INTERSIL ISL14011

ISL14011
®
Data Sheet
January 30, 2007
Low Jitter Clock Generators for Set-Top
Box
The ISL14011 series of devices are general purpose
integrated Clock Synthesizers and Generators suited for
consumer applications such as Set-top Box, and various
other consumer applications.
The selectable reference input accepts 30MHz signal either
from crystal or an external source. It is specified to operate
with a nominal 3.3V supply and is offered in 16 Ld QFN
package.
Contact Factory for other output frequency options.
ISL14011IRZ*
PART
MARKING
TEMP.
RANGE (°C)
11IZ
Features
• LVTTL Outputs
• Selectable Crystal or Ref. Clock for Inputs
• Period Jitter ~50ps RMS
• Single Supply; 3.3V nominal
• Extended Temperature Range: -40°C to +85°C
• Available in small foot print package
- 16 Ld QFN 3mmx3mm
• Pb-Free plus anneal available (RoHS Compliant)
Applications
Ordering Information
PART
NUMBER
FN6427.0
-40 to +85
PACKAGE
16 Ld QFN
PKG.
DWG. #
L16.3x3
• Set-Top Boxes
Pinout
ISL14011
(16 LD QFN)
TOP VIEW
NC
VCC
CLK4
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
VCC
*Add "-T" suffix for tape and reel.
16
15
14
13
VCC 1
4 LVTTL
1
25, 30, 24, 27 16 Ld QFN
10 CLK2
GND 4
9
5
6
7
8
CLK1
30MHz
X2 3
GND
ISL14011
11 CLK3
NC
NUMBER
OF
OUTPUT
PART
INPUT
OPTIONS FREQUENCY OUTPUTS FREQUENCY PACKAGE
X1 2
GND
Selection Table
12 NC
NC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright Intersil Americas Inc. 2007. All Rights Reserved
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ISL14011
Functional Block Diagram
CLK1
OSC.
M1
PHASE FREQ DET.
VCO1
CLK2
30MHz
CRYSTAL
N1
CLK3
M2
PHASE FREQ DET.
VCO2
CLK4
N2
Pin Description
16 LD QFN
SYMBOLS
1,14,16
VCC
2
X1
The X1 pin is the terminal 1 of an external 30MHz crystal. This pin is grounded for external CK input.
3
X2
The X2 pin is the terminal 2 of external 30MHz crystal, or external clock input.
4, 5, 7
GND
Ground
8
CLK1
CLK1 Output: 25MHz
10
CLK2
CLK2 Output: 30MHz
11
CLK3
CLK3 Output: 24MHz
13
CLK4
CLK4 Output: 27MHz
6, 9,12,15
NC
2
PIN DESCRIPTION
Supply Voltage
No Connect
FN6427.0
January 30, 2007
ISL14011
Absolute Maximum Ratings
Thermal Information
Voltage on VCC, CLK pins (respect to Gnd) . . . . . . . . -0.3V to 4.0V
Voltage on X1, X2 pins (respect to Gnd) . . . . . . . . . . . -0.3V to 2.5V
ESD Rating
MIL STD-883, Method 3014 . . . . . . . . . . . . . . . . . . . . . . . . .>±5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
θJC (°C/W)
16 Ld QFN Package. . . . . . . . . . . . . . .
59
11.5
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65ºC to +150ºC
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300ºC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
DC Electrical Specifications
SYMBOL
VCC = 3.3V ±10%, TA = -40ºC to +85ºC, Typical values are at TA = +25ºC and VCC = 3.3V,
Unless otherwise noted
SYMBOL
CONDITIONS
Supply Voltage
VCC
Supply Voltage
Supply Current
ICC
Supply Current CL = 5pF on all outputs
MIN
TYP
MAX
UNIT
3.0
3.3
3.6
V
11
15
mA
2.4
V
0.5
V
CLOCK INPUT X2 (X1 GROUNDED) FOR EXTERNAL CLOCK MODE
Input High Level
VIH
Input Level Low
VIL
Input Current
1.5
IIL, IIH
VX2 to Ground
VOH
IOH = -100µA
0.5
mA
CLOCK OUTPUTS (CLK)
Output High Level
Output Low Level
VOL
Output Short Circuit Current
IOSC
AC Electrical Specifications
SYMBOL
VCC-0.2
V
IOH = -4mA
2.4
V
IOH = -6mA
2.1
V
IOL = 100µA
0.2
V
IOL = 4mA
0.4
V
IOL = 6mA
0.75
V
CLK = VCC or Gnd
13
30
mA
MIN
TYP
MAX
UNIT
CL= 5pF on all outputs
SYMBOL
Crystal Frequency
6
CONDITIONS
fin
30
MHz
CLOCK OUTPUTS
Rise Time
tR
20% to 80% VCC
1.8
ns
Fall Time
tF
80% to 20% VCC
1.8
ns
Duty Cycle
40
60
%
Period Jitter
JP
RMS
50
ps
Power Up Time
tPO
VCC >2.7V
2
ms
3
FN6427.0
January 30, 2007
ISL14011
Typical Performance Curves (Period Jitter)
70
VSUPPLY = 3.3V
TEMPERATURE +23ºC
PERIOD JITTER SIGMA (ps)
65
60
CK1
55
CK2
50
45
CK4
40
CK3
35
30
25
20
0
2
4
6
8
10
12
14
LOAD CAPACITANCE (pF)
FIGURE 1. STANDARD DEVIATION vs LOAD CAPACITANCE
4
FN6427.0
January 30, 2007
ISL14011
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L16.3x3
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
2X
MILLIMETERS
0.15 C A
D
A
9
D/2
D1
D1/2
2X
N
6
INDEX
AREA
0.15 C B
MIN
NOMINAL
E1/2
E
A
0.80
0.90
1.00
-
-
-
0.05
-
A2
-
-
1.00
9
A3
0.20 REF
0.18
0.15 C B
B
TOP VIEW
A2
D1
2.75 BSC
9
1.35
A
0
0.08 C
9
5
NX b
0.10
4X P
D2
(DATUM B)
A1
7, 8, 10
9
1.65
7, 8, 10
0.50 BSC
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
N
16
2
Nd
4
3
4
3
8
P
-
-
0.60
NX k
θ
-
-
12
7
D2
2 N
1.50
Ne
M CA B
1.65
2.75 BSC
1.35
e
/ / 0.10 C
1.50
3.00 BSC
E1
C
A3
5, 8
-
E2
SIDE VIEW
0.30
3.00 BSC
E
SEATING PLANE
0.23
9
D
D2
2X
0.15 C A
NOTES
E/2
E1
2X
MAX
A1
b
1
2
3
9
4X
SYMBOL
9
9
Rev. 1 6/04
4X P
NOTES:
1
(DATUM A)
2
3
6
INDEX
AREA
E2/2
NX L
N e
8
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
(Ne-1)Xe
REF.
E2
2. N is the number of terminals.
7
3. Nd and Ne refer to the number of terminals on each D and E.
8
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
9
CORNER
OPTION 4X
(Nd-1)Xe
REF.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
BOTTOM VIEW
A1
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
NX b
5
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
SECTION "C-C"
C
L
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
C
L
L1
10
L
L1
10
L
10. Compliant to JEDEC MO-220VEED-2 Issue C, except for the E2
and D2 MAX dimension.
e
e
TERMINAL TIP
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C C
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
5
FN6427.0
January 30, 2007