BYW51−200 SWITCHMODEt Power Rectifier Features and Benefits • • • • • • Low Forward Voltage Low Power Loss/High Efficiency High Surge Capacity 175°C Operating Junction Temperature 16 A Total (8 A Per Diode Leg) Pb−Free Packages are Available* http://onsemi.com ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS trr = 35 ns Applications • Power Supply − Output Rectification • Power Management • Instrumentation 1 2, 4 3 Mechanical Characteristics • • • • • • MARKING DIAGRAM Case: Epoxy, Molded Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 1.9 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Rating: Human Body Model 3B Machine Model C TO−220AB CASE 221A PLASTIC A Y WW BYW51−200 G AKA AYWW BYW51−200G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION Device BYW51−200 BYW51−200G Package Shipping TO−220 50 Units/Rail TO−220 (Pb−Free) 50 Units/Rail *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 3 1 Publication Order Number: BYW51−200/D BYW51−200 MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 200 V Average Rectified Forward Current TC = 156°C Per Leg Total Device IF(AV) A 8.0 16 Peak Rectified Forward Current (Square Wave, 20 kHz), TC = 153°C − Per Diode Leg IFM 16 A Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 100 A TJ, Tstg −65 to +175 °C Operating Junction Temperature and Storage Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Conditions Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case Characteristic Min. Pad RqJC 3.0 °C/W Maximum Thermal Resistance, Junction−to−Ambient Min. Pad RqJA 60.0 Min Typical Max − − 0.8 0.89 0.89 0.97 − − 21 3.8 1000 10 − − 35 25 ELECTRICAL CHARACTERISTICS Characteristic Symbol Instantaneous Forward Voltage (Note 1) (iF = 8.0 A, Tj = 100°C) (iF = 8.0 A, Tj = 25°C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, Tj = 100°C) (Rated dc Voltage, Tj = 25°C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/s) (IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A) trr 1. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0% http://onsemi.com 2 Unit V mA ns BYW51−200 70 50 30 100°C 10 7.0 175°C 25°C 100°C 10 1.0 0.1 0.2 0.3 25°C 5.0 0.4 0.5 0.6 0.7 0.9 0.8 1.0 1.1 1.2 1.3 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 2. Maximum Forward Voltage 3.0 2.0 IR, REVERSE CURRENT (m A) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 20 TJ = 175°C 100 IF, INSTANTANEOUS FORWARD CURRENT (A) 100 1.0 0.7 0.5 0.3 0.2 800 400 200 80 40 20 8.0 4.0 2.0 TJ = 175°C 100°C 0.8 0.4 0.2 0.08 0.04 0.02 25°C 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Figure 3. Typical Reverse Current, Per Leg* 1.2 * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. vF, INSTANTANEOUS VOLTAGE (VOLTS) 20 20 IF(AV), AVERAGE FORWARD CURRENT (A) IF(AV), AVERAGE FORWARD CURRENT (A) Figure 1. Typical Forward Voltage, Per Leg 18 16 14 12 10 dc 8.0 6.0 SQUARE WAVE 4.0 2.0 0 140 145 150 155 160 165 170 175 180 RqJA = 16°C/W RqJA = 60°C/W (NO HEATSINK) 18 16 14 dc 12 10 8.0 SQUARE WAVE 6.0 dc 4.0 SQUARE WAVE 2.0 0 0 TC, CASE TEMPERATURE (°C) 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) Figure 4. Current Derating, Case, Per Leg Figure 5. Current Derating, Ambient, Per Leg http://onsemi.com 3 24 1000 22 TJ = 175°C 20 18 SQUARE WAVE 16 14 12 C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (W) BYW51−200 dc 10 8.0 6.0 300 TJ = 25°C 100 30 4.0 2.0 0 10 0 2.0 4.0 6.0 8.0 10 12 14 16 18 1.0 20 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 6. Power Dissipation, Per Leg 10 VR, REVERSE VOLTAGE (VOLTS) Figure 7. Typical Capacitance, Per Leg http://onsemi.com 4 100 BYW51−200 PACKAGE DIMENSIONS TO−220 CASE 221A−09 ISSUE AD −T− B SEATING PLANE C F T S INCHES DIM MIN MAX A 0.570 0.620 B 0.380 0.405 C 0.160 0.190 D 0.025 0.035 F 0.142 0.147 G 0.095 0.105 H 0.110 0.155 J 0.018 0.025 K 0.500 0.562 L 0.045 0.060 N 0.190 0.210 Q 0.100 0.120 R 0.080 0.110 S 0.045 0.055 T 0.235 0.255 U 0.000 0.050 V 0.045 −−− Z −−− 0.080 STYLE 6: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE 4 A Q 1 2 3 U H K Z L R V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. J G D N MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 −−− −−− 2.04 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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