ONSEMI MMBD717LT1G

MMBD717LT1
Preferred Device
Common Anode
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
• Extremely Fast Switching Speed
• Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1 mAdc
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating
Symbol
Value
Unit
Reverse Voltage
VR
20
V
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF
200
1.6
mW
mW/°C
Operating Junction Temperature Range
TJ
−55 to +150
°C
Storage Temperature Range
Tstg
−55 to +150
°C
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20 VOLT
SCHOTTKY BARRIER
DETECTOR AND SWITCHING
DIODES
CATHODE
1
ANODE
3
2
CATHODE
1
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
SC−70 / SOT−323
CASE 419
STYLE 4
ELECTRICAL CHARACTERISTICS (TA = 125°C unless otherwise noted)
MARKING DIAGRAM
Rating
Symbol
Min
Typ
Max
Unit
V(BR)R
20
−
−
V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT
−
2.0
2.5
PF
Reverse Leakage (VR = 10 V)
(For each individual diode while
the second diode is unbiased)
IR
−
0.05
1.0
mAdc
Forward Voltage (IF = 1.0 mAdc)
VF
−
0.28
0.37
Vdc
Reverse Breakdown Voltage
(IR = 10 mA)
B3 M G
G
1
B3 = Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping †
MMBD717LT1
SC−70
3,000 / Tape & Reel
SC−70
(Pb−Free)
3,000 / Tape & Reel
MMBD717LT1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
Publication Order Number:
MMBD717LT1/D
MMBD717LT1
820 W
+10 V
2k
100 mH
0.1 mF
IF
tr
tp
0.1 mF
IF
t
trr
10%
t
DUT
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
90%
iR(REC) = 1 mA
IR
VR
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
INPUT SIGNAL
NOTES: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
IR , REVERSE CURRENT (μA)
100
IF, FORWARD CURRENT (mA)
10
1.0
150 °C
125 °C
0
0.05
85°C
0.1
125°C
1.0
85°C
0.1
0.01
0.15
25°C
0.2
0.25
−40 °C
0.3
25°C
−55 °C
0.35
0.4
0.45
0.001
0.5
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Forward Voltage
Figure 3. Reverse Current versus Reverse Voltage
3.0
2.5
C T, CAPACITANCE (pF)
0.1
TA = 150°C
10
2.0
1.5
1.0
0.5
0
0
2.0
4.0
6.0
8.0
10
12
VR, REVERSE VOLTAGE (VOLTS)
14
Figure 4. Typical Capacitance
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2
16
18
MMBD717LT1
PACKAGE DIMENSIONS
SC−70 / SOT−323
CASE 419−04
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
D
e1
3
DIM
A
A1
A2
b
c
D
E
e
e1
L
HE
E
HE
1
2
b
e
A
0.05 (0.002)
c
A2
L
A1
MIN
0.80
0.00
0.30
0.10
1.80
1.15
1.20
2.00
MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.7 REF
0.35
0.40
0.18
0.25
2.10
2.20
1.24
1.35
1.30
1.40
0.65 BSC
0.425 REF
2.10
2.40
MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.079
INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.017 REF
0.083
MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.095
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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For additional information, please contact your
local Sales Representative.
MMBD717LT1/D