MC74AC151, MC74ACT151 1−of−8 Decoder/Demultiplexer The MC74AC151/74ACT151 is a high−speed 8−input digital multiplexer. It provides, in one package, the ability to select one line of data from up to eight sources. The MC74AC151/74ACT151 can be used as a universal function generator to generate any logic function of four variables. Both true and complementary outputs are provided. • Outputs Source/Sink 24 mA • ′ACT151 Has TTL Compatible Inputs http://onsemi.com DIP−16 N SUFFIX CASE 648 16 VCC I4 I5 I6 I7 S0 S1 S2 16 15 14 13 12 11 10 9 1 16 1 2 I3 3 I2 I1 4 5 I0 6 Z Z 7 E 8 1 16 GND 1 SO−16 D SUFFIX CASE 751B TSSOP−16 DT SUFFIX CASE 948F Figure 1. Pinout: 16−Lead Packages Conductors (Top View) PIN ASSIGNMENT 16 PIN FUNCTION I0−I7 Data Inputs S0−S2 Select Inputs ORDERING INFORMATION Device E Enable Input Z Data Output Z Inverted Data Output TRUTH TABLE Inputs 1 EIAJ−16 M SUFFIX CASE 966 Outputs E S2 S1 S0 Z Z H L L L L L L L L X L L L L H H H H X L L H H L L H H X L H L H L H L H H I0 I1 I2 I3 I4 I5 I6 I7 L I0 I1 I2 I3 I4 I5 I6 I7 Package Shipping MC74AC151N PDIP−16 25 Units/Rail MC74ACT151N PDIP−16 25 Units/Rail MC74AC151D SOIC−16 48 Units/Rail MC74ACT151D SOIC−16 48 Units/Rail MC74AC151DR2 SOIC−16 2500 Tape & Reel MC74ACT151DR2 SOIC−16 2500 Tape & Reel MC74AC151DT TSSOP−16 96 Units/Rail MC74ACT151DT TSSOP−16 96 Units/Rail MC74AC151DTR2 TSSOP−16 2500 Tape & Reel MC74ACT151DTR2 TSSOP−16 2500 Tape & Reel H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial MC74AC151M EIAJ−16 50 Units/Rail MC74ACT151M EIAJ−16 50 Units/Rail DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 6 1 Publication Order Number: MC74AC151/D MC74AC151, MC74ACT151 S0 E I0 I1 I2 I3 I4 I5 I6 I7 S1 S2 Z Z Figure 2. Logic Symbol FUNCTIONAL DESCRIPTION Z = E•(I0•S0•S1•S2+I1•S0•S1•S2+ I2•S0•S1•S2+I3•S0•S1•S2+ I4•S0•S1•S2+I5•S0•S1•S2+ I6•S0•S1•S2+I7•S0•S1•S2) The MC74AC151/74ACT151 provides the ability, in one package, to select from eight sources of data or control information. By proper manipulation of the inputs, the MC74AC151/74ACT151 can provide any logic function of four variables and its complement. The MC74AC151/74ACT151 is a logic implementation of a single pole, 8−position switch with the switch position controlled by the state of three Select inputs, S0, S1, S2. Both true and complementary outputs are provided. The Enable input (E) is active LOW. When it is not activated, the complementary output is HIGH and the true output is LOW regardless of all other inputs. The logic function provided at the output is: I0 I1 I2 I3 I4 I5 S2 S1 S0 E NOTE: This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Z Figure 3. Logic Diagram http://onsemi.com 2 Z I6 I7 MC74AC151, MC74ACT151 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH IOL Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − Unit V V ns/V ns/V − − 140 °C −40 25 85 °C Output Current − High − − −24 mA Output Current − Low − − 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 3 MC74AC151, MC74ACT151 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 ±1.0 μA VI = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 μA VIN = VCC or GND VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 4 V V V IOUT = −50 μA *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 μA *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA MC74AC151, MC74ACT151 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Sn to Z or Z 3.3 5.0 3.0 2.5 11.5 8.5 18.0 13.0 3.0 2.0 20.0 15.0 ns 3−6 tPHL Propagation Delay Sn to Z or Z 3.3 5.0 2.5 2.0 12 8.5 18.0 13.0 2.5 1.5 20.0 15.0 ns 3−6 tPLH Propagation Delay E to Z or Z 3.3 5.0 2.5 2.0 8.0 6.0 13.0 10.0 2.0 1.5 14.0 11.0 ns 3−6 tPHL Propagation Delay E to Z or Z 3.3 5.0 1.5 1.5 8.5 6.5 13.0 10.0 1.5 1.5 14.0 11.0 ns 3−6 tPLH Propagation Delay In to Z or Z 3.3 5.0 2.5 1.5 9.5 7.0 14.0 10.5 2.0 1.5 15.5 11.0 ns 3−5 tPHL Propagation Delay In to Z or Z 3.3 5.0 2.5 1.5 9.5 7.0 15.0 11.0 2.0 1.5 16.0 12.0 ns 3−5 *Voltage Range 3.3 V is 3.3 V ± 0.3 V *Voltage Range 5.0 V is 5.0 V ± 0.5 V DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V VOL Maximum Low Level Output Voltage V V IOUT = −50 μA *VIN = VIL or VIH IOH −24 mA −24 mA IOUT = 50 μA *VIN = VIL or VIH IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 μA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 μA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 5 MC74AC151, MC74ACT151 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol Parameter VCC* (V) 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Sn to Z 5.0 3.5 − 15.5 3.0 17.0 ns 3−6 tPHL Propagation Delay Sn to Z 5.0 3.5 − 15.5 3.0 16.5 ns 3−6 tPLH Propagation Delay Sn to Z 5.0 3.5 − 15 3.0 16.5 ns 3−6 tPHL Propagation Delay Sn to Z 5.0 4.0 − 16.5 3.5 18.5 ns 3−6 tPLH Propagation Delay E to Z 5.0 2.5 − 9.5 2.5 10.0 ns 3−6 tPHL Propagation Delay E to Z 5.0 2.5 − 9.0 2.5 10.0 ns 3−6 tPLH Propagation Delay E to Z 5.0 2.5 − 8.5 2.5 9.5 ns 3−6 tPHL Propagation Delay E to Z 5.0 3.0 − 10.0 2.5 10.5 ns 3−6 tPLH Propagation Delay In to Z 5.0 3.5 − 11.5 3.0 12.5 ns 3−6 tPHL Propagation Delay In to Z 5.0 3.5 − 12.0 3.0 13.5 ns 3−6 tPLH Propagation Delay In to Z 5.0 3.5 − 12.0 3.0 13.0 ns 3−6 tPHL Propagation Delay In to Z 5.0 4.0 − 12.5 3.0 14.0 ns 3−6 *Voltage Range 5.0 V is 5.0 V ± 0.5 V CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 70 pF VCC = 5.0 V http://onsemi.com 6 MC74AC151, MC74ACT151 MARKING DIAGRAMS DIP−16 SO−16 MC74AC151N AWLYYWW AC151 AWLYWW MC74ACT151N AWLYYWW ACT151 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 7 TSSOP−16 EIAJ−16 AC 151 ALYW 74AC151 ALYW ACT 151 ALYW 74ACT151 ALYW MC74AC151, MC74ACT151 PACKAGE DIMENSIONS PDIP−16 N SUFFIX 16 PIN PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 D SUFFIX 16 PIN PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC151, MC74ACT151 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX 16 PIN PLASTIC TSSOP PACKAGE CASE948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D DETAIL E H G EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966−01 ISSUE O 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 9 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74AC151, MC74ACT151 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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