HRS TR0636E

TR0636E-20170
IT3D(M)-300S-BGA (37) Lead-Free
CROSS SECTION TEST REPORT
- Post 6000 cycles Report -
APPRO VED
T Y. ARAI
Nov . 18, 2009
CHECKED
T M. MAT SUO
Nov . 18, 2009
CHARG ED
T S. KI KUCHI
Nov . 17, 2009
HIROSE ELECTRIC
- 1 -
[1] Objective
To evaluate SnCu intermetallic at BGA joints by cross sectioning initial state and post 6000
thermal cycle in accordance with IPC-9701.
[2] Specimens
No.
Product Name
State
1
5
Reworked
Initial
3
Water Soluble
IT3M-300S-BGA (37)
Lead Free
6
7
Solder Ball on Connector
Virgin Assembly
Reworked
Virgin Assembly
No clean
Reworked
Post 6000 cycle
Water Soluble
8
Assembly
Virgin Assembly
No clean
2
4
Solder paste
Virgin Assembly
Reworked
Virgin
Reworked
Sn-3.0Ag-0.5Cu
Sn-3.0Ag-0.5Cu
Remarks
328
*Specimens are assembled as Fig.1.
*The test board design is based on IPC-9701
specification.
*Thickness of the PCB: 3.3mm
294
Spacer Position
[3] Test Period
From July 16, 2008 to January 20, 2009
- 2 -
Cross Sectioning
1.
Requirements
SnCu intermetallic is observed at ‘the solder to connector pin interface’ and ‘the solder to
pad interface’.
2.
Conditions
2-1 Test condition
0
(+10 / 0 C )
0
( 0 / -10 C )
Number of cycles : 6000
For details, please refer to IPC-9701 and JESD22-A-104-B.
2-2 Cross Sectioning Locations
1st Column of Solder Joints
Pin 1 Side
1st Row of Solder Joints
- 3 -
3.
Results
Typical SnCu intermetallic was observed in all specimens.
■ Initial
Representative
Cross Section
A
B
(Cross Section)
3-1: No clean, Virgin
Assembly
A
B
3-2: No clean,
Reworked
3-3: Water Soluble,
Virgin Assembly
- 4 -
3-4: Water Soluble,
Reworked
■ Post 6000 cycles
Representative
Cross Section
A
B
(Cross Section)
3-1: No clean, Virgin
Assembly
A
B
3-2: No clean,
Reworked
3-3: Water Soluble,
Virgin Assembly
- 5 -
3-4: Water Soluble,
Reworked
- 6 -