ONSEMI NBXSBA024LN1TAG

NBXSBA024, NBXSBB024,
NBXMBA024
2.5 V / 3.3 V, 622.08 MHz
LVPECL Clock Oscillator
The single frequency, crystal oscillator (XO) is designed to meet
today’s requirements for 2.5 V / 3.3 V LVPECL clock generation
applications. The device uses a high Q fundamental crystal and Phase
Lock Loop (PLL) multiplier to provide 622.08 MHz, ultra low jitter
and phase noise LVPECL differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Frequency stability options available as either ±50 PPM
NBXSBA024/NBXMBA024 (Industrial Temperature Range) or
±20 PPM NBXSBB024 (Commercial Temperature Range).
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000 and 100.
Features
•
•
•
•
•
•
•
•
•
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise − 0.5 ps (12 kHz − 20 MHz)
Output Frequency − 622.08 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range: 2.5 V ±5% or 3.3 V ±10%
Total Frequency Stability − ±20 PPM; ±50 PPM
This is a Pb−Free Device
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MARKING DIAGRAM
6 PIN CLCC
LN SUFFIX
CASE 848AB
NBXSBx024 = Specific Device Code
x
= A or B
y
= S or M
= NBXSBA024 (±50 PPM)
= NBXSBB024 (±20 PPM)
622.0800
= Output Frequency (MHz)
AA
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NBXSBA024LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXSBB024LN1TAG*
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXSBA024LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
NBXMBA024LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXMBA024LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
Applications
• SONET Line Card
• Networking
• Optical Systems
VDD
6
CLK CLK
5 4
PLL
Clock
Multiplier
Crystal
1
OE
NC*
2
NC
OE*
NBXyBx024
622.0800
AAWLYYWWG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Please contact sales office for availability
3
GND
*NBXMBA024 device pintout
Figure 1. Simplified Logic Diagram
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 3
1
Publication Order Number:
NBXSBA024/D
NBXSBA024, NBXSBB024, NBXMBA024
OE
1
6
VDD
NC
1
6
VDD
NC
2
5
CLK
OE
2
5
CLK
GND
3
4
CLK
GND
3
4
CLK
NBXSxxxxx
NBXMxxxxx
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Pin No.
Symbol
I/O
Description
1
OE/NC*
LVTTL/LVCMOS
Control Input
2
NC/OE*
N/A
No Connect.
3
GND
Power Supply
Ground 0 V
4
CLK
LVPECL Output
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
5
CLK
LVPECL Output
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
6
VDD
Power Supply
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
Positive power supply voltage. Voltage should not exceed 2.5 V ±5% or 3.3 V ±10%.
*NBXMBA024 device pinout
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
OE Pin
Output Pins
Open
Active
HIGH Level
Active
LOW Level
High Z
Table 3. ATTRIBUTES
Characteristic
Value
Internal Default State Resistor
ESD Protection
170 kW
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD
Positive Power Supply
GND = 0 V
4.6
V
Iout
LVPECL Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−55 to +120
°C
Tsol
Wave Solder
260
°C
See Figure 5
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
NBXSBA024, NBXSBB024, NBXMBA024
Table 5. DC CHARACTERISTICS (VDD = 2.5 V ± 5%; 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 2)
Characteristic
Symbol
Conditions
Min.
Typ.
Max.
Units
95
105
mA
IDD
Power Supply Current
VIH
OE Input HIGH Voltage
2000
VDD
mV
VIL
OE Input LOW Voltage
GND − 300
800
mV
IIH
Input HIGH Current
OE
−100
+100
mA
IIL
Input LOW Current
OE
−100
+100
mA
VOH
Output HIGH Voltage
VDD−1195
VDD−945
mV
VOL
Output LOW Voltage
VDD−1945
VDD−1600
mV
VOUTPP
Output Voltage Amplitude
700
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 W to VDD − 2.0 V. See Figure 4.
Table 6. AC CHARACTERISTICS (VDD = 2.5 V ± 5%; 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Characteristic
Symbol
fCLKOUT
Df
FNOISE
Conditions
Min.
Output Clock Frequency
Frequency Stability NBXSBB024
NBXSBA024, NBXMBA024
Phase−Noise Performance
fCLKout = 622.08 MHz
(See Figure 3)
Typ.
Max.
622.08
0°C to +70°C
−40°C to +85°C
(Note 4)
Units
MHz
±20
±50
ppm
100 Hz of Carrier
−88
dBc/Hz
1 kHz of Carrier
−108
dBc/Hz
10 kHz of Carrier
−115
dBc/Hz
100 kHz of Carrier
−116
dBc/Hz
1 MHz of Carrier
−122
dBc/Hz
10 MHz of Carrier
−149
dBc/Hz
12 kHz to 20 MHz
0.5
0.7
ps
tjit(F)
RMS Phase Jitter
tjitter
Cycle to Cycle, RMS
1000 Cycles
1.5
8
ps
Cycle to Cycle, Peak−to−Peak
1000 Cycles
15
30
ps
tOE/OD
tDUTY_CYCLE
Period, RMS
10,000 Cycles
1
4
ps
Period, Peak−to−Peak
10,000 Cycles
10
20
ps
200
ns
50
55
%
Output Enable/Disable Time
Output Clock Duty Cycle
(Measured at Cross Point)
45
tR
Output Rise Time (20% and 80%)
250
400
ps
tF
Output Fall Time (80% and 20%)
250
400
ps
1
5
ms
3
ppm
1
ppm
tstart
Start−up Time
Aging
1st
Year
Every Year After
1st
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 W to VDD − 2.0 V. See Figure 4.
4. Parameter guarantee 10 years aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
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3
NBXSBA024, NBXSBB024, NBXMBA024
Figure 3. Typical Phase Noise Plot
Table 7. RELIABILITY COMPLIANCE
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Parameter
Standard
Method
Shock
Mechanical
MIL−STD−833, Method 2002, Condition B
Solderability
Mechanical
MIL−STD−833, Method 2003
Vibration
Mechanical
MIL−STD−833, Method 2007, Condition A
Solvent Resistance
Mechanical
MIL−STD−202, Method 215
Thermal Shock
Environment
MIL−STD−833, Method 1011, Condition A
Moisture Level Sensitivity
Environment
MSL1 260°C per IPC/JEDEC J−STD−020D
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4
NBXSBA024, NBXSBB024, NBXMBA024
NBXSBA024
Zo = 50 W
Q
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VDD − 2.0 V
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
temp. 260°C
20 − 40 sec. max.
peak
Temperature (°C)
260
6°C/sec. max.
3°C/sec. max.
217
ramp−up
175
150
cooling
pre−heat
reflow
60180 sec.
Time
60150 sec.
Figure 5. Recommended Reflow Soldering Profile
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5
NBXSBA024, NBXSBB024, NBXMBA024
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
A
D
4X
D1
0.15 C
E2
TERMINAL 1
INDICATOR
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
H E1
DIM
A
A1
A2
A3
b
D
D1
D2
D3
E
E1
E2
E3
e
H
L
R
E
D2
TOP VIEW
A2
A3
0.10 C
A
SIDE VIEW
A1
C
6.17
6.66
4.37
4.65
1.17
SOLDERING FOOTPRINT*
3
2
e
6X
R
1.50
E3
0.10 C A B
0.05 C
0.08
1.30
MILLIMETERS
NOM
MAX
1.80
1.90
0.70 REF
0.36 REF
0.10
0.12
1.40
1.50
7.00 BSC
6.20
6.23
6.81
6.96
5.08 BSC
5.00 BSC
4.40
4.43
4.80
4.95
3.49 BSC
2.54 BSC
1.80 REF
1.27
1.37
0.70 REF
SEATING
PLANE
D3
1
MIN
1.70
6X
b
6
5
4
6X
5.06
L
BOTTOM VIEW
2.54
PITCH
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PureEdge is a trademark of Semiconductor Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NBXSBA024/D