4 and 8-Channel ESD Protection Arrays in CSP CM1220 Features • • • • • • • • Four and eight channels of ESD protection TM OptiGuard coated for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Chip Scale Package (CSP) features extremely low lead inductance for optimum ESD protection 5 bump, 0.960mm X 1.330mm CSP footprint for CM1220-04 10 bump, 1.960mm X 1.330mm CSP footprint for CM1220-08 RoHS-compliant, lead-free version packaging Functional Description The CM1220 ESD protection arrays are available in four and eight channel configurations. Each ESD channel features a nominal capacitance of 14pF making the devices ideal for protecting high speed I/O ports and LCD and camera data lines without significantly affecting signal integrity. The CM1220 integrates avalanche-type ESD diodes on every channel, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC61000-4-2 international Applications standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the • • • • • • LCD and camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. Keypads and buttons Wireless handsets Handheld PCs/PDAs LCD and camera modules CM1220 protect against contact discharges at greater than ±30kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easy-touse pin assignments. In particular, the CM1220 is ideal for protecting high speed I/O ports and data and control lines for the LCD display and camera interface in mobile handsets. The CM1220 incorporates CMD’s OptiGuard TM coating for improved reliability at assembly in a space-saving, lowprofile Chip Scale Package. Block Diagram ©2010 SCILLC. All rights reserved. March 2010 – Rev.2 Publication Order Number: CM1220/D CM1220 Pin Configurations Top View (Bumps Down) Bottom View (Bumps Up) CM1220-04 5-Bump CSP Package With OptiGuardTM Top View (Bumps Down) Bottom View (Bumps Up) CM1220-08 10-Bump CSP Package With OptiGuardTM Note: 1). These drawings are not to scale. Rev.2 | Page 2 of 10 | www.onsemi.com CM1220 Pin Descriptions CM1220-08 CM1220-04 PINS NAME PINS NAME A1 ESD1 A1 ESD1 A3 ESD2 A3 A5 ESD3 A7 B2 CM1220-08 DESCRIPTION CM1220-04 DESCRIPTION PINS NAME PINS NAME ESD Channel C1 ESD5 C1 ESD3 ESD Channel ESD2 ESD Channel C3 ESD6 C3 ESD4 ESD Channel − − ESD Channel C5 ESD7 − − ESD Channel ESD4 − − ESD Channel C7 ESD8 − − ESD Channel GND B2 GND Device Ground B6 GND − − Device Ground Ordering Information 1 Bumps Package Ordering Part Number Part Marking 5 CSP CM1220-04CP J 10 CSP CM1220-08CP L208 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Absolute Maximum Ratings PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C RATING UNITS -40 to +85 °C Standard Operating Conditions PARAMETER Operating Temperature Range Rev. 2 | Page 3 of 10 | www.onsemi.com CM1220 Electrical Operating Characteristics (see Note 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 11 14 17 pF CDIODE Diode (Channel) Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC VDIODE Diode Standoff Voltage IDIODE = 10µA 6.0 ILEAK Diode Leakage Current VIN = +3.3V (reverse bias voltage) 0.1 1 µA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp IDIODE = 10mA 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Note 2 VESD RDYN 5.6 -1.5 Dynamic Resistance Positive Negative kV kV ±30 ±15 2.3 0.9 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. Performance Information Capacitance (Normalized) Diode Characteristics (nominal conditions unless specified otherwise) Figure 1. Insertion Loss Vs. Frequency (0V Bias) Rev.2 | Page 4 of 10 | www.onsemi.com V Ω Ω CM1220 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous (183ûC) Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 2. Recommended Non-Solder Mask Defined Pad Illustration Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 5 of 10 | www.onsemi.com 60 seconds 260°C CM1220 Mechanical Specifications The CM1220 is supplied in custom Chip Scale Packages (CSP) depending on the channel count. Dimensions for these packages are presented in the following pages. CM1220-04CP Mechanical Specifications Package Specifications Package Custom CSP Bumps 5 Dim Millimeters Min Nom Max Inches Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1220-04CP Chip Scale 3500 pieces Controlling dimension: millimeters Rev.2 | Page 6 of 10 | www.onsemi.com Package CM1220 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1220-04 1.33 X 0.96 X 0.644 1.42 X 1.07 X 0.740 8mm 178mm (7") 3500 4mm 4mm Rev. 2 | Page 7 of 10 | www.onsemi.com CM1220 CM1220-08CP Mechanical Specifications Package Specifications Package Custom CSP Bumps 10 Dim Millimeters Min Nom Max Inches Min Nom Max A1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 0.091 0.0110 Package Dimensions for CM1220-08CP Chip Scale 3500 pieces Controlling dimension: millimeters Rev.2 | Page 8 of 10 | www.onsemi.com Package CM1220 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1220-08 1.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.08 X 1.45 X 0.740 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Rev. 2 | Page 9 of 10 | www.onsemi.com CM1220 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email [email protected] N. American Technical Support: Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev.2 | Page 10 of 10 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative