ONSEMI NLU1GT86AMX1TCG

NLU1GT86
Single 2-Input Exclusive OR
Gate, TTL Level
LSTTL-Compatible Inputs
The NLU1GT86 MiniGatet is an advanced CMOS high-speed
2-input Exclusive OR gate in ultra-small footprint.
The device input is compatible with TTL-type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT86 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
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MARKING
DIAGRAMS
UDFN6
MU SUFFIX
CASE 517AA
6M
ULLGA6
1.0 x 1.0
CASE 613AD
6M
ULLGA6
1.2 x 1.0
CASE 613AE
6M
ULLGA6
1.45 x 1.0
CASE 613AF
6M
1
Features
•High Speed: tPD = 3.1 ns (Typ) @ VCC = 5.0 V
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•TTL-Compatible Input: VIL = 0.8 V; VIH = 2.0 V
•CMOS-Compatible Output:
1
VOH > 0.8 VCC; VOL < 0.1 VCC @ Load
•Power Down Protection Provided on inputs
•Balanced Propagation Delays
•Ultra-Small Packages
•These are Pb-Free Devices
1
1
IN B
1
6
VCC
IN A
2
5
NC
6
M
= Device Marking
= Date Code
PIN ASSIGNMENT
GND
3
4
OUT Y
Figure 1. Pinout (Top View)
IN A
=1
IN B
1
IN B
2
IN A
3
GND
4
OUT Y
5
NC
6
VCC
FUNCTION TABLE
OUT Y
Input
Figure 2. Logic Symbol
Output
A
B
Y
L
L
H
H
L
H
L
H
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 2
1
Publication Order Number:
NLU1GT86/D
NLU1GT86
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
-0.5 to +7.0
V
VIN
DC Input Voltage
-0.5 to +7.0
V
DC Output Voltage
-0.5 to +7.0
V
VIN < GND
-20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
-65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V-0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
> 2000
> 150
N/A
V
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22-A114-A.
3. Tested to EIA / JESD22-A115-A.
4. Tested to JESD22-C101-A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
-55
+125
°C
0
0
100
20
ns/V
VOUT
TA
Operating Free-Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLU1GT86
DC ELECTRICAL CHARACTERISTICS
TA = 25 5C
Symbol
Parameter
Conditions
VCC (V)
Min
1.4
2.0
VIH
Low-Level Input
Voltage
3.0
4.5 to 5.5
VIL
Low-Level Input
Voltage
3.0
4.5 to 5.5
VOH
High-Level Output
Voltage
VOL
Low-Level Output
Voltage
Typ
Max
TA = +855C
TA = -555C
to +1255C
Min
Min
Max
1.4
2.0
0.53
0.8
VIN = VIH or VIL
IOH = -50 mA
3.0
4.5
2.9
4.4
3.0
4.5
VIN = VIH or VIL
IOH = -4 mA
IOH = -8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
0.0
0.0
Max
1.4
2.0
0.53
0.8
V
0.53
0.8
2.9
4.4
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Input Leakage
Current
0 v VIN v 5.5 V
0 to 5.5
±0.1
±1.0
±1.0
mA
ICC
Quiescent Supply
Current
0 v VIN v VCC
5.5
1.0
20
40
mA
ICCT
Quiescent Supply
Current
VIN = 3.4 V
5.5
1.35
1.50
1.65
mA
IOPD
Output Leakage
Current
VOUT = 5.5 V
0.0
0.5
5.0
10
mA
TA = +855C
TA = -555C
to +1255C
Min
Min
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
Parameter
VCC
(V)
Test
Condition
tPLH,
tPHL
Propagation Delay, Input A to
Output Y
3.0 to
3.6
4.5 to
5.5
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 6)
TA = 25 5C
Min
Typ
Max
CL = 15 pF
5.0
11.0
CL = 50 pF
6.2
CL = 15 pF
3.1
CL = 50 pF
5.0
Max
Unit
13.0
15.5
ns
14.5
16.5
19.5
6.8
6.0
10.0
4.2
8.8
10.0
12.0
5.5
10
10
10.0
11
Max
pF
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU1GT86
Input A or B
50% VCC
50%
GND
tPLH
tPHL
VOH
Output Y
50% VCC
VOL
Figure 3. Switching Waveforms
VCC
OUTPUT
INPUT
CL*
*Includes all probe and jig capacitance.
A 1-MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
UDFN6
(Pb-Free)
3000 / Tape & Reel
NLU1GT86AMX1TCG
ULLGA6, 1.45 x 1.0, 0.5P
(Pb-Free)
3000 / Tape & Reel
NLU1GT86BMX1TCG
ULLGA6, 1.2 x 1.0, 0.4P
(Pb-Free)
3000 / Tape & Reel
NLU1GT86CMX1TCG
ULLGA6, 1.0 x 1.0, 0.35P
(Pb-Free)
3000 / Tape & Reel
Device
NLU1GT86MUTCG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GT86
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE C
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
DETAIL B
Side View
(Optional)
A3
5X
5X
0.48
L
1.18
b
0.10 C A B
0.05 C
6X
0.22
3
L2
6X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6
4
0.53
e
NOTE 3
1
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NLU1GT86
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
6X
0.22
e
5X
L
NOTE 4
3
1
1.18
L1
0.53
6
4
6X
b
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
0.05 C
NOTE 3
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NLU1GT86
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.35
0.45
5X
0.49
e
5X
L
NOTE 4
3
1
6X
0.26
1.24
L1
0.53
6
4
6X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NLU1GT86
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
5X
C
A1
e
5X
L
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
0.49
NOTE 4
3
1
6X
0.30
1.24
L1
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
NOTE 3
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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8
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For additional information, please contact your local
Sales Representative
NLU1GT86/D