NCP565/NCV565 1.5 A Low Dropout Linear Regulator The NCP565/NCV565 low dropout linear regulator will provide 1.5 A at a fixed output voltage or an adjustable voltage down to 0.9 V. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage and good load transient response are important. Device protection includes current limit, short circuit protection, and thermal shutdown. Features • • • • • • • • • • MARKING DIAGRAMS D2PAK CASE 936 FIXED 1 Ultra Fast Transient Response (t1.0 ms) Low Ground Current (1.1 mA @ Iload = 1.5 A) Low Dropout Voltage (0.9 V @ Iload = 1.5 A) Low Noise (28 mVrms) 0.9 V Reference Voltage Adjustable Output Voltage from 7.7 V down to 0.9 V 1.2 V Fixed Output Version. Other Fixed Voltages Available on Request Current Limit Protection (3.5 A Typ) Thermal Shutdown Protection (160°C) Pb−Free Packages are Available Typical Applications • • • • http://onsemi.com Servers ASIC Power Supplies Post Regulation for Power Supplies Constant Current Source 2 3 NC P565D2Txx AWLYWWG Tab = Ground Pin 1. Vin 2. Ground 3. Vout 1 5 NC y565D2T AWLYWWG D2PAK CASE 936A ADJUSTABLE Tab = Ground Pin 1. N.C. 2. Vin 3. Ground 4. Vout 5. Adj xx y A WL Y WW G = 12 or 33 = P or V = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free P565 MNxx AYWWG G DFN6 CASE 506AX 1 xx = Voltage Rating AJ = Adjustible 12 = 1.2 V 33 = 3.3 V AYM 565yy G G SOT−223 CASE 318E 1 yy A Y WW M G = Voltage Rating 12 = 1.2 V = Assembly Location = Year = Work Week = Date Code = Pb−Free Package Tab = Vout Pin 1. Ground 2. Vout 3. Vin (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. © Semiconductor Components Industries, LLC, 2007 February, 2007 − Rev. 12 1 Publication Order Number: NCP565/D NCP565/NCV565 PIN DESCRIPTION D2PAK DFN6 SOT−223 Pin No. Adj. Version Pin No. Fixed Version Pin No. Adj. Version Pin No. Fixed Version Pin No. Fixed Version Symbol 1 − 1, 2 1, 2, 5 − N.C. 2 1 3 3 3 Vin 3, Tab 2, Tab 6 6 1 Ground 4 3 4 4 2, Tab Vout Regulated Output Voltage 5 − 5 − − Adj This pin is to be connected to the Rsense resistors on the output. The linear regulator will attempt to maintain 0.9 V between this pin and ground. Refer to Figure 1 for the equation. ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ Description − Positive Power Supply Input Voltage Power Supply Ground MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) Vin 9.0 V Output Pin Voltage Vout −0.3 to Vin + 0.3 V Adjust Pin Voltage Vadj −0.3 to Vin + 0.3 V Thermal Characteristics SOT−223 (Notes 2, 3) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin RqJA RqJP 107 12 Thermal Characteristics DFN6 3x3 (Notes 2, 3) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin RqJA RqJP 176 37 Thermal Characteristics D2PAK (5ld) (Notes 2, 3) Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin RqJC RqJA RqJP 3 105 4 Operating Junction Temperature Range TJ −40 to 150 °C Operating Ambient Temperature Range TA −40 to 125 °C Storage Temperature Range Tstg −55 to 150 °C °C/W °C/W °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A 2. The maximum package power dissipation is: TJ(max) * TA PD + RqJA 3. As measured using a copper heat spreading area of 50 mm2. http://onsemi.com 2 NCP565/NCV565 Vin C1 Voltage Reference Block Vin C1 Voltage Vref = 0.9 V Reference Output Block Stage Vref = 0.9 V Output Stage Vout 5.6 pF R1 R1 C2 C2 R2 ADJ R2 GND R1 + R2 ǒVVout * 1Ǔ ref Vout GND GND Figure 1. Typical Schematic, Adjustable Output Figure 2. Typical Schematic, Fixed Output http://onsemi.com 3 NCP565/NCV565 ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.3 V, Vout = 0.9 V, TJ = 25°C, Cin = Cout = 150 mF, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Reference Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −10 to 105°C) Vref 0.882 (−2%) 0.9 0.918 (+2%) V Reference Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −40 to 125°C) Vref 0.873 (−3%) 0.9 0.927 (+3%) V ADJ Pin Current IAdj − 30 − nA Line Regulation (Iout = 10 mA) Regline − 0.03 − % Load Regulation (10 mA < Iout < 1.5 A) ADJUSTABLE OUTPUT VERSION Regload − 0.03 − % Dropout Voltage (Iout = 1.5 A, Vout = 2.5 V) (Note 4) Vdo − 0.9 1.3 V Current Limit Ilim 1.6 3.5 − A Ripple Rejection (120 Hz; Iout = 1.5 A) RR − 85 − dB Ripple Rejection (1 kHz; Iout = 1.5 A) RR − 75 − dB IGND − 1.1 3.0 mA Vn − 28 − mVrms Ground Current (Iout = 1.0 mA to 1.5 A) Output Noise Voltage (f = 100 Hz to 100 kHz, Iout = 1.5 A) FIXED OUTPUT VOLTAGE (Vin = Vout + 1.3 V, TJ = 25°C, Cin = Cout = 150 mF, unless otherwise noted.) Output Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −10 to 105°C) 1.2 V version Vout 1.176 (−2%) 1.2 1.224 (+2%) V Output Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −40 to 125°C) 1.2 V version Vout 1.164 (−3%) 1.2 1.236 (+3%) V Output Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −10 to 105°C) 3.3 V version Vout 3.234 (−2%) 3.3 3.366 (+2%) V Output Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TJ = −40 to 125°C) 3.3 V version Vout 3.201 (−3%) 3.3 3.399 (+3%) V Line Regulation (Iout = 10 mA) Regline − 0.03 − % Load Regulation (10 mA < Iout < 1.5 A) Regload − 0.03 − % Dropout Voltage (Iout = 1.5 A, Vout = 2.5 V) (Note 4) Vdo − 0.9 1.3 V Current Limit Ilim 1.6 3.5 − A Ripple Rejection (120 Hz; Iout = 1.5 A) RR − 85 − dB Ripple Rejection (1 kHz; Iout = 1.5 A) RR − 75 − dB IGND − 1.1 3.0 mA Vn − 28 − mVrms Ground Current (Iout = 1.0 mA to 1.5 A) Output Noise Voltage (f = 100 Hz to 100 kHz, Iout = 1.5 A) 4. Dropout voltage is a measurement of the minimum input/output differential at full load. http://onsemi.com 4 NCP565/NCV565 TYPICAL CHARACTERISTICS 3.302 Vref, REFERENCE VOLTAGE (V) Vref, REFERENCE VOLTAGE (V) 0.9005 0.9000 0.8995 0.8990 0.8985 Vin = 2.5 V Vout = 0.9 V Cin = Cout = 150 mF 0.8980 0.8975 0.8970 −50 −25 0 25 50 75 100 125 3.300 3.298 3.296 3.294 3.292 Vin = 4.9 V Vout = 3.3 V Cin = Cout = 150 mF 3.290 3.288 −50 150 −25 Vin − Vout, DROPOUT VOLTAGE (V) ISC, SHORT CIRCUIT CURRENT LIMIT (A) 75 100 125 150 1.2 3.90 3.85 3.80 3.75 3.70 3.65 3.60 Vin = 2.5 V Vout = 0.9 V Cin = Cout = 150 mF 3.55 3.50 3.45 3.40 −25 0 25 50 75 100 125 1.0 Iout = 1.5 A 0.8 0.6 Iout = 50 mA 0.4 Cin = Cout = 150 mF 0.2 0 −50 150 TJ, JUNCTION TEMPERATURE (°C) −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 5. Short Circuit Current Limit vs. Temperature Figure 6. Dropout Voltage vs. Temperature 1.28 IGND, GROUND CURRENT (mA) 1.16 IGND, GROUND CURRENT (mA) 50 Figure 4. Output Voltage vs. Temperature Figure 3. Output Voltage vs. Temperature 1.14 1.12 1.10 1.08 1.06 Vin = 2.5 V Vout = 0.9 V Iout = 1.5 A Cin = Cout = 150 mF 1.04 1.02 1.00 0.98 0.96 −50 25 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) 3.35 −50 0 1.26 1.24 1.22 1.2 1.18 1.16 1.14 1.12 −25 0 50 100 25 75 125 TJ, JUNCTION TEMPERATURE (°C) 150 0 Figure 7. Ground Current vs. Temperature 300 600 900 1200 Iout, OUTPUT CURRENT (mA) 1500 Figure 8. Ground Current vs. Output Current http://onsemi.com 5 NCP565/NCV565 TYPICAL CHARACTERISTICS 100 1000 80 Unstable 70 100 60 ESR (W) RIPPLE REJECTION (dB) 90 50 40 10 Iout = 1.5 A 30 20 100 1000 10000 F, FREQUENCY (Hz) 0 100000 1000000 OUTPUT VOLTAGE DEVIATION (mV) 0 −10 Vin = 4.59 V Vout = 0.9 V −30 Iout, OUTPUT CURRENT (A) −40 1.50 1.00 0.50 0 0 50 100 150 200 250 500 750 300 350 0 Vin = 4.59 V Vout = 0.9 V −20 −30 −40 1.50 1.00 0.50 0 400 0 0.5 1.0 1.5 OUTPUT VOLTAGE DEVIATION (mV) 10 0 1.50 Iout, OUTPUT CURRENT (A) OUTPUT VOLTAGE DEVIATION (mV) Iout, OUTPUT CURRENT (A) Vin = 4.59 V Vout = 0.9 V 1.00 0.50 0 50 100 150 200 2.5 3.0 3.5 4.0 Figure 12. Load Transient from 10 mA to 1.5 A 40 0 2.0 TIME (ms) 50 −50 1500 −10 Figure 11. Load Transient from 10 mA to 1.5 A 20 1250 10 TIME (nS) 30 1000 Figure 10. Output Capacitor ESR Stability vs. Output Current 10 −20 250 OUTPUT CURRENT (mA) Figure 9. Ripple Rejection vs. Frequency OUTPUT VOLTAGE DEVIATION (mV) Cout = 10 mF 1 0 10 Iout, OUTPUT CURRENT (A) Vout = 3.3 V Stable 10 250 300 350 50 40 30 Vin = 4.59 V Vout = 0.9 V 20 10 0 1.50 1.00 0.50 400 TIME (nS) 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TIME (ms) Figure 13. Load Transient from 1.5 A to 10 mA Figure 14. Load Transient from 1.5 A to 10 mA http://onsemi.com 6 NCP565/NCV565 100 90 90 NOISE DENSITY (nVrms/ǰHz) 100 80 70 60 Vin = 3.0 V Vout = 0.9 V Iout = 10 mA 50 40 30 20 10 80 70 Vin = 3.0 V Vout = 0.9 V Iout = 1.5 A 60 50 40 30 20 10 0 Start 1.0 kHz 0 Start 1.0 kHz Stop 100 kHz FREQUENCY (kHz) Stop 100 kHz FREQUENCY (kHz) Figure 15. Noise Density vs. Frequency Figure 16. Noise Density vs. Frequency 1000 Unstable 100 ESR (W) NOISE DENSITY (nVrms/ǰHz) TYPICAL CHARACTERISTICS 10 Cout = 10 mF Fixed 3.3V Stable 1 0 250 500 750 1000 1250 1500 OUTPUT CURRENT (mA) Figure 17. Output Capacitor ESR Stability vs. Output Current http://onsemi.com 7 NCP565/NCV565 Adjustable Operation APPLICATION INFORMATION The typical application circuit for the adjustable output regulators is shown in Figure 1. The adjustable device develops and maintains the nominal 0.9 V reference voltage between Adj and ground pins. A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R1 that adds to the 0.9 V across R2 and sets the overall output voltage. The output voltage is set according to the formula: The NCP565 low dropout linear regulator provides adjustable voltages at currents up to 1.5 A. It features ultra fast transient response and low dropout voltage. These devices contain output current limiting, short circuit protection and thermal shutdown protection. Input, Output Capacitor and Stability An input bypass capacitor is recommended to improve transient response or if the regulator is located more than a few inches from the power source. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies and significantly enhance the output transient response. Different types and different sizes of input capacitors can be chosen dependent on the quality of power supply. A 150 mF OSCON 16SA150M type from Sanyo should be adequate for most applications. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. The output capacitor is required for stability. The NCP565 remains stable with ceramic, tantalum, and aluminum− electrolytic capacitors with a minimum value of 1.0 mF as long as the ESR remains between 50 mW and 2.5 W. The NCP565 is optimized for use with a 150 mF OSCON 16SA150M type in parallel with a 10 mF OSCON 10SL10M type from Sanyo. The 10 mF capacitor is used for best AC stability while 150 mF capacitor is used for achieving excellent output transient response. The output capacitors should be placed as close as possible to the output pin of the device. If not, the excellent load transient response of NCP565 will be degraded. Vout + Vref ) R2Ǔ * I ǒR1 R2 Adj The adjust pin current, Iadj, is typically 30 nA and normally much lower than the current flowing through R1 and R2, thus it generates a small output voltage error that can usually be ignored. Load Transient Measurement Large load current changes are always presented in microprocessor applications. Therefore good load transient performance is required for the power stage. NCP565 has the feature of ultra fast transient response. Its load transient responses in Figures 11 through 14 are tested on evaluation board shown in Figure 18. On the evaluation board, it consists of NCP565 regulator circuit with decoupling and filter capacitors and the pulse controlled current sink to obtain load current transitions. The load current transitions are measured by current probe. Because the signal from current probe has some time delay, it causes un−synchronization between the load current transition and output voltage response, which is shown in Figures 11 through 14. GEN Vout −VCC Vin Pulse R2 V NCP565 RL Evaluation Board GND + + GND Scope Voltage Probe Figure 18. Schematic for Transient Response Measurement http://onsemi.com 8 NCP565/NCV565 PCB Layout Considerations several capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close as possible to the load for the best results. The schematic of NCP565 typical application circuit, which this PCB layout is base on, is shown in Figure 19. The output voltage is set to 3.3 V for this demonstration board according to the feedback resistors in the Table 1. Good PCB layout plays an important role in achieving good load transient performance. Because it is very sensitive to its PCB layout, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figures below give an example of a layout where parasitic elements are minimized. For microprocessor applications it is customary to use an output capacitor network consisting of 2 Vin Vin Vout Vout 4 NCP565 C1 150 m C2 150 m 1 Adj NC 5 C4 10 m GND C3 150 m C3 150 m 3 GND GND R2 R1 15.8 k 42.2 k C6 5.6 p Figure 19. Schematic of NCP565 Typical Application Circuit Figure 20. Top Layer http://onsemi.com 9 NCP565/NCV565 Figure 21. Bottom Layer NCP565 ON Semiconductor www.onsemi.com D1 VIN R2 C2 R1C6 VOUT C4 C3 C1 C5 GND GND July, 2003 Figure 22. Silkscreen Layer Table 1. Bill of Materials for NCP565 Adj Demonstration Board Item Used # Component Designators Suppliers Part Number 1 4 Radial Lead Aluminum Capacitor 150 mF/16 V C1, C2, C3, C5 Sanyo Oscon 16SA150M 2 1 Radial Lead Aluminum Capacitor 10 mF/10 V C4 Sanyo Oscon 10SL10M 3 1 SMT Chip Resistor (0805) 15.8 K 1% R2 Vishay CRCW08051582F 4 1 SMT Chip Resistor (0805) 42.2 K 1% R1 Vishay CRCW08054222F 5 1 SMT Ceramic Capacitor (0603) 5.6 pF 10% C6 Vishay VJ0603A5R6KXAA 6 1 NCP565 Low Dropout Linear Regulator U1 ON Semiconductor NCP565D2TR4 http://onsemi.com 10 NCP565/NCV565 Protection Diodes Thermal Considerations When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which Vin drops. In the NCP565 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 23 is recommended. This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a substitute for proper heat sinking. The maximum device power dissipation can be calculated by: PD + TJ(max) * TA RqJA 200 180 Vout NCP565 C1 GND Vout Adj CAdj qJA (°C/W) Vin DFN 1 oz Cu DFN 2 oz Cu 160 1N4002 (Optional) Vin C2 R1 140 SOT−223 1 oz Cu 120 SOT−223 2 oz Cu D2PAK 1 oz Cu 100 D2PAK 2 oz Cu 80 R2 60 40 0 Figure 23. Protection Diode for Large Output Capacitors 50 100 150 200 250 300 350 400 450 500 COPPER HEAT−SPREADER AREA (mm sq) Figure 24. Thermal Resistance http://onsemi.com 11 NCP565/NCV565 ORDERING INFORMATION Device Nominal Output Voltage* D2PAK (Pb−Free) NCP565D2TG 50 Units / Tube D2PAK Adj NCP565D2TR4G D2PAK (Pb−Free) NCP565MNADJT2G DFN6 (Pb−Free) 800 / Tape & Reel 3000 / Tape & Reel D2PAK NCP565D2T12 NCP565D2T12G D2PAK (Pb−Free) NCP565D2T12R4 D2PAK NCP565D2T12R4G Shipping † D2PAK NCP565D2T NCP565D2TR4 Package D2PAK (Pb−Free) Fixed (1.2 V) 50 Units / Tube 800 / Tape & Reel NCP565MN12T2G DFN6 (Pb−Free) 3000 / Tape & Reel NCP565ST12T3G SOT−223 (Pb−Free) 4000 / Tape & Reel NCP565D2T33G D2PAK (Pb−Free) 50 Units / Tube D2PAK (Pb−Free) 800 / Tape & Reel DFN6 (Pb−Free) 3000 / Tape & Reel D2PAK (Pb−Free) 50 Units / Tube NCP565D2T33R4G Fixed (3.3 V) NCP565MN33T2G NCV565D2TG NCV565D2TR4G Adj 800 / Tape & Reel *For other fixed output versions, please contact the factory. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 12 NCP565/NCV565 PACKAGE DIMENSIONS D2PAK−3 D2T SUFFIX CASE 936−03 ISSUE B −T− K OPTIONAL CHAMFER A E U S B F 1 2 3 V H M J D 0.010 (0.254) M T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. TERMINAL 4 L P N G DIM A B C D E F G H J K L M N P R S U V R C SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN NCP565/NCV565 PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE C −T− OPTIONAL CHAMFER A TERMINAL 6 E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. V H 1 2 3 4 5 M D 0.010 (0.254) M T DIM A B C D E G H K L M N P R S U V P N G L R C INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 3.05 0.12 16.02 0.63 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches 5−LEAD D2PAK *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN NCP565/NCV565 PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L D b1 NOTES: 6. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7. CONTROLLING DIMENSION: INCH. 4 HE 1 2 3 E b e1 e 0.08 (0003) C q A DIM A A1 b b1 c D E e e1 L1 HE q A1 MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − L1 SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° NCP565/NCV565 PACKAGE DIMENSIONS DFN6, 3x3.3, 0.95 PITCH CASE 506AX−01 ISSUE O A D NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. B PIN 1 REFERENCE ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 2X E DIM A A1 A3 b D D2 E E2 e K L L1 0.15 C 2X 0.15 C TOP VIEW 0.10 C A 6X 0.08 C SEATING PLANE (A3) SIDE VIEW MILLIMETERS MIN NOM MAX 0.80 −−− 0.90 0.00 −−− 0.05 0.20 REF 0.30 −−− 0.40 3.00 BSC 1.90 −−− 2.10 3.30 BSC 1.10 −−− 1.30 0.95 BSC 0.20 −−− −−− 0.40 −−− 0.60 0.00 −−− 0.15 C A1 SOLDERING FOOTPRINT* D2 4X 6X 3.60 e L 1 K 3 1.35 6X 0.50 1 E2 2.15 6X L1 6 0.95 PITCH 4 6X BOTTOM VIEW b (NOTE 3) 0.10 C A B 6X 0.83 0.05 C DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. The product described herein (NCP565), may be covered by one or more of the following U.S. patents: 5,920,184; 5,834,926. 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