ONSEMI NLU3G14CMX1TCG

NLU3G14
Triple Schmitt-Trigger
Inverter
The NLU3G14 MiniGatet is an advanced high-speed CMOS
triple Schmitt-trigger inverter in ultra-small footprint.
The NLU3G14 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLU3G14 can be used to enhance noise immunity or to square
up slowly changing waveforms.
http://onsemi.com
MARKING
DIAGRAMS
Features
•High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•Power Down Protection Provided on inputs
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra-Small Packages
•These are Pb-Free Devices
IN A1
UDFN8
CASE 517AJ
UXM
G
AM
1
ULLGA8
1.45 x 1.0
CASE 613AA
1
ULLGA8
1.6 x 1.0
CASE 613AB
LAM
G
ULLGA8
1.95 x 1.0
CASE 613AC
LAM
G
1
VCC
8
1
8
OUT Y3
2
7
OUT Y1
IN A2
3
6
IN A3
GND
4
5
OUT Y2
1
UX, A or LA = Specific Device Code
M = Date Code
G
= Pb-Free Package
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
IN A1
1
IN A2
1
IN A3
1
OUT Y2
1
IN A1
2
OUT Y3
3
IN A2
4
GND
5
OUT Y2
6
IN A3
7
OUT Y1
8
VCC
OUT Y2
OUT Y3
Figure 2. Logic Symbol
FUNCTION TABLE
A
Y
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 2
1
Publication Order Number:
NLU3G14/D
NLU3G14
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
-0.5 to +7.0
V
VIN
DC Input Voltage
-0.5 to +7.0
V
DC Output Voltage
-0.5 to +7.0
V
VIN < GND
-20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
-65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
UL 94 V-0 @ 0.125 in
> 2000
> 200
N/A
V
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22-A114-A.
3. Tested to EIA / JESD22-A115-A.
4. Tested to JESD22-C101-A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
VOUT
TA
Operating Free-Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
http://onsemi.com
2
-55
+125
°C
0
0
No Limit
No Limit
ns/V
NLU3G14
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
TA = 25 5C
TA = +855C
VCC
(V)
Min
Typ
Max
Min
VT+
Positive
Threshold
Voltage
3.0
4.5
5.5
1.85
2.86
3.50
2.0
3.0
3.6
2.2
3.15
3.85
VT-
Negative
Threshold
Voltage
3.0
4.5
5.5
0.9
1.35
1.65
1.5
2.3
2.9
1.65
2.46
3.05
0.9
1.35
1.65
VH
Hysteresis
Voltage
3.0
4.5
5.5
0.30
0.40
0.50
0.57
0.67
0.74
1.20
1.40
1.60
0.30
0.40
0.50
VOH
Minimum
High-Level
Output
Voltage
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
3.0
4.5
2.58
3.94
VOL
Maximum
Low-Level
Output
Voltage
VIN v VT-MIN
IOH = -50 mA
VIN v VT-MIN
IOH = -4 mA
IOH = -8 mA
VIN w VT+MAX
IOL = 50 mA
VIN w VT+MAX
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
0
0
0
Max
TA = -555C to
+1255C
Min
2.2
3.15
3.85
Max
Unit
2.2
3.15
3.85
V
0.9
1.35
1.65
1.20
1.40
1.60
0.30
0.40
0.50
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
1.20
1.40
1.60
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Input
Leakage
Current
0 v VIN v 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Quiescent
Supply
Current
0 v VIN v VCC
5.5
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input A to Output Y
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 6)
VCC
(V)
Test
Condition
TA = 25 5C
Min
TA = +855C
Typ
Max
Min
TA = -555C to
+1255C
Max
Min
Max
Unit
ns
3.0 to
3.6
CL = 15 pF
7.0
12.8
1.0
15
1.0
17
CL = 50 pF
8.5
16.3
1.0
18.5
1.0
20.5
4.5 to
5.5
CL = 15 pF
4.0
8.6
1.0
10
1.0
11.5
CL = 50 pF
5.5
10.6
1.0
12
1.0
13.5
5.0
10
5.0
7.0
10
10
pF
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
http://onsemi.com
3
NLU3G14
OUTPUT
INPUT
VCC
A or B
50%
CL*
GND
tPLH
Y
tPHL
50% VCC
*Includes all probe and jig capacitance.
A 1-MHz square input wave is recommended for propagation delay tests.
Figure 3. Switching Waveforms
Figure 4. Test Circuit
VH
VCC
VT+
VT-
VIN
VCC
VH
VT+
VT-
VIN
GND
GND
VOH
VOH
VOUT
Vout
VOL
VOL
(a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times
(b) A Schmitt-Trigger Offers Maximum Noise Immunity
Figure 5. Typical Schmitt-Trigger Applications
ORDERING INFORMATION
Package
Shipping†
UDFN8
(Pb-Free)
3000 / Tape & Reel
NLU3G14AMX1TCG
ULLGA8, 1.95 x 1.0, 0.5P
(Pb-Free)
3000 / Tape & Reel
NLU3G14BMX1TCG
ULLGA8, 1.6 x 1.0, 0.4P
(Pb-Free)
3000 / Tape & Reel
NLU3G14CMX1TCG
ULLGA8, 1.45 x 1.0, 0.35P
(Pb-Free)
3000 / Tape & Reel
Device
NLU3G14MUTAG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
NLU3G14
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ-01
ISSUE O
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
ÉÉ
ÉÉ
L1
E
DETAIL A
NOTE 5
0.10 C
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
A1
e/2
e
(b2)
C
DETAIL A
8X
1
4
8
5
SEATING
PLANE
L
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
(L2)
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
8X b
8X
0.10
M
C A B
0.05
M
C
0.66
7X
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA-01
ISSUE A
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
A1
C
e
L
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
e/2
1
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
7X
0.48
NOTE 4
8X
0.22
4
L1
1.18
8
5
8X
b
0.53
0.10 C A B
BOTTOM VIEW
0.05 C
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
8X
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
SEATING
PLANE
SIDE VIEW
C
A1
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
e/2
0.49
e
1
7X
L
NOTE 4
8X
0.26
4
L1
1.24
8
5
8X
b
0.53
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
NLU3G14
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC-01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
7X
e/2
e
7X
L
0.49
NOTE 4
8X
0.30
4
1
L1
1.24
8
5
8X
BOTTOM VIEW
b
0.10 C A B
0.05 C
0.53
1
PKG
OUTLINE
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
http://onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NLU3G14/D