TR0636E-20170 IT3D(M)-300S-BGA (37) Lead-Free CROSS SECTION TEST REPORT - Post 6000 cycles Report - APPRO VED T Y. ARAI Nov . 18, 2009 CHECKED T M. MAT SUO Nov . 18, 2009 CHARG ED T S. KI KUCHI Nov . 17, 2009 HIROSE ELECTRIC - 1 - [1] Objective To evaluate SnCu intermetallic at BGA joints by cross sectioning initial state and post 6000 thermal cycle in accordance with IPC-9701. [2] Specimens No. Product Name State 1 5 Reworked Initial 3 Water Soluble IT3M-300S-BGA (37) Lead Free 6 7 Solder Ball on Connector Virgin Assembly Reworked Virgin Assembly No clean Reworked Post 6000 cycle Water Soluble 8 Assembly Virgin Assembly No clean 2 4 Solder paste Virgin Assembly Reworked Virgin Reworked Sn-3.0Ag-0.5Cu Sn-3.0Ag-0.5Cu Remarks 328 *Specimens are assembled as Fig.1. *The test board design is based on IPC-9701 specification. *Thickness of the PCB: 3.3mm 294 Spacer Position [3] Test Period From July 16, 2008 to January 20, 2009 - 2 - Cross Sectioning 1. Requirements SnCu intermetallic is observed at ‘the solder to connector pin interface’ and ‘the solder to pad interface’. 2. Conditions 2-1 Test condition 0 (+10 / 0 C ) 0 ( 0 / -10 C ) Number of cycles : 6000 For details, please refer to IPC-9701 and JESD22-A-104-B. 2-2 Cross Sectioning Locations 1st Column of Solder Joints Pin 1 Side 1st Row of Solder Joints - 3 - 3. Results Typical SnCu intermetallic was observed in all specimens. ■ Initial Representative Cross Section A B (Cross Section) 3-1: No clean, Virgin Assembly A B 3-2: No clean, Reworked 3-3: Water Soluble, Virgin Assembly - 4 - 3-4: Water Soluble, Reworked ■ Post 6000 cycles Representative Cross Section A B (Cross Section) 3-1: No clean, Virgin Assembly A B 3-2: No clean, Reworked 3-3: Water Soluble, Virgin Assembly - 5 - 3-4: Water Soluble, Reworked - 6 -