MC74AC20, MC74ACT20 Dual 4−Input NAND Gate Features • Outputs Source/Sink 24 mA • ′ACT20 Has TTL Compatible Inputs • Pb−Free Packages are Available VCC A1 B1 NC C1 D1 O1 14 13 12 11 10 9 8 http://onsemi.com PDIP−14 N SUFFIX CASE 646 14 1 SOIC−14 D SUFFIX CASE 751A 14 1 2 3 4 5 6 7 A0 B0 NC C0 D0 O0 GND 1 Figure 1. Pinout: 14-Lead Packages (Top View) 14 1 SOEIAJ−14 M SUFFIX CASE 965 PIN ASSIGNMENT PIN FUNCTION An, Bn, Cn, Dn Inputs On Outputs ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage (Referenced to GND) VCC −0.5 to +7.0 V DC Input Voltage (Referenced to GND) Vin −0.5 to VCC + 0.5 V DC Output Voltage (Referenced to GND) Vout −0.5 to VCC + 0.5 V DC Input Current, per Pin Iin ± 20 mA DC Output Sink/Source Current, per Pin Iout ± 50 mA DC VCC or GND Current per Output Pin ICC ± 50 mA Storage Temperature Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 8 1 Publication Order Number: MC74AC20/D MC74AC20, MC74ACT20 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VREG DC Regulated Power Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Min Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − HIGH − − −24 mA IOL Output Current − LOW − − 24 mA ns/V 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum Low Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 ±1.0 mA 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 4.0 40 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V. http://onsemi.com 2 V V V IOUT = − 50 mA *VIN = VIL or VIH − 12 mA IOH − 24 mA − 24 mA IOUT = 50 mA *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VIN = VCC or GND MC74AC20, MC74ACT20 AC CHARACTERISTICS Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Min Typ Max Min Max tPLH Propagation Delay 3.3 5.0 2.0 1.5 6.0 5.0 8.5 7.0 1.5 1.0 10.0 8.0 ns tPHL Propagation Delay 3.3 5.0 1.5 1.5 5.0 4.0 7.0 6.0 1.0 1.0 9.0 7.0 ns *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V VOL Maximum Low Level Output Voltage V V IOUT = − 50 mA *VIN = VIL or VIH − 24 mA IOH − 24 mA IOUT = 50 mA *VIN = VIL or VIH 24 mA IOH 24 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 4.0 40 mA IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 3 VI = VCC, GND VIN = VCC or GND MC74AC20, MC74ACT20 AC CHARACTERISTICS Symbol VCC* (V) Parameter tPLH Propagation Delay tPHL Propagation Delay 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Unit Min Typ Max Min Max 5.0 2.0 6.5 9.0 1.5 10.5 ns 5.0 2.0 5.5 9.0 1.5 10.5 ns *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 40 pF VCC = 5.0 V ORDERING INFORMATION Device Package MC74AC20N PDIP−14 MC74AC20NG PDIP−14 (Pb−Free) MC74ACT20N PDIP−14 MC74ACT20NG PDIP−14 (Pb−Free) MC74AC20D SOIC−14 MC74AC20DG SOIC−14 (Pb−Free) MC74AC20DR2 SOIC−14 MC74AC20DR2G SOIC−14 (Pb−Free) MC74ACT20D SOIC−14 MC74ACT20DG SOIC−14 (Pb−Free) MC74ACT20DR2 SOIC−14 MC74ACT20DR2G SOIC−14 (Pb−Free) MC74AC20M SOEIAJ−14 MC74AC20MG SOEIAJ−14 (Pb−Free) MC74AC20MEL SOEIAJ−14 MC74AC20MELG SOEIAJ−14 (Pb−Free) http://onsemi.com 4 Shipping† 25 Units/Rail 55 Units/Rail 2500/Tape & Reel 55 Units/Rail 2500/Tape & Reel 50 Units/Rail 2000/Tape & Reel MC74AC20, MC74ACT20 MARKING DIAGRAMS PDIP−14 SOIC−14 14 14 MC74AC20N AWLYYWWG 1 14 74AC20 ALYW AC20G AWLYWW 1 1 14 14 MC74ACT20N AWLYYWWG 1 SOEIAJ−14 14 ACT20G AWLYWW 1 74ACT20 ALYW 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package http://onsemi.com 5 MC74AC20, MC74ACT20 PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B A F L N C −T− SEATING PLANE H G D 14 PL J K 0.13 (0.005) M M http://onsemi.com 6 DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 MC74AC20, MC74ACT20 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M 7 1 G −T− D 14 PL 0.25 (0.010) T B S A DIM A B C D F G J K M P R J M K M F R X 45 _ C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 MC74AC20, MC74ACT20 PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE A 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE M_ L 7 1 DETAIL P Z D VIEW P A e A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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