NBXDBA012 3.3 V, 106.25 MHz / 212.5 MHz LVPECL Clock Oscillator The NBXDBA012 dual frequency crystal oscillator (XO) is designed to meet today's requirements for 3.3V LVPECL clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide selectable 106.25 MHz or 212.5 MHz, ultra low jitter and phase noise LVPECL differential output. This device is a member of ONSemiconductor's PureEdget clock family that provides accurate and precision clock solutions. Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1,000. Features •LVPECL Differential Output •Uses High Q Fundamental Mode Crystal and PLL Multiplier •Ultra Low Jitter and Phase Noise - 0.4 ps (12 kHz - 20 MHz) •Selectable Output Frequency - 106.25 MHz / 212.5 MHz •Frequency Stability - ±50 PPM •Hermetically Sealed Ceramic SMD Package •RoHS Compliant •Operating Range 3.3 V ±10% •This is a Pb-Free Device Applications •1X and 2X Fiber Channel •Host Bus Adapter VDD 6 http://onsemi.com MARKING DIAGRAM 6 PIN CLCC TBD SUFFIX CASE 848AB DBA012 A WL YY WW DBA012 AWLYYWW = NBXDBA012 (±50 PPM) = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping† NBXDBA012LN1TAG CLCC-6 1000/Tape & Reel (Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. CLK CLK 5 4 PLL Clock Multiplier Crystal 1 OE 2 FSEL 3 GND Figure 1. Simplified Logic Diagram © Semiconductor Components Industries, LLC, 2007 August, 2007 - Rev. 0 1 Publication Order Number: NBXDBA012/D NBXDBA012 OE 1 6 VDD FSEL 2 5 CLK GND 3 4 CLK Figure 2. Pin Connections (Top View) Table 1. PIN DESCRIPTION Pin No. Symbol I/O Description 1 OE LVTTL/LVCMOS Control Input Output Enable Pin. When left floating pin defaults to logic HIGH and output is active. See OE pin description Table 2. 2 FSEL LVTTL/LVCMOS Control Input Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output Frequency Select pin description Table 3. 3 GND Power Supply 4 CLK LVPECL Output Non-Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to VTT = VDD - 2 V. 5 CLK LVPECL Output Non-Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to VTT = VDD - 2 V. 6 VDD Power Supply Ground 0 V. Positive power supply voltage. Voltage should not exceed 3.3 V ±10%. Table 2. OUTPUT ENABLE TRI-STATE FUNCTION Table 3. OUTPUT FREQUENCY SELECT OE Pin Output Pin FSEL Pin Output Frequency (MHz) Open Active Open (pin will float high) 106.25 HIGH Level 106.25 LOW Level 212.5 HIGH Level Active LOW Level High Z Table 4. ATTRIBUTES Characteristic ESD Protection Value Human Body Model Machine Model 2 kV 200 V Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test 1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D. Table 5. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units VDD Positive Power Supply GND = 0 V 4.6 V Iout LVPECL Output Current Continuous Surge 25 50 mA TA Operating Temperature Range -40 to +85 °C Tstg Storage Temperature Range -55 to +120 °C Tsol Wave Solder 260 °C See Figure 6 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 NBXDBA012 Table 6. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = -40°C to +85°C) Symbol Characteristic Conditions Min. Typ. Max. Units 80 95 mA IDD Power Supply Current (Note 2) VIH OE and FSEL Input HIGH Voltage 2000 VDD mV VIL OE and FSEL Input LOW Voltage GND - 300 800 mV IIH Input HIGH Current OE FSEL -100 -100 +100 +100 mA IIL Input LOW Current OE FSEL -100 -100 +100 +100 mA VDD-1145 2155 VDD-895 2405 mV VDD = 3.3 V VDD-1945 1355 VDD-1600 1700 mV VDD = 3.3 V VOH VOL VOUTPP Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Output Voltage Amplitude (Note 2) 780 mV NOTE: NBX circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained. 2. Measurement taken with outputs terminated with 50 ohm to VDD-2 V. Table 7. AC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = -40°C to +85°C) Symbol Characteristic fCLKOUT Output Clock Frequency Df FNOISE Frequency Stability Phase-Noise Performance fCLKout = 106.25 MHz/212.5 MHz Conditions Min. Typ. FSEL = HIGH 106.25 FSEL = LOW 212.5 Max. MHz ±50 10 Years Aging Units ppm 100 Hz of Carrier -103/-90 dBc/Hz 1 kHz of Carrier -125/-122 dBc/Hz 10 kHz of Carrier -135/-127 dBc/Hz 100 kHz of Carrier -137/-128 dBc/Hz 1 MHz of Carrier -137/-131 dBc/Hz 10 MHz of Carrier -162/-159 dBc/Hz 12 kHz to 20 MHz 0.4 0.9 ps tjit(F) RMS Phase Jitter tjitter Cycle to Cycle, RMS 1000 Cycles 3 10 ps Cycle to Cycle, Peak-to-Peak 1000 Cycles 15 35 ps Period, RMS 10,000 Cycles 2 5 ps Period, Peak-to-Peak 10,000 Cycles 10 25 ps 200 ns 50 52 % tOE/OD tDUTY_CYCLE Output Enable/Disable Time Output Clock Duty Cycle (Measured at Cross Point) 48 tR Output Rise Time (20% and 80%) 150 550 ps tF Output Fall Time (80% and 20%) 150 550 ps 1 5 ms 3 ppm 1 ppm tstart Start-up Time Aging 1st Year Every Year After 1st NOTE: NBX circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained. http://onsemi.com 3 NBXDBA012 Table 8. RELIABILITY COMPLIANCE ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Parameter Standard Method Shock Mechanical MIL-STD-833, Method 2002, Condition B Solderability Mechanical MIL-STD-833, Method 2003 Vibration Mechanical MIL-STD-833, Method 2007, Condition A Solvent Resistance Mechanical MIL-STD-202, Method 215 Resistance to Soldering Heat Mechanical MIL-STD-203, Method 210, Condition I or J Thermal Shock Environment MIL-STD-833, Method 1001, Condition A Moisture Resistance Environment MIL-STD-833, Method 1004 Figure 3. Typical Phase Noise Plot @ 106.25 MHz Figure 4. Typical Phase Noise Plot @ 212.5 MHz Figure 5. Typical Output Waveform @ 106.25 MHz Figure 6. Typical Output Waveform @ 212.5 MHz http://onsemi.com 4 NBXDBA012 NBXDBA012 Zo = 50 W CLK D Receiver Device Driver Device Zo = 50 W CLK D 50 W 50 W VTT VTT = VDD - 2.0 V Figure 7. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) temp. 260°C 20 - 40 sec. max. peak Temperature (°C) 260 6°C/sec. max. 3°C/sec. max. 217 ramp-up 175 150 cooling pre-heat reflow Time 60180 sec. 60150 sec. Figure 8. Recommended Reflow Soldering Profile http://onsemi.com 5 NBXDBA012 PACKAGE DIMENSIONS 6 PIN CLCC, 7x5, 2.54P CASE 848AB-01 ISSUE O A D 4X 0.15 C E2 TERMINAL 1 INDICATOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. B D1 DIM A A1 A2 A3 b D D1 D2 D3 E E1 E2 E3 e L R E E1 D2 TOP VIEW A3 A2 0.10 C A SIDE VIEW A1 C SEATING PLANE MIN 1.70 0.08 1.30 6.17 6.66 4.37 4.65 1.17 MILLIMETERS NOM MAX 1.80 1.90 0.70 REF 0.36 REF 0.10 0.12 1.40 1.50 7.00 BSC 6.20 6.23 6.81 6.96 5.08 BSC 5.00 BSC 4.40 4.43 4.80 4.95 3.49 BSC 2.54 BSC 1.27 1.37 0.70 REF SOLDERING FOOTPRINT* D3 e 2 1 3 6X 1.50 R 5.06 E3 0.10 C A B 0.05 C 6X 6 5 4 b 6X L 2.54 PITCH BOTTOM VIEW 6X 1.50 DIMENSION: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NBXDBA012/D