Wafer Lot = Year = Work Week 15 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 ORDERING INFORMATION Device DIP PIN ASSIGNMENT VCC1 1 16 VCC2 AOUT 2 15 A4IN AOUT 3 14 A4IN A1IN 4 13 A4IN A1IN 5 12 A3IN A1IN 6 11 A3IN A2IN 7 10 A2IN, A3IN VEE 8 9 A2IN Package Shipping MC10H121L CDIP–16 25 Units/Rail MC10H121P PDIP–16 25 Units/Rail MC10H121FN PLCC–20 46 Units/Rail Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). Semiconductor Components Industries, LLC, 2000 May, 2000 – Rev. 7 1 Publication Order Number: MC10H121/D MC10H121 MAXIMUM RATINGS Symbol Rating Unit VEE VI Power Supply (VCC = 0) Characteristic –8.0 to 0 Vdc Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current — Continuous — Surge 50 100 mA TA Tstg Operating Temperature Range 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.) 0° Symbol Characteristic IE Power Supply Current IinH Input Current High Pins 3, 4, 5, 6, 7, 9 11, 12, 13, 14, 15 Pin 10 25° 75° Min Max Min Max Min Max Unit — 29 — 26 — 29 mA µA — — 500 610 — — 295 360 — — 295 360 0.5 — 0.5 — 0.3 — µA High Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc Low Output Voltage –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Propagation Delay Pin 10 Only Exclude Pin 10 0.45 0.55 1.8 1.95 0.45 0.6 1.8 2.0 0.55 0.7 2.2 2.4 Rise Time 0.5 1.7 0.5 1.8 0.5 1.9 ns Fall Time 0.5 1.7 0.5 1.8 0.5 1.9 ns IinL VOH VOL Input Current Low VIH VIL AC PARAMETERS tpd tr tf ns 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. http://onsemi.com 2 MC10H121 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 G1 X V 0.010 (0.250) S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S 0.007 (0.180) M T L–M H S N S Z K1 K C E F 0.007 (0.180) M T L–M S 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L–M S N S VIEW S SEATING PLANE NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– N S MC10H121 B CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A–01 ISSUE O A A 16 9 1 8 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620–10. E F M C L K T N 16X 0.25 (0.010) G J 16X T B M 0.25 (0.010) –A– 16 9 1 8 PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M M D SEATING PLANE DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 T A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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