LINER LTC3112

LTC3129
15V, 200mA Synchronous
Buck-Boost DC/DC Converter
with 1.3µA Quiescent Current
Description
Features
Regulates VOUT Above, Below or Equal to VIN
n Wide V Range: 2.42V to 15V, 1.92V to 15V After
IN
Start-Up (Bootstrapped)
n Wide V
OUT Range: 1.4V to 15.75V
n 200mA Output Current in Buck Mode
n Single Inductor
n 1.3µA Quiescent Current
n Programmable Maximum Power Point Control
n 1.2MHz Ultralow Noise PWM
n Current Mode Control
n Pin Selectable Burst Mode® Operation
n Up to 95% Efficiency
n Accurate RUN Pin Threshold
n Power Good Indicator
n 10nA Shutdown Current
n Thermally Enhanced 3mm × 3mm QFN and
16-Lead MSOP Packages
The LTC®3129 is a high efficiency, 200mA buck-boost
DC/DC converter with a wide VIN and VOUT range. It includes
an accurate RUN pin threshold to allow predictable regulator turn-on and a maximum power point control (MPPC)
capability that ensures maximum power extraction from
non-ideal power sources such as photovoltaic panels.
n
The LTC3129 employs an ultralow noise, 1.2MHz PWM
switching architecture that minimizes solution footprint by
allowing the use of tiny, low profile inductors and ceramic
capacitors. Built-in loop compensation and soft-start
simplify the design. For high efficiency operation at light
loads, automatic Burst Mode operation can be selected,
reducing the quiescent current to just 1.3µA.
Additional features include a power good output, less than
10nA of shutdown current and thermal shutdown.
The LTC3129 is available in thermally enhanced 3mm ×
3mm QFN and 16-lead MSOP packages. For fixed output
voltage options, see the functionally equivalent LTC3129-1,
which eliminates the need for an external feedback divider.
Applications
n
n
n
n
n
n
Industrial Wireless Sensor Nodes
Post-Regulator for Harvested Energy
Solar Panel Post-Regulator/Charger
Intrinsically Safe Power Supplies
Wireless Microphones
Avionics-Grade Wireless Headsets
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
and PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners.
Typical Application
BST1 SW1
2.42V TO 15V
VIN
Efficiency and Power Loss vs Load
22nF
10µH
SW2 BST2
5V AT 200mA, VIN > 5V
5V AT 100mA, VIN < 5V
VOUT
VOUT
VIN
10pF
3.32M
10µF
VCC
MPPC
FB
PGOOD
PWM
1.02M
PGND
EFFICIENCY
100
80
70
60
50
40
10
POWER LOSS
1
30
VIN = 2.5V
0.1
VIN = 3.6V
=
5V
V
10
IN
VIN = 15V
VOUT = 5V
0
0.01
0.01
0.1
1
10
100
1000
OUTPUT CURRENT (mA)
20
VCC
GND
90
POWER LOSS (mW)
10µF
LTC3129
RUN
1000
100
EFFICIENCY (%)
22nF
2.2µF
3129 TA01b
3129 TA01a
3129f
For more information www.linear.com/3129
1
LTC3129
Absolute Maximum Ratings
(Notes 1, 8)
VIN, VOUT Voltages ..................................... –0.3V to 18V
SW1 DC Voltage............................. –0.3V to (VIN + 0.3V)
SW2 DC Voltage..........................–0.3V to (VOUT + 0.3V)
SW1, SW2 Pulsed (<100ns) Voltage...............–1V to 19V
BST1 Voltage ..................... (SW1 – 0.3V) to (SW1 + 6V)
BST2 Voltage .....................(SW2 – 0.3V) to (SW2 + 6V)
RUN, PGOOD Voltages................................ –0.3V to 18V
VCC, FB, PWM, MPPC Voltages..................... –0.3V to 6V
PGOOD Sink Current ..............................................15mA
Operating Junction Temperature Range
(Notes 2, 5)............................................. –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
MSE Lead Temperature (Soldering, 10 sec)........... 300°C
Pin Configuration
BST2
SW2
PGND
SW1
TOP VIEW
TOP VIEW
16 15 14 13
VCC
RUN
MPPC
GND
FB
NC
NC
PWM
12 VOUT
BST1 1
VIN 2
11 PGOOD
17
PGND
VCC 3
10 PWM
RUN 4
6
7
8
MPPC
GND
FB
NC
9
5
NC
1
2
3
4
5
6
7
8
17
PGND
16
15
14
13
12
11
10
9
VIN
BST1
SW1
PGND
SW2
BST2
VOUT
PGOOD
MSE PACKAGE
16-LEAD PLASTIC MSOP
TJMAX = 125°C, θJC = 10°C/W, θJA = 40°C/W (NOTE 6)
EXPOSED PAD (PIN 17) IS PGND, MUST BE SOLDERED TO PCB
UD PACKAGE
16-LEAD (3mm × 3mm) PLASTIC QFN
TJMAX = 125°C, θJC = 7.5°C/W, θJA = 68°C/W (NOTE 6)
EXPOSED PAD (PIN 17) IS PGND, MUST BE SOLDERED TO PCB
Order Information
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3129EUD#PBF
LTC3129EUD#TRPBF
LGDR
16-Lead (3mm × 3mm) Plastic QFN
–40°C to 125°C
LTC3129IUD#PBF
LTC3129IUD#TRPBF
LGDR
16-Lead (3mm × 3mm) Plastic QFN
–40°C to 125°C
LTC3129EMSE#PBF
LTC3129EMSE#TRPBF
3129
16-Lead Plastic MSOP
–40°C to 125°C
LTC3129IMSE#PBF
LTC3129IMSE#TRPBF
3129
16-Lead Plastic MSOP
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3129f
2
For more information www.linear.com/3129
LTC3129
Electrical
Characteristics
The
l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). Unless otherwise noted, VIN = 12V, VOUT = 5V.
PARAMETER
CONDITIONS
VIN Start-Up Voltage
MIN
l
Input Voltage Range
VCC > 2.42V (Back-Driven)
l
1.92
VIN UVLO Threshold (Rising)
VCC > 2.42V (Back-Driven)
TYP
MAX
UNITS
2.25
2.42
V
15
V
l
1.8
1.9
2.0
V
VIN UVLO Hysteresis
l
80
100
130
mV
Output Voltage Adjust Range
l
1.4
15.75
V
Feedback Voltage
l
1.151
1.175
1.199
V
Feedback Input Current
FB = 1.25V
0.1
10
nA
Quiescent Current (VIN) – Shutdown
RUN = 0V, Including Switch Leakage
10
100
nA
Quiescent Current (VIN) UVLO
Either VIN or VCC Below Their UVLO Threshold, or
RUN Below the Threshold to Enable Switching
1.9
3
µA
Quiescent Current – Burst Mode Operation
Measured on VIN , FB > 1.25V
PWM = 0V, RUN = VIN
1.3
2.0
µA
N-Channel Switch Leakage on VIN and VOUT
SW1 = 0V, VIN = 15V
SW2 = 0V, VOUT = 15V
RUN = 0V
10
50
nA
N-Channel Switch On-Resistance
VCC = 4V
Inductor Average Current Limit
VOUT > UV Threshold (Note 4)
VOUT < UV Threshold (Note 4)
l
l
220
80
275
130
350
200
mA
mA
Inductor Peak Current Limit
(Note 4)
l
400
500
680
mA
Maximum Boost Duty Cycle
FB = 1.10V. Percentage of Period SW2 is Low in
Boost Mode (Note 7)
l
85
89
95
%
Minimum Duty Cycle
FB = 1.25V. Percentage of Period SW1 is High in
Buck Mode (Note 7)
l
0
%
Switching Frequency
PWM = VCC
l
1.0
1.2
SW1 and SW2 Minimum Low Time
(Note 3)
l
1.12
1.175
1.22
V
1
10
nA
MPPC Voltage
MPPC Input Current
VCC > 2.4V
0.5
0.9
1.15
V
1.22
1.28
V
50
80
120
mV
1
10
nA
1.6
V
l
PWM = 5V
0.1
Soft-Start Time
0.5
V
1
µA
3
VCC Voltage
VIN > 4.85V
VCC Dropout Voltage (VIN – VCC)
VIN = 3.0V, Switching
VIN = 2.0V (VCC in UVLO)
VCC UVLO Threshold (Rising)
l
3.4
ms
4.1
4.7
V
35
0
60
2
mV
mV
2.42
l
2.1
2.25
l
4
20
VCC UVLO Hysteresis
VCC Current Limit
ns
1.16
l
PWM Input Low
PWM Input Current
60
VCC = 0V
VCC Back-Drive Voltage (Maximum)
VCC = 5.5V (Switching)
VCC Leakage to VIN if VCC > VIN
VCC = 5.5V, VIN = 1.8V, Measured on VIN
VOUT UV Threshold (Rising)
2
4
–7
l
0.95
1.15
V
mV
40
5.5
l
VCC Input Current (Back-Driven)
MHz
l
RUN = 15V
PWM Input High
1.4
l
RUN (Switching) Threshold Hysteresis
RUN Input Current
Ω
90
MPPC = 5V
RUN Threshold to Enable VCC
RUN Threshold to Enable Switching (Rising)
0.75
mA
V
mA
µA
1.35
V
3129f
For more information www.linear.com/3129
3
LTC3129
Electrical
Characteristics
The
l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). Unless otherwise noted, VIN = 12V, VOUT = 5V.
PARAMETER
CONDITIONS
MIN
TYP
VOUT UV Hysteresis
MAX
UNITS
150
VOUT Current – Shutdown
RUN = 0V, VOUT = 15V Including Switch Leakage
VOUT Current – Sleep
PWM = 0V, FB = 1.25V
VOUT Current – Active
PWM = VCC, VOUT = 15V (Note 4), FB = 1.25V
10
mV
100
nA
5
9
µA
–7.5
–10
%
VOUT/27
PGOOD Threshold, Falling
Referenced to Programmed VOUT Voltage
PGOOD Hysteresis
Referenced to Programmed VOUT Voltage
2.5
PGOOD Voltage Low
ISINK = 1mA
250
300
mV
PGOOD Leakage
PGOOD = 15V
1
50
nA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3129 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3129E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3129I is guaranteed over the full –40°C to 125°C operating junction
temperature range. The junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) according to the
formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal
impedance. Note that the maximum ambient temperature consistent
with these specifications, is determined by specific operating conditions
in conjunction with board layout, the rated thermal package thermal
resistance and other environmental factors.
Note 3: Specification is guaranteed by design and not 100% tested in
production.
Efficiency, VOUT = 3.3V
1000
90
100
90
BURST
70
60
50
PWM
40
30
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
20
10
0.1
1
100
10
OUTPUT CURRENT (mA)
1000
3129 G01
10
1
BURST
0.1
0.01
0.01
0.1
BURST
80
PWM
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
1
100
10
OUTPUT CURRENT (mA)
1000
3129 G02
EFFICIENCY (%)
100
POWER LOSS (mW)
80
EFFICIENCY (%)
TA = 25°C, unless otherwise noted.
Power Loss, VOUT = 2.5V
Efficiency, VOUT = 2.5V
100
%
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a much higher thermal resistance.
Note 7: Switch timing measurements are made in an open-loop test
configuration. Timing in the application may vary somewhat from these
values due to differences in the switch pin voltage during non-overlap
durations when switch pin voltage is influenced by the magnitude and
duration of the inductor current.
Note 8: Voltage transients on the switch pin(s) beyond the DC limits
specified in the Absolute Maximum Ratings are non-disruptive to normal
operation when using good layout practices as described elsewhere in the
data sheet and application notes and as seen on the product demo board.
Typical Performance Characteristics
0
0.01
–5.5
µA
70
60
50
PWM
40
30
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
20
10
0
0.01
0.1
1
100
10
OUTPUT CURRENT (mA)
1000
3129 G03
3129f
4
For more information www.linear.com/3129
LTC3129
Typical Performance Characteristics
Power Loss, VOUT = 3.3V
100
1000
Efficiency, VOUT = 5V
10
1
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
BURST
1
100
10
OUTPUT CURRENT (mA)
60
50
PWM
40
30
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
20
10
0
0.01
1000
0.1
1
100
10
OUTPUT CURRENT (mA)
Efficiency, VOUT = 12V
PWM
40
30
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
20
10
0
0.01
0.1
1
100
10
OUTPUT CURRENT (mA)
POWER LOSS (mW)
EFFICIENCY (%)
60
250
0.01
0.01
BURST
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
0.1
0.1
1
100
10
OUTPUT CURRENT (mA)
1
100
10
OUTPUT CURRENT (mA)
1000
3129 G10
60
50
PWM
40
30
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
20
10
0
0.01
1000
0.1
1
100
10
OUTPUT CURRENT (mA)
Maximum Output Current
vs VIN and VOUT
30
150
100
50
0
VOUT = 2.5V
VOUT = 3.3V
VOUT = 4.1V
VOUT = 5V
VOUT = 6.9V
VOUT = 8.2V
VOUT = 12V
VOUT = 15V
2 3 4 5 6 7 8 9 10 11 12 13 14 15
VIN (V)
3129 G11
1000
3129 G09
200
IOUT (mA)
POWER LOSS (mW)
PWM
0.1
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
70
3129 G08
1000
1
80
BURST
1
0.01
0.01
Power Loss, VOUT = 15V
1000
BURST
90
PWM
0.1
1000
10
1
100
10
OUTPUT CURRENT (mA)
Efficiency, VOUT = 15V
10
3129 G07
100
0.1
100
100
70
VIN = 2.5V
VIN = 3.6V
VIN = 5V
VIN = 10V
VIN = 15V
BURST
3129 G06
Power Loss, VOUT = 12V
80
50
1
0.01
0.01
1000
1000
BURST
40
90
10
3129 G05
3129 G04
100
PWM
0.1
EFFICIENCY (%)
0.1
70
IIN (µA)
0.01
0.01
Power Loss, VOUT = 5V
100
POWER LOSS (mW)
EFFICIENCY (%)
POWER LOSS (mW)
80
PWM
0.1
1000
BURST
90
100
TA = 25°C, unless otherwise noted.
No Load Input Current
vs VIN and VOUT (PWM = 0V)
25
VOUT = 2.5V
VOUT = 5V
VOUT = 10V
VOUT = 15V
20
FB DIVIDER CURRENT = 2µA
15
10
5
0
2.5
4.5
6.5
8.5 10.5
VIN (V)
12.5
14.5
3129 G12
3129f
For more information www.linear.com/3129
5
LTC3129
Typical Performance Characteristics
1.2
70
1.1
50
40
VOUT = 2.5V
VOUT = 3.3V
VOUT = 4.1V
VOUT = 5V
VOUT = 6.9V
VOUT = 8.2V
VOUT = 12V
VOUT = 15V
30
20
10
0
2
4
6
8
10
VIN (V)
12
14
0.9
0.8
0.7
0.6
0.4
–45
16
0
–1
–20
5
30
55
80
TEMPERATURE (°C)
105
5
30
55
80
TEMPERATURE (°C)
–0.50
–1.00
–45
–20
5
30
55
80
TEMPERATURE (°C)
70
60
50
40
30
20
10
0
1.13 1.135 1.14 1.145 1.15 1.155 1.16 1.165 1.17
MPPC PIN VOLTAGE (V)
50
50
40
40
10
5
0
–5
–10
–15
–45
–20
5
30
55
80
TEMPERATURE (°C)
5
30
55
80
TEMPERATURE (°C)
105
130
3129 G19
105
130
3129 G18
Fixed Frequency PWM
Waveforms
SW2
5V/DIV
SW1
5V/DIV
30
IL
200mA/DIV
20
10
–20
130
15
VCC Dropout Voltage vs VIN
(PWM Mode, Switching)
60
105
3129 G15
3129 G17
DROPOUT (mV)
DROPOUT (mV)
–0.25
Maximum Output Current
vs Temperature (Normalized to 25°C)
80
60
0
–45
130
90
VCC Dropout Voltage vs Temperature
(PWM Mode, Switching)
10
105
100
3129 G16
20
0
Average Input Current Limit
vs MPPC Voltage
130
30
0.25
3129 G14
PERCENTAGE OF FULL INPUT CURRENT (%)
1
–2
–45
–20
3129 G13
2
0.50
–0.75
0.5
Accurate RUN Threshold
vs Temperature (Normalized to 25°C)
CHANGE IN RUN THRESHOLD (%)
0.75
1.0
RDS(ON) (Ω)
LOAD (mA)
60
1.00
VCC = 2.5V
VCC = 3V
VCC = 4V
VCC = 5V
CHANGE IN FB VOLTAGE (%)
1.3
FB Voltage vs Temperature
(Normalized to 25°C)
Switch RDS(ON) vs Temperature
CHANGE IN MAXIMUM OUTPUT CURRENT (%)
80
Burst Mode Threshold
vs VIN and VOUT
TA = 25°C, unless otherwise noted.
0
2
2.25 2.5 2.75
3 3.25 3.5 3.75
VIN (V)
4
L = 10µH
VIN = 7V
VOUT = 5V
IOUT = 200mA
500ns/DIV
3129 G21
3129 G20
3129f
6
For more information www.linear.com/3129
LTC3129
Typical Performance Characteristics
Fixed Frequency Ripple on VOUT
TA = 25°C, unless otherwise noted.
Burst Mode Ripple on VOUT
Burst Mode Waveforms
SW1
5V/DIV
VOUT
20mV/DIV
VOUT
100mV/DIV
SW2
5V/DIV
IL
200mA/DIV
IL
200mA/DIV
L = 10µH
VIN = 7V
VOUT = 5V
IOUT = 200mA
COUT = 10µF
200ns/DIV
IL
100mA/DIV
3129 G22
L = 10µH
VIN = 7V
VOUT = 5V
IOUT = 5mA
COUT = 22µF
3129 G23
50µs/DIV
VOUT
5V/DIV
VOUT
100mV/DIV
VCC
5V/DIV
RUN
5V/DIV
VOUT
100mV/DIV
IVOUT
100mA/DIV
IVIN
200mA/DIV
1ms/DIV
Step Load Transient Response in
Burst Mode Operation
Step Load Transient Response in
Fixed Frequency
Start-Up Waveforms
VIN = 7V
VOUT = 5V
IOUT = 50mA
COUT = 22µF
3129 G24
100µs/DIV
L = 10µH
VIN = 7V
VOUT = 5V
IOUT = 5mA
COUT = 22µF (WITH THE RECOMMENDED
FEEDFORWARD CAPACITOR)
3129 G25
IVOUT
100mA/DIV
3129 G26
500µs/DIV
L = 10µH
VIN = 7V
VOUT = 5V
COUT = 10µF
IOUT = 50mA to 150mA STEP
PGOOD Response to a Drop
On VOUT
3129 G27
500µs/DIV
L = 10µH
VIN = 7V
VOUT = 5V
COUT = 22µF (WITH THE RECOMMENDED
FEEDFORWARD CAPACITOR)
IOUT = 5mA to 125mA STEP
MPPC Response to a Step Load
VOUT
2V/DIV
PGOOD
2V/DIV
VIN
2V/DIV
VOUT
2V/DIV
IVOUT
100mA/DIV
VOUT = 5V
1ms/DIV
3129 G28
2ms/DIV
VIN = 5VOC
VMPPC SET TO 3.5V
CIN = 22µF, RIN = 10Ω,
VOUT = 5V, COUT = 22µF
IOUT = 25mA to 125mA STEP
3129 G29
3129f
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7
LTC3129
Pin Functions
(QFN/MSOP)
BST1 (Pin 1/Pin 15): Bootstrapped Floating Supply for
High Side NMOS Gate Drive. Connect to SW1 through a
22nF capacitor, as close to the part as possible. The value
is not critical. Any value from 4.7nF to 47nF may be used.
VIN (Pin 2/Pin 16): Input Voltage for the Converter. Connect
a minimum of 4.7µF ceramic decoupling capacitor from
this pin to the ground plane, as close to the pin as possible.
VCC (Pin 3/Pin 1): Output voltage of the internal voltage
regulator. This is the supply pin for the internal circuitry.
Bypass this output with a minimum of 2.2µF ceramic
capacitor close to the pin. This pin may be back-driven
by an external supply, up to a maximum of 5.5V.
RUN (Pin 4/Pin 2): Input to the Run Comparator. Pull this
pin above 1.1V to enable the VCC regulator and above 1.28V
to enable the converter. Connecting this pin to a resistor
divider from VIN to ground allows programming a VIN
start threshold higher than the 1.8V (typical) VIN UVLO
threshold. In this case, the typical VIN turn-on threshold is
determined by VIN = 1.22V • [1+(R3/R4)] (see Figure 2).
MPPC (Pin 5/Pin 3): Maximum Power Point Control Programming Pin. Connect this pin to a resistor divider from
VIN to ground to enable the MPPC functionality. If the VOUT
load is greater than what the power source can provide,
the MPPC will reduce the inductor current to regulate VIN
to a voltage determined by: VIN = 1.175V • [1+(R5/R6)]
(see Figure 3). By setting the VIN regulation voltage appropriately, maximum power transfer from the limited source
is assured. Note this pin is very noise sensitive, therefore
minimize trace length and stray capacitance. Please refer
to the Applications Information section for more detail
on programming the MPPC for different sources. If this
function is not needed, tie the pin to VCC.
GND (Pin 6/Pin 4): Signal Ground. Provide a short direct
PCB path between GND and the ground plane where the
exposed pad is soldered.
FB (Pin 7/Pin 5): Feedback Input to the Error Amplifier.
Connect to a resistor divider from VOUT to ground. The
output voltage can be adjusted from 1.4V to 15.75V by:
VOUT = 1.175V • [1+(R1/R2)]. Note this pin is very noise
sensitive, therefore minimize trace length and stray capacitance.
NC (Pins 8, 9/Pins 6, 7): Unused. These pins should be
grounded.
PWM (Pin 10/Pin 8): Mode Select Pin.
PWM = Low (ground): Enables automatic Burst Mode
operation.
PWM = High (tie to VCC): Fixed frequency PMW operation.
This pin should not be allowed to float. It has an internal
5M pull-down resistor.
PGOOD (Pin 11/Pin 9): Open drain output that pulls to
ground when FB drops too far below its regulated voltage. Connect a pull-up resistor from this pin to a positive
supply. This pin can sink up to the absolute maximum
rating of 15mA when low. Note that this pin is forced low
in shutdown or VCC UVLO.
VOUT (Pin 12/Pin 10): Output voltage of the converter.
Connect a minimum value of 4.7µF ceramic capacitor from
this pin to the ground plane, as close to the pin as possible.
BST2 (Pin 13/Pin 11): Bootstrapped floating supply for
high side NMOS gate drive. Connect to SW2 through a
22nF capacitor, as close to the part as possible. The value
is not critical. Any value from 4.7nF to 47nF may be used.
SW2 (Pin 14/Pin 12): Switch Pin. Connect to one side of
the inductor. Keep PCB trace lengths as short and wide
as possible to reduce EMI.
PGND (Pin 15, Exposed Pad Pin 17/Pin 13, Exposed
Pad Pin 17): Power Ground. Provide a short direct PCB
path between PGND and the ground plane. The exposed
pad must also be soldered to the PCB ground plane. It
serves as a power ground connection, and as a means of
conducting heat away from the die.
SW1 (Pin 16/Pin 14): Switch Pin. Connect to one side of
the inductor. Keep PCB trace lengths as short and wide
as possible to reduce EMI.
3129f
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LTC3129
Block Diagram
BST1
VIN
SW2
LDO
START
4.1V
VCC_GD
DRIVER
A
DRIVER
B
VOUT
START
VCC
1.175V
VREF
VREF
0.9V
+
–
1.22V
+
–
NC
ISENSE
C
START
SD
DRV_C
DRV_A
DRV_D
+
–
ISENSE
1.175V
–
+
ISENSE
20mA
RESET
MPPC
1.175V
–
+
UV
ILIM
FB
1.1V
LOGIC
ENABLE
UVLO
NC
DRIVER
DRV_B
500mA
–
+
DRIVER
D
VREF_GD
RUN
VOUT
VCC
ISENSE
VIN
BST2
VCC
VREF
VCC
SW1
IZERO
THERMAL
SHUTDOWN
ISENSE
PWM
VC
–
+
+
–
+
–
VIN
1.175V
SOFT-START
OSC
+
–
–
+
PWM
5M
100mV
–
+
600mV
SLEEP
GND
PGOOD
CLAMP
–7.5%
–
+
PGND
3129 BD
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9
LTC3129
Operation
Introduction
Pwm Mode Operation
The LTC3129 is a 1.3µA quiescent current, monolithic, current mode, buck-boost DC/DC converter that can operate
over a wide input voltage range of 1.92V to 15V and provide
up to 200mA to the load. Internal, low RDS(ON) N-channel
power switches reduce solution complexity and maximize
efficiency. A proprietary switch control algorithm allows the
buck-boost converter to maintain output voltage regulation
with input voltages that are above, below or equal to the
output voltage. Transitions between the step-up or stepdown operating modes are seamless and free of transients
and sub-harmonic switching, making this product ideal
for noise sensitive applications. The LTC3129 operates
at a fixed nominal switching frequency of 1.2MHz, which
provides an ideal trade-off between small solution size and
high efficiency. Current mode control provides inherent
input line voltage rejection, simplified compensation and
rapid response to load transients.
If the PWM pin is high or if the load current on the converter
is high enough to command PWM mode operation with
PWM low, the LTC3129 operates in a fixed 1.2MHz PWM
mode using an internally compensated average current
mode control loop. PWM mode minimizes output voltage
ripple and yields a low noise switching frequency spectrum. A proprietary switching algorithm provides seamless transitions between operating modes and eliminates
discontinuities in the average inductor current, inductor
ripple current and loop transfer function throughout all
modes of operation. These advantages result in increased
efficiency, improved loop stability and lower output voltage
ripple in comparison to the traditional buck-boost converter.
Burst Mode capability is also included in the LTC3129 and
is user-selected via the PWM input pin. In Burst Mode
operation, the LTC3129 provides exceptional efficiency at
light output loading conditions by operating the converter
only when necessary to maintain voltage regulation. The
Burst Mode quiescent current is a miserly 1.3µA. At higher
loads, the LTC3129 automatically switches to fixed frequency PWM mode when Burst Mode operation is selected.
(Please refer to the Typical Performance Characteristics
curves for the mode transition point at different input and
output voltages.) If the application requires extremely low
noise, continuous PWM operation can also be selected
via the PWM pin.
Figure 1 shows the topology of the LTC3129 power stage
which is comprised of four N-channel DMOS switches
and their associated gate drivers. In PWM mode operation
both switch pins transition on every cycle independent of
the input and output voltages. In response to the internal
control loop command, an internal pulse width modulator
generates the appropriate switch duty cycle to maintain
regulation of the output voltage.
CBST1
BST1
CBST2
L
VIN
SW1
BST2
SW2 VOUT
VCC
VCC
A
D
VCC
A MPPC (maximum power point control) function is also
provided that allows the input voltage to the converter to
be servo'd to a programmable point for maximum power
when operating from various non-ideal power sources
such as photovoltaic cells. The LTC3129 also features
an accurate RUN comparator threshold with hysteresis,
allowing the buck-boost DC/DC converter to turn on and
off at user-selected VIN voltage thresholds. With a wide
voltage range, 1.3µA Burst Mode current and programmable RUN and MPPC pins, the LTC3129 is well suited
for many diverse applications.
VCC
B
PGND
C
PGND
LTC3129
3129 F01
Figure 1. Power Stage Schematic
3129f
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LTC3129
Operation
When stepping down from a high input voltage to a lower
output voltage, the converter operates in buck mode and
switch D remains on for the entire switching cycle except
for the minimum switch low duration (typically 90ns). During the switch low duration, switch C is turned on which
forces SW2 low and charges the flying capacitor, CBST2.
This ensures that the switch D gate driver power supply
rail on BST2 is maintained. The duty cycle of switches A
and B are adjusted to maintain output voltage regulation
in buck mode.
If the input voltage is lower than the output voltage, the
converter operates in boost mode. Switch A remains on
for the entire switching cycle except for the minimum
switch low duration (typically 90ns). During the switch
low duration, switch B is turned on which forces SW1
low and charges the flying capacitor, CBST1. This ensures
that the switch A gate driver power supply rail on BST1 is
maintained. The duty cycle of switches C and D are adjusted
to maintain output voltage regulation in boost mode.
Oscillator
The LTC3129 operates from an internal oscillator with a
nominal fixed frequency of 1.2MHz. This allows the DC/DC
converter efficiency to be maximized while still using small
external components.
Current Mode Control
The LTC3129 utilizes average current mode control for the
pulse width modulator. Current mode control, both average
and the better known peak method, enjoy some benefits
compared to other control methods including: simplified
loop compensation, rapid response to load transients and
inherent line voltage rejection.
Referring to the Block Diagram, a high gain, internally
compensated transconductance amplifier monitors Vout
through a voltage divider connected to the FB pin. The
error amplifier output is used by the current mode control
loop to command the appropriate inductor current level.
The inverting input of the internally compensated average
current amplifier is connected to the inductor current
sense circuit. The average current amplifier's output is
compared to the oscillator ramps, and the comparator
outputs are used to control the duty cycle of the switch
pins on a cycle-by-cycle basis.
The voltage error amplifier monitors the output voltage,
VOUT through a voltage divider and makes adjustments to
the current command as necessary to maintain regulation.
The voltage error amplifier therefore controls the outer
voltage regulation loop. The average current amplifier
makes adjustments to the inductor current as directed by
the voltage error amplifier output via VC and is commonly
referred to as the inner current loop amplifier.
The average current mode control technique is similar to
peak current mode control except that the average current
amplifier, by virtue of its configuration as an integrator,
controls average current instead of the peak current. This
difference eliminates the peak to average current error
inherent to peak current mode control, while maintaining
most of the advantages inherent to peak current mode
control.
Average current mode control requires appropriate compensation for the inner current loop, unlike peak current
mode control. The compensation network must have high
DC gain to minimize errors between the actual and commanded average current level, high bandwidth to quickly
change the commanded current level following transient
load steps and a controlled mid-band gain to provide a
form of slope compensation unique to average current
mode control. The compensation components required
to ensure proper operation have been carefully selected
and are integrated within the LTC3129.
Inductor Current Sense and Maximum Output Current
As part of the current control loop required for current
mode control, the LTC3129 includes a pair of current
sensing circuits that measure the buck-boost converter
inductor current.
The voltage error amplifier output, VC, is internally clamped
to a nominal level of 0.6V. Since the average inductor
current is proportional to VC, the 0.6V clamp level sets
the maximum average inductor current that can be programmed by the inner current loop. Taking into account
the current sense amplifier's gain, the maximum average
3129f
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11
LTC3129
Operation
inductor current is approximately 275mA (typical). In
Buck mode, the output current is approximately equal to
the inductor current IL.
IOUT(BUCK) ≈ IL • 0.89
The 90ns SW1/SW2 forced low time on each switching
cycle briefly disconnects the inductor from VOUT and VIN
resulting in about 11% less output current in either buck
or boost mode for a given inductor current. In boost mode,
the output current is related to average inductor current
and duty cycle by:
IOUT(BOOST) ≈ IL • (1 – D) • Efficiency,
where D is the converter duty cycle.
Since the output current in boost mode is reduced by the
duty cycle (D), the output current rating in buck mode is
always greater than in boost mode. Also, because boost
mode operation requires a higher inductor current for a
given output current compared to buck mode, the efficiency
in boost mode will be lower due to higher IL² • RDS(ON)
losses in the power switches. This will further reduce the
output current capability in boost mode. In either operating
mode, however, the inductor peak-to-peak ripple current
does not play a major role in determining the output current capability, unlike peak current mode control.
With peak current mode control, the maximum output
current capability is reduced by the magnitude of inductor
ripple current because the peak inductor current level is the
control variable, but the average inductor current is what
determines the output current. The LTC3129 measures
and controls average inductor current, and therefore, the
inductor ripple current magnitude has little effect on the
maximum current capability in contrast to an equivalent
peak current mode converter. Under most conditions in
buck mode, the LTC3129 is capable of providing a minimum of 200mA to the load. In boost mode, as described
previously, the output current capability is related to the
boost ratio or duty cycle (D). For example, for a 3.6V VIN
to 5V output application, the LTC3129 can provide up
to 150mA to the load. Refer to the Typical Performance
characteristics section for more detail on output current
capability.
Overload Current Limit and IZERO Comparator
The internal current sense waveform is also used by the
peak overload current (IPEAK) and zero current (IZERO) comparators. The IPEAK current comparator monitors Isense
and turns off switch A if the inductor current level exceeds
its maximum internal threshold, which is approximately
500mA. An inductor current level of this magnitude will
occur during a fault, such as an output short-circuit, or
during large load or input voltage transients.
The LTC3129 features near discontinuous inductor current
operation at light output loads by virtue of the IZERO comparator circuit. By limiting the reverse current magnitude
in PWM mode, a balance between low noise operation and
improved efficiency at light loads is achieved. The IZERO
comparator threshold is set near the zero current level in
PWM mode, and as a result, the reverse current magnitude
will be a function of inductance value and output voltage
due to the comparator's propagation delay. In general,
higher output voltages and lower inductor values will
result in increased reverse current magnitude.
In automatic Burst Mode operation (PWM pin low), the
IZERO comparator threshold is increased so that reverse
inductor current does not normally occur. This maximizes
efficiency at very light loads.
Burst Mode Operation
When the PWM pin is held low, the LTC3129 is configured
for automatic Burst Mode operation. As a result, the buckboost DC/DC converter will operate with normal continuous PWM switching above a predetermined minimum
output load and will automatically transition to power
saving Burst Mode operation below this output load level.
Note that if the PWM pin is low, reverse inductor current is
not allowed at any load. Refer to the Typical Performance
Characteristics section to determine the Burst Mode
transition threshold for various combinations of VIN and
VOUT. If PWM is low, at light output loads, the LTC3129
will go into a standby or sleep state when the output voltage achieves its nominal regulation level. The sleep state
halts PWM switching and powers down all non-essential
3129f
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LTC3129
Operation
functions of the IC, significantly reducing the quiescent
current of the LTC3129 to just 1.3µA typical. This greatly
improves overall power conversion efficiency when the
output load is light. Since the converter is not operating
in sleep, the output voltage will slowly decay at a rate
determined by the output load resistance and the output
capacitor value. When the output voltage has decayed by
a small amount, typically 1%, the LTC3129 will wake and
resume normal PWM switching operation until the voltage on VOUT is restored to the previous level. If the load
is very light, the LTC3129 may only need to switch for a
few cycles to restore VOUT and may sleep for extended
periods of time, significantly improving efficiency. If the
load is suddenly increased above the burst transition
threshold, the part will automatically resume continuous
PWM operation until the load is once again reduced.
logic threshold. The VCC regulator includes current-limit
protection to safeguard against accidental short-circuiting
of the VCC rail.
A feedforward capacitor on the feedback divider can be
used to reduce Burst Mode VOUT ripple. This is discussed
in more detail in the Applications Information section of
this data sheet.
The VCC UVLO has a falling voltage threshold of 2.19V
(typical). If the VCC voltage falls below this threshold, IC
operation is disabled until VCC rises above 2.25V (typical)
as long as VIN is above its nominal UVLO threshold level.
Note that Burst Mode operation is inhibited until soft-start
is done, the MPPC pin is greater than 1.175V and VOUT
has reached regulation.
Depending on the particular application, either of these
UVLO thresholds could be the limiting factor affecting the
minimum input voltage required for operation. Because the
VCC regulator uses VIN for its power input, the minimum
input voltage required for operation is determined by the
VCC minimum voltage, as input voltage (VIN) will always
be higher than VCC in the normal (non-bootstrapped)
configuration. Therefore, the minimum VIN for the part
to startup is 2.25V (typical).
Soft-Start
The LTC3129 soft-start circuit minimizes input current
transients and output voltage overshoot on initial power up.
The required timing components for soft-start are internal
to the LTC3129 and produce a nominal soft-start duration of approximately 3ms. The internal soft-start circuit
slowly ramps the error amplifier output, VC. In doing so,
the current command of the IC is also slowly increased,
starting from zero. It is unaffected by output loading or
output capacitor value. Soft-start is reset by the UVLO on
both VIN and VCC, the RUN pin and thermal shutdown.
Undervoltage Lockout (UVLO)
There are two undervoltage lockout (UVLO) circuits within
the LTC3129 that inhibit switching; one that monitors VIN
and another that monitors VCC. Either UVLO will disable
operation of the internal power switches and keep other
IC functions in a reset state if either VIN or VCC are below
their respective UVLO thresholds.
The VIN UVLO comparator has a falling voltage threshold
of 1.8V (typical). If VIN falls below this level, IC operation
is disabled until VIN rises above 1.9V (typical), as long as
the VCC voltage is above its UVLO threshold.
VCC Regulator
In applications where VCC is bootstrapped (powered
through a Schottky diode by either VOUT or an auxiliary
power rail), the minimum input voltage for operation will
be limited only by the VIN UVLO threshold (1.8V typical).
Please note that if the bootstrap voltage is derived from
the LTC3129 VOUT and not an independent power rail, then
the minimum input voltage required for initial startup is
still 2.25V (typical).
An internal low dropout regulator (LDO) generates a nominal 4.1V VCC rail from VIN. The VCC rail powers the internal
control circuitry and the gate drivers of the LTC3129. The
VCC regulator is disabled in shutdown to reduce quiescent
current and is enabled by raising the RUN pin above its
Note that if either VIN or VCC are below their UVLO thresholds, or if RUN is below its accurate threshold of 1.22V
(typical), then the LTC3129 will remain in a soft shutdown
state, where the VIN quiescent current will be only 1.9µA
typical.
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13
LTC3129
Operation
VOUT Undervoltage
There is also an undervoltage comparator that monitors
the output voltage. Until VOUT reaches 1.15V (typical), the
average current limit is reduced by a factor of two. This
reduces power dissipation in the device in the event of a
shorted output. In addition, N-channel switch D, which
feeds VOUT, will be disabled until VOUT exceeds 1.15V.
RUN Pin Comparator
With the addition of an optional resistor divider as shown
in Figure 2, the RUN pin can be used to establish a userprogrammable turn-on and turn-off threshold. This feature
can be utilized to minimize battery drain below a certain
input voltage, or to operate the converter in a hiccup mode
from very low current sources.
LTC3129
VIN
In addition to serving as a logic level input to enable certain functions of the IC, the RUN pin includes an accurate
internal comparator that allows it to be used to set custom
rising and falling ON/OFF thresholds with the addition of
an optional external resistor divider. When RUN is driven
above its logic threshold (0.9V typical), the VCC regulator
is enabled, which provides power to the internal control
circuitry of the IC. If the voltage on RUN is increased further
so that it exceeds the RUN comparator's accurate analog
threshold (1.22V typical), all functions of the buck-boost
converter will be enabled and a start-up sequence will ensue,
assuming the VIN and VCC UVLO thresholds are satisfied.
If RUN is brought below the accurate comparator threshold,
the buck-boost converter will inhibit switching, but the VCC
regulator and control circuitry will remain powered unless
RUN is brought below its logic threshold. Therefore, in
order to completely shut down the IC and reduce the Vin
current to 10nA (typical), it is necessary to ensure that
RUN is brought below its worst case low logic threshold of
0.5V. RUN is a high voltage input and can be tied directly
to VIN to continuously enable the IC when the input supply
is present. Also note that RUN can be driven above VIN
or VOUT as long as it stays within the operating range of
the IC (up to 15V).
1.22V
R3
–
+
ACCURATE THRESHOLD
ENABLE SWITCHING
RUN
R4
0.9V
+
–
ENABLE LDO AND
CONTROL CIRCUITS
LOGIC THRESHOLD
3129 F02
Figure 2. Accurate RUN Pin Comparator
Note that once RUN is above 0.9V typical, the quiescent
input current on VIN (or VCC if back-driven) will increase to
about 1.9µA typical until the VIN and VCC UVLO thresholds
are satisfied.
The converter is enabled when the voltage on RUN exceeds
1.22V (nominal). Therefore, the turn-on voltage threshold
on VIN is given by:
VIN(TURN-ON) = 1.22V • (1 + R3/R4)
The RUN comparator includes a built-in hysteresis of
approximately 80mV, so that the turn off threshold will
be 1.14V.
There may be cases due to PCB layout, very large value
resistors for R3 and R4, or proximity to noisy components
where noise pickup may cause the turn-on or turn-off of the
IC to be intermittent. In these cases, a small filter capacitor can be added across R4 to ensure proper operation.
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LTC3129
Operation
PGOOD Comparator
The LTC3129 provides an open-drain PGOOD output that
pulls low if VOUT falls more than 7.5% (typical) below its
programmed value. When VOUT rises to within 5% (typical)
of its programmed value, the internal PGOOD pull-down
will turn off and PGOOD will go high if an external pullup resistor has been provided. An internal filter prevents
nuisance trips of PGOOD due to short transients on VOUT.
Note that PGOOD can be pulled up to any voltage, as long
as the absolute maximum rating of 18V is not exceeded,
and as long as the maximum sink current rating is not
exceeded when PGOOD is low. Note that PGOOD will
also be driven low if VCC is below its UVLO threshold or
if the part is in shutdown (RUN below its logic threshold)
while VCC is being held up (or back-driven). PGOOD is
not affected by VIN UVLO or the accurate RUN threshold.
Maximum Power-Point Control (MPPC)
The MPPC input of the LTC3129 can be used with an
optional external voltage divider to dynamically adjust
the commanded inductor current in order to maintain
*CIN
RS
–
MPPC
VSOURCE
VIN(MPPC) = 1.175V • (1 + R5/R6)
Note that external compensation should not be required
for MPPC loop stability if input filter capacitor, CIN, is at
least 22µF.
The divider resistor values can be in the MΩ range to
minimize the input current in very low power applications.
However, stray capacitance and noise pickup on the MPPC
pin must also be minimized.
VIN
R5
+
a minimum input voltage when using high resistance
sources, such as photovoltaic panels, so as to maximize
input power transfer and prevent VIN from dropping too
low under load. Referring to Figure 3, the MPPC pin is
internally connected to the non-inverting input of a gm
amplifier, whose inverting input is connected to the 1.175V
reference. If the voltage at MPPC, using the external voltage divider, falls below the reference voltage, the output of
the amplifier pulls the internal VC node low. This reduces
the commanded average inductor current so as to reduce
the input current and regulate VIN to the programmed
minimum voltage, as given by:
LTC3129
+
–
R6
1.175V
* CIN SHOULD BE AT
LEAST 22µF FOR
MPPC APPLICATIONS
FB
+
–
VOLTAGE
ERROR AMP
VC
CURRENT
COMMAND
3129 F03
Figure 3. MPPC Amplifier with External Resistor Divider
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15
LTC3129
Operation
The MPPC pin controls the converter in a linear fashion
when using sources that can provide a minimum of 5mA
to 10mA of continuous input current. For operation from
weaker input sources, refer to the Applications Information section to see how the programmable RUN pin can
be used to control the converter in a hysteretic manner to
provide an effective MPPC function for sources that can
provide as little as 5µA or less. If the MPPC function is not
required, the MPPC pin should be tied to VCC.
Thermal Considerations
The power switches of the LTC3129 are designed to operate continuously with currents up to the internal current
limit thresholds. However, when operating at high current
levels, there may be significant heat generated within the
IC. In addition, the VCC regulator can also generate wasted
heat when VIN is very high, adding to the total power
dissipation of the IC. As described elsewhere in this data
sheet, bootstrapping of the VCC for 5V output applications
can essentially eliminate the VCC power dissipation term
GND
and significantly improve efficiency. As a result, careful
consideration must be given to the thermal environment
of the IC in order to provide a means to remove heat from
the IC and ensure that the LTC3129 is able to provide its
full rated output current. Specifically, the exposed die
attach pad of both the QFN and MSE packages must be
soldered to a copper layer on the PCB to maximize the
conduction of heat out of the IC package. This can be accomplished by utilizing multiple vias from the die attach
pad connection underneath the IC package to other PCB
layer(s) containing a large copper plane. A typical board
layout incorporating these concepts is shown in Figure 4.
If the IC die temperature exceeds approximately 180°C, over
temperature shutdown will be invoked and all switching
will be inhibited. The part will remain disabled until the die
temperature cools by approximately 10°C. The soft-start
circuit is re-initialized in overtemperature shutdown to
provide a smooth recovery when the IC die temperature
cools enough to resume operation.
VIN
CIN
VCC
L
COUT
3129 F04
GND
VOUT
Figure 4. Typical 2-Layer PC Board Layout (MSE Package)
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LTC3129
Applications Information
A standard application circuit for the LTC3129 is shown on
the front page of this data sheet. The appropriate selection
of external components is dependent upon the required
performance of the IC in each particular application given
considerations and trade-offs such as PCB area, input
and output voltage range, output voltage ripple, transient
response, required efficiency, thermal considerations and
cost. This section of the data sheet provides some basic
guidelines and considerations to aid in the selection of
external components and the design of the applications
circuit, as well as more application circuit examples.
Programming VOUT
The output voltage of the LTC3129 is set by connecting
the FB pin to an external resistor divider from VOUT to
ground, as shown in Figure 5, according to the equation:
VOUT = 1.175V • (1+ R1/R2)
VOUT
VOUT
COUT
LTC3129
R1
CFF
FB
R2
3129 F05
Figure 5. VOUT Feedback Divider
A small feedforward capacitor can be added in parallel with
R1 (in Figure 5) to reduce Burst Mode ripple and improve
transient response. Details on selecting a feedforward
capacitor are provided later in this data sheet.
VCC Capacitor Selection
The VCC output of the LTC3129 is generated from VIN by a
low dropout linear regulator. The VCC regulator has been
designed for stable operation with a wide range of output
capacitors. For most applications, a low ESR capacitor of
at least 2.2µF should be used. The capacitor should be
located as close to the VCC pin as possible and connected
to the VCC pin and ground through the shortest traces pos-
sible. VCC is the regulator output and is also the internal
supply pin for the LTC3129 control circuitry as well as the
gate drivers and boost rail charging diodes. The VCC pin is
not intended to supply current to other external circuitry.
Inductor Selection
The choice of inductor used in LTC3129 application circuits
influences the maximum deliverable output current, the
converter bandwidth, the magnitude of the inductor current
ripple and the overall converter efficiency. The inductor
must have a low DC series resistance, when compared to
the internal switch resistance, or output current capability and efficiency will be compromised. Larger inductor
values reduce inductor current ripple but may not increase
output current capability as is the case with peak current
mode control as described in the Maximum Output Current section. Larger value inductors also tend to have a
higher DC series resistance for a given case size, which
will have a negative impact on efficiency. Larger values
of inductance will also lower the right half plane (RHP)
zero frequency when operating in boost mode, which can
compromise loop stability. Nearly all LTC3129 application
circuits deliver the best performance with an inductor value
between 3.3µH and 10µH. Buck mode-only applications
can use the larger inductor values as they are unaffected
by the RHP zero, while mostly boost applications generally
require inductance on the low end of this range depending
on how large the step-up ratio is.
Regardless of inductor value, the saturation current rating
should be selected such that it is greater than the worst-case
average inductor current plus half of the ripple current. The
peak-to-peak inductor current ripple for each operational
mode can be calculated from the following formula, where
f is the switching frequency (1.2MHz), L is the inductance
in µH and tLOW is the switch pin minimum low time in
µs. The switch pin minimum low time is typically 0.09µs.
∆IL(P−P)(BUCK) =
VOUT  VIN – VOUT   1

 – t LOW  A


L 
VIN
 f
∆IL(P−P)(BOOST) =
VIN  VOUT – VIN   1

 – t LOW  A


L  VOUT  f
3129f
For more information www.linear.com/3129
17
LTC3129
Applications Information
It should be noted that the worst-case peak-to-peak inductor ripple current occurs when the duty cycle in buck
mode is minimum (highest VIN) and in boost mode when
the duty cycle is 50% (VOUT = 2 • VIN). As an example, if
VIN (minimum) = 2.5V and VIN (maximum) = 15V, VOUT
= 5V and L = 10µH, the peak-to-peak inductor ripples at
the voltage extremes (15V VIN for buck and 2.5V VIN for
boost) are:
Different inductor core materials and styles have an impact
on the size and price of an inductor at any given current
rating. Shielded construction is generally preferred as it
minimizes the chances of interference with other circuitry.
The choice of inductor style depends upon the price, sizing,
and EMI requirements of a particular application. Table 1
provides a wide sampling of inductors that are well suited
to many LTC3129 applications.
Buck = 248mA peak-to-peak
Table 1. Recommended Inductors
Boost = 93mA peak-to-peak
VENDOR
PART
Coilcraft
www.coilcraft.com
EPL2014, EPL3012, EPL3015, LPS3015,
LPS3314, XFL3012
Coiltronics
www.cooperindustries.com
SDH3812, SD3814, SD3114, SD3118
Murata
www.murata.com
LQH3NP, LQH32P, LQH44P
Sumida
www.sumida.com
CDRH2D16, CDRH2D18, CDRH3D14,
CDRH3D16
Taiyo-Yuden
www.t-yuden.com
NR3012T, NR3015T, NRS4012T,
BRC2518
TDK
www.tdk.com
VLS3012, VLS3015, VLF302510MT,
VLF302512MT
Toko
www.tokoam.com
DB3015C, DB3018C, DB3020C, DP418C,
DP420C, DEM2815C, DFE322512C,
DFE252012C
Würth
www.we-online.com
WE-TPC 2813, WE-TPC 3816,
WE-TPC 2828
One half of this inductor ripple current must be added to
the highest expected average inductor current in order to
select the proper saturation current rating for the inductor.
To avoid the possibility of inductor saturation during load
transients, an inductor with a saturation current rating of
at least 600mA is recommended for all applications.
In addition to its influence on power conversion efficiency,
the inductor DC resistance can also impact the maximum
output current capability of the buck-boost converter
particularly at low input voltages. In buck mode, the
output current of the buck-boost converter is primarily
limited by the inductor current reaching the average current limit threshold. However, in boost mode, especially
at large step-up ratios, the output current capability can
also be limited by the total resistive losses in the power
stage. These losses include, switch resistances, inductor
DC resistance and PCB trace resistance. Avoid inductors
with a high DC resistance (DCR) as they can degrade the
maximum output current capability from what is shown
in the Typical Performance Characteristics section and
from the Typical Application circuits.
As a guideline, the inductor DCR should be significantly
less than the typical power switch resistance of 750mΩ
each. The only exceptions are applications that have a
maximum output current requirement much less than what
the LTC3129 is capable of delivering. Generally speaking,
inductors with a DCR in the range of 0.15Ω to 0.3Ω are
recommended. Lower values of DCR will improve the efficiency at the expense of size, while higher DCR values
will reduce efficiency (typically by a few percent) while
allowing the use of a physically smaller inductor.
Recommended inductor values for different operating
voltage ranges are given in Table 2. These values were
chosen to minimize inductor size while maintaining an
acceptable amount of inductor ripple current for a given
VIN and VOUT range.
Table 2. Recommended Inductor Values
VIN AND VOUT RANGE
RECOMMENDED INDUCTOR VALUES
VIN and VOUT Both < 4.5V
3.3µH to 4.7µH
VIN and VOUT Both < 8V
4.7µH to 6.8µH
VIN and VOUT Both < 11V
6.8µH to 8.2µH
VIN and VOUT Up to 15.75V
8.2µH to 10µH
Feedforward Capacitor
The use of a voltage feedforward capacitor, as shown in
Figure 5, offers a number of performance advantages. A
feedforward capacitor will reduce output voltage ripple in
3129f
18
For more information www.linear.com/3129
LTC3129
Applications Information
Burst Mode operation and improve transient response. In
addition, due to the wide VIN and VOUT operating range
of the LTC3129 and its fixed internal loop compensation,
some applications may require the use of a feedforward
capacitor to assure light-load stability (less than ~15mA)
when operating in PWM mode (PWM pin pulled high).
Therefore, to reduce Burst Mode ripple and improve
phase margin at light load when PWM mode operation is
selected, a feedforward capacitor is recommended for all
applications. The recommended feedforward capacitor
value can be calculated by:
CFF = 66/R1
Where R1 is the top feedback divider resistor value in MΩ
and CFF is the recommended feedforward capacitor value
in picofarads (use the nearest standard value). Refer to
the application circuits for examples.
Examining the previous equations reveals that the output
voltage ripple increases with load current and is generally higher in boost mode than in buck mode. Note that
these equations only take into account the voltage ripple
that occurs from the inductor current to the output being
discontinuous. They provide a good approximation to the
ripple at any significant load current but underestimate the
output voltage ripple at very light loads where the output
voltage ripple is dominated by the inductor current ripple.
In addition to the output voltage ripple generated across
the output capacitance, there is also output voltage ripple
produced across the internal resistance of the output
capacitor. The ESR-generated output voltage ripple is
proportional to the series resistance of the output capacitor
and is given by the following expressions where RESR is
the series resistance of the output capacitor and all other
terms as previously defined.
Output Capacitor Selection
A low effective series resistance (ESR) output capacitor
of 4.7µF minimum should be connected at the output of
the buck-boost converter in order to minimize output voltage ripple. Multilayer ceramic capacitors are an excellent
option as they have low ESR and are available in small
footprints. The capacitor value should be chosen large
enough to reduce the output voltage ripple to acceptable
levels. Neglecting the capacitor's ESR and ESL (effective series inductance), the peak-to-peak output voltage
ripple in PWM mode can be calculated by the following
formula, where f is the frequency in MHz (1.2MHz), COUT
is the capacitance in µF, tLOW is the switch pin minimum
low time in µs (0.09µs typical) and ILOAD is the output
current in amperes.
∆VP−P(BUCK) =
ILOAD t LOW
∆VP−P(BOOST) =
COUT
V
ILOAD  VOUT – VIN + tLOW fVIN 
 V
fCOUT 
VOUT
∆VP−P(BUCK) =
ILOADRESR
∆VP−P(BOOST) =
1– tLOW f
≅ ILOADRESR V
ILOADRESR VOUT
(
VIN 1– t LOW f
)
V 
≅ ILOADRESR  OUT  V
 VIN 
In most LTC3129 applications, an output capacitor between
10µF and 22µF will work well. To minimize output ripple
in Burst Mode operation, or transients incurred by large
step loads, values of 22µF or larger are recommended.
Input Capacitor Selection
The VIN pin carries the full inductor current and provides
power to internal control circuits in the IC. To minimize
input voltage ripple and ensure proper operation of the IC,
a low ESR bypass capacitor with a value of at least 4.7µF
should be located as close to the VIN pin as possible. The
traces connecting this capacitor to VIN and the ground
plane should be made as short as possible.
3129f
For more information www.linear.com/3129
19
LTC3129
Applications Information
When powered through long leads or from a power source
with significant resistance, a larger value bulk input capacitor may be required and is generally recommended.
In such applications, a 47µF to 100µF low-ESR electrolytic
capacitor in parallel with a 1µF ceramic capacitor generally
yields a high performance, low cost solution.
Note that applications using the MPPC feature should
use a minimum CIN of 22µF. Larger values can be used
without limitation.
Recommended Input and Output Capacitor Types
The capacitors used to filter the input and output of the
LTC3129 must have low ESR and must be rated to handle
the AC currents generated by the switching converter.
This is important to maintain proper functioning of the
IC and to reduce output voltage ripple. There are many
capacitor types that are well suited to these applications
including multilayer ceramic, low ESR tantalum, OS-CON
and POSCAP technologies. In addition, there are certain
types of electrolytic capacitors such as solid aluminum
organic polymer capacitors that are designed for low
ESR and high AC currents and these are also well suited
to some LTC3129 applications. The choice of capacitor
technology is primarily dictated by a trade-off between
size, leakage current and cost. In backup power applications, the input or output capacitor might be a super or
ultra capacitor with a capacitance value measuring in the
Farad range. The selection criteria in these applications
are generally similar except that voltage ripple is generally
not a concern. Some capacitors exhibit a high DC leakage current which may preclude their consideration for
applications that require a very low quiescent current in
Burst Mode operation. Note that ultra capacitors may have
a rather high ESR, therefore a 4.7µF (minimum) ceramic
capacitor is recommended in parallel, close to the IC pins.
Ceramic capacitors are often utilized in switching converter applications due to their small size, low ESR and
low leakage currents. However, many ceramic capacitors
intended for power applications experience a significant
loss in capacitance from their rated value as the DC bias
voltage on the capacitor increases. It is not uncommon for
a small surface mount capacitor to lose more than 50%
of its rated capacitance when operated at even half of its
maximum rated voltage. This effect is generally reduced
as the case size is increased for the same nominal value
capacitor. As a result, it is often necessary to use a larger
value capacitance or a higher voltage rated capacitor than
would ordinarily be required to actually realize the intended
capacitance at the operating voltage of the application. X5R
and X7R dielectric types are recommended as they exhibit
the best performance over the wide operating range and
temperature of the LTC3129. To verify that the intended
capacitance is achieved in the application circuit, be sure
to consult the capacitor vendor's curve of capacitance
versus DC bias voltage.
Using the Programmable RUN Function to Operate
from Extremely Weak Input Sources
Another application of the programmable RUN pin is that
it can be used to operate the converter in a hiccup mode
from extremely low current sources. This allows operation
from sources that can only generate microamps of output
current, and would be far too weak to sustain normal steadystate operation, even with the use of the MPPC pin. Because
the LTC3129 draws only 1.9µA typical from VIN until it is
enabled, the RUN pin can be programmed to keep the IC
disabled until VIN reaches the programmed voltage level.
In this manner, the input source can trickle-charge an input
storage capacitor, even if it can only supply microamps of
current, until VIN reaches the turn-on threshold set by the
RUN pin divider. The converter will then be enabled using
the stored charge in the input capacitor, until Vin drops
below the turn-off threshold, at which point the converter
will turn off and the process will repeat.
This approach allows the converter to run from weak
sources such as thin-film solar cells using indoor lighting. Although the converter will be operating in bursts,
it is enough to charge an output capacitor to power low
duty cycle loads, such as wireless sensor applications,
or to trickle charge a battery. In addition, note that the
input voltage will be cycling (with a small ripple as set by
the RUN hysteresis) about a fixed voltage, as determined
by the divider. This allows the high impedance source to
operate at the programmed optimal voltage for maximum
power transfer.
3129f
20
For more information www.linear.com/3129
LTC3129
Applications Information
When using high value divider resistors (in the MΩ
range) to minimize current draw on VIN, a small noise
filter capacitor may be necessary across the lower divider
resistor to prevent noise from erroneously tripping the
RUN comparator. The capacitor value should be minimized
so as not to introduce a time delay long enough for the
input voltage to drop significantly below the desired VIN
threshold before the converter is turned off. Note that
larger VIN decoupling capacitor values will minimize this
effect by providing more holdup time on VIN.
Programming the MPPC Voltage
As discussed in the previous section, the LTC3129 includes an MPPC function to optimize performance when
operating from voltage sources with relatively high source
resistance. Using an external voltage divider from VIN, the
MPPC function takes control of the average inductor current
when necessary to maintain a minimum input voltage, as
programmed by the user. Referring to Figure 3:
VIN(MPPC) = 1.175V • (1 + R5/R6)
This is useful for such applications as photovoltaic
powered converters, since the maximum power transfer
point occurs when the photovoltaic panel is operated at
about 75% of its open-circuit voltage. For example, when
operating from a photovoltaic panel with an open-circuit
voltage of 5V, the maximum power transfer point will be
when the panel is loaded such that its output voltage is
about 3.75V. Choosing values of 2MΩ for R5 and 909kΩ
for R6 will program the MPPC function to regulate the
maximum input current so as to maintain VIN at a minimum
of 3.74V (typical). Note that if the panel can provide more
power than the LTC3129 can draw, the input voltage will
rise above the programmed MPPC point. This is fine as
long as the input voltage doesn't exceed 15V.
For weak input sources with very high resistance (hundreds of Ohms or more), the LTC3129 may still draw more
current than the source can provide, causing VIN to drop
below the UVLO threshold. For these applications, it is
recommended that the programmable RUN feature be
used, as described in the previous section.
MPPC Compensation and Gain
When using MPPC, there are a number of variables that
affect the gain and phase of the input voltage control
loop. Primarily these are the input capacitance, the MPPC
divider ratio and the VIN source resistance (or current). To
simplify the design of the application circuit, the MPPC
control loop in the LTC3129 is designed with a relatively
low gain, such that external MPPC loop compensation is
generally not required when using a VIN capacitor value
of at least 22µF. The gain from the MPPC pin to the internal VC control voltage is about 12, so a drop of 50mV
on the MPPC pin (below the 1.175V MPPC threshold),
corresponds to a 600mV drop on the internal VC voltage,
which reduces the average inductor current all the way
to zero. Therefore, the programmed input MPPC voltage
will be maintained within about 4% over the load range.
Note that if large value VIN capacitors are used (which may
have a relatively high ESR) a small ceramic capacitor of
at least 4.7µF should be placed in parallel across the VIN
input, near the VIN pin of the IC.
Bootstrapping the VCC Regulator
The high and low side gate drivers are powered through
the VCC rail, which is generated from the input voltage, VIN,
through an internal linear regulator. In some applications,
especially at high input voltages, the power dissipation
in the linear regulator can become a major contributor to
thermal heating of the IC and overall efficiency. The Typical
Performance Characteristics section provides data on the
VCC current and resulting power loss versus VIN and VOUT.
A significant performance advantage can be attained in high
VIN applications where converter output voltage (VOUT) is
programmed to 5V, if VOUT is used to power the VCC rail.
Powering VCC in this manner is referred to as bootstrapping. This can be done by connecting a Schottky diode
(such as a BAT54) from VOUT to VCC as shown in Figure 6.
With the bootstrap diode installed, the gate driver currents
are supplied by the buck-boost converter at high efficiency
rather than through the internal linear regulator. The internal linear regulator contains reverse blocking circuitry
3129f
For more information www.linear.com/3129
21
LTC3129
Applications Information
that allows VCC to be driven above its nominal regulation
level with only a very slight amount of reverse current.
Please note that the bootstrapping supply (either VOUT or
a separate regulator) must be limited to less than 5.7V so
as not to exceed the maximum VCC voltage of 5.5V after
the diode drop.
Sources of Small Photovoltaic Panels
By maintaining VCC above its UVLO threshold, bootstrapping, even to a 3.3V output, also allows operation down
to the VIN UVLO threshold of 1.8V (typical).
Sanyo
http://panasonic.net/energy/amorton/en/
PowerFilm
http://www.powerfilmsolar.com/
Ixys
Corporation
http://www.ixys.com/ProductPortfolio/GreenEnergy.aspx
G24
Innovations
http://www.g24i.com/
SolarPrint
http://www.solarprint.ie/
VOUT
VOUT
COUT
LTC3129
A list of companies that manufacture small solar panels
(sometimes referred to as modules or solar cell arrays)
suitable for use with the LTC3129 is provided in Table 3.
Table 3. Small Photovoltaic Panel Manufacturers
BAT54
VCC
2.2µF
3129 F06
Figure 6. Example of VCC Bootstrap
3129f
22
For more information www.linear.com/3129
LTC3129
Typical Applications
Hiccup Converter Powers Wireless Sensor from Indoor Lighting
UVLO = 3.5V
VIN
4.7µF
+
4.9cm × 5.8cm
BST1 SW1
4.5
22µF
LTC3129
3.5
VOUT
3.6V
1M
976k
MPPC
NC
PGOOD
PGOOD
VCC
NC
2.37M
2M
FB
PWM
10pF
4.0
VOUT
RUN
470µF
6.3V
PULSED IOUT
25mA FOR 5ms
SW2 BST2
VIN
4.42M
VCC
PV PANEL
SANYO AM-1815
22nF
4.7µH
TRANSMIT RATE (Hz)
22nF
Transmit Rate vs Light Level
(Fluorescent)
GND
3.0
2.5
2.0
1.5
1.0
0.5
0
2.2µF
PGND
0
400
800
1200
LIGHT LEVEL (Lx)
1600
2000
3129 TA02b
3129 TA02a
Low Noise 3.6V Converter Using Bootstrap Diode to Extend Lower VIN Range
22nF
BST1 SW1
VIN
1.8V TO 15V
22nF
6.8µH
VIN < 3.6V, IOUT = 100mA
VIN > 3.6V, IOUT = 200mA
SW2 BST2
VOUT
VIN
LTC3129
2M
RUN
VCC
VOUT
3.6V
10µF
33pF
BAT54
FB
MPPC
976k
PGOOD
PWM
10µF
VCC
NC
NC
GND
2.2µF
PGND
3129 TA03
3129f
For more information www.linear.com/3129
23
LTC3129
Typical Applications
Solar Powered Converter with MPPC Charges Storage Capacitor
BST1 SW1
UVLO = 4.3V
VIN
22nF
4.7µH
100.0
SW2 BST2
VOUT
VIN
1M
47µF
CERAMIC
4.7µF
LTC3129
1F
3.09M
RUN
VCC
MPPC
PowerFilm
SP4.2-37
SOLAR
MODULE
VOUT
4.8V
+
PGOOD
PGOOD
PWM
NC
8.4cm × 3.7cm
10.0
1.0
VCC
NC
392k
COOPER BUSSMANN
PB-5R0V105-R
1M
FB
OUTPUT CURRENT (mA)
22nF
Average Output Current
vs Light Level (Daylight)
GND
0.1
1000
2.2µF
PGND
10000
100000
LIGHT LEVEL (Lx)
1000000
3129 TA04b
3129 TA04a
Li-Ion Powered 3V Converter with 3.1V Input UVLO Reduces Low Battery IQ to 3µA
22nF
22nF
4.7µH
BST1 SW1
UVLO = 3.1V
SW2 BST2
10µF
LTC3129
2M
+
VOUT
3V
200mA
VOUT
VIN
33pF
Li-Ion
1.58M
RUN
4.7µF
VCC
FB
MPPC
VCC
NC
1.27M
1.02M
PGOOD
PWM
NC
10pF
GND
2.2µF
PGND
3129 TA05
15V Converter Operates from Three to Eight AA or AAA Cells
22nF
VIN
2.42V TO 15V
22nF
10µH
BST1 SW1
SW2 BST2
VOUT
VIN
10µF
25V
LTC3129
RUN
10µF
THREE TO EIGHT
AA OR AAA
BATTERIES
VCC
VOUT
15V
25mA MINIMUM
3.01M
22pF
FB
MPPC
255k
PGOOD
PWM
VCC
NC
NC
GND
2.2µF
PGND
3129 TA06
3129f
24
For more information www.linear.com/3129
LTC3129
Typical Applications
Energy Harvesting Converter Operates from a Variety of Weak Sources
22nF
BAS 70-05
BST1 SW1
UVLO = 3.3V
INPUT SOURCES:
• RF
• AC
• PIEZO
• COIL-MAGNET
22nF
4.7µH
SW2 BST2
VOUT
5V
VOUT
VIN
10µF
LTC3129
4.99M
3.32M
22pF
RUN
FB
100µF
CERAMIC
VCC
MPPC
BAS 70-06
VCC
NC
3.01M
1.02M
PGOOD
PWM
NC
10pF
GND
2.2µF
PGND
3129 TA07
Solar Powered Converter Extends Battery Life in Low Power 3V Primary Battery Applications
TOKO DEM2812C
22nF
BST1 SW1
UVLO = 3.7V
VIN
4.7µF
22nF
3.3µH
SW2 BST2
22µF
LTC3129
4.99M
VCC
6.3V
2.43M
10pF
4.22M
D2
G2
G1
VOUT
R4
2.43M
MPPC
2.2µF
CR2032
3V COIN CELL
PGOOD
PWM
BAT54
NC
NC
VCC
GND
PGND
74LVC2G04
2.2µF
3129 TA09
Percentage of Added Battery Life vs Light Level and Load
(PowerFilm SP4.2-37, 30sq cm Panel)
1000
ADDED BATTERY LIFE (%)
+ 470µF
VOUT
3V TO 3.2V
S2
15pF
2.43M
FB
S1
D1
3.20V
VOUT
VIN
RUN
PV PANEL
SANYO AM-1815
OR
PowerFilm SP4.2-37
FDC6312P
DUAL PMOS
100
10
1
100
AVERAGE LOAD = 165µW
AVERAGE LOAD = 330µW
AVERAGE LOAD = 660µW
AVERAGE LOAD = 1650µW
AVERAGE LOAD = 3300µW
1,000
LIGHT LEVEL (Lx)
10,000
3129 TA09b
3129f
For more information www.linear.com/3129
25
LTC3129
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1700 Rev A)
Exposed Pad Variation AA
0.70 ±0.05
3.50 ±0.05
1.65 ±0.05
2.10 ±0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.75 ±0.05
15
PIN 1
TOP MARK
(NOTE 6)
16
0.40 ±0.10
1
1.65 ±0.10
(4-SIDES)
2
(UD16 VAR A) QFN 1207 REV A
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ±0.05
0.50 BSC
3129f
26
For more information www.linear.com/3129
LTC3129
Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev E)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
5.23
(.206)
MIN
2.845 ±0.102
(.112 ±.004)
0.889 ±0.127
(.035 ±.005)
8
1
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102 3.20 – 3.45
(.065 ±.004) (.126 – .136)
0.305 ±0.038
(.0120 ±.0015)
TYP
16
0.50
(.0197)
BSC
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
0.35
REF
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
9
NO MEASUREMENT PURPOSE
0.280 ±0.076
(.011 ±.003)
REF
16151413121110 9
DETAIL “A”
0° – 6° TYP
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
4.90 ±0.152
(.193 ±.006)
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1.10
(.043)
MAX
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
1234567 8
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.86
(.034)
REF
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE16) 0911 REV E
3129f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representaForofmore
information
www.linear.com/3129
tion that the interconnection
its circuits
as described
herein will not infringe on existing patent rights.
27
LTC3129
Typical Application
Dual VIN Application, Using the LTC4412 PowerPath™ Controller
22nF
MBR0520
22nF
10µH
12V WALL ADAPTER INPUT
FDN338
BSS314
BST1 SW1
SW2 BST2
VOUT
VIN
LTC3129
10µF
LTC4412
+
GATE
VIN
VCC
SENSE
Li-Ion
CTL
10pF
3.01M
FB
MPPC
324k
PGOOD
VCC
NC
NC
GND
VOUT
12V
10µF
25V
RUN
PWM
STAT
VIN = 12V, IOUT = 200mA
VIN = 3.6V, IOUT = 50mA
GND
PGND
2.2µF
3129 TA08
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LTC3103
15V, 300mA Synchronous Step-Down DC/DC Converter with
Ultralow Quiescent Current
VIN(MIN) = 2.2V, VIN(MAX) = 15V, VOUT(MIN) = 0.8V, IQ = 1.8µA,
ISD <1µA, 3mm × 3mm DFN-10, MSOP-10 Packages
LTC3104
15V, 300mA Synchronous Step-Down DC/DC Converter with
Ultralow Quiescent Current and 10mA LDO
VIN(MIN) = 2.2V, VIN(MAX) = 15V, VOUT(MIN) = 0.8V, IQ = 2.8µA,
ISD <1µA, 4mm × 3mm DFN-14, MSOP-16 Packages
LTC3105
400mA Step-up Converter with MPPC and 250mV Start-Up
VIN(MIN) = 0.2V, VIN(MAX) = 5V, VOUT(MIN) = 0 5.25VMAX, IQ = 22µA,
ISD <1µA, 3mm × 3mm DFN-10/MSOP-12 Packages
LTC3112
15V, 2.5A, 750kHz Monolithic Synch Buck/Boost
VIN(MIN) = 2.7V, VIN(MAX) = 15V, VOUT(MIN) = 2.7V to 14V, IQ = 50µA,
ISD <1µA, 4mm × 5mm DFN-16 TSSOP-20E Packages
LTC3115-1
40V, 2A, 2MHz Monolithic Synch Buck/Boost
VIN(MIN) = 2.7V, VIN(MAX) = 40V, VOUT(MIN) = 2.7V to 40V, IQ = 50µA,
ISD <1µA, 4mm × 5mm DFN-16 and TSSOP-20E Packages
LTC3531
5.5V, 200mA, 600kHz Monolithic Synch Buck/Boost
VIN(MIN) = 1.8V, VIN(MAX) = 5.5V, VOUT(MIN) = 2V to 5V, IQ = 16µA,
ISD <1µA, 3mm × 3mm DFN-8 and ThinSOT Packages
LTC3388-1/
LTC3388-3
20V, 50mA High Efficiency Nano Power Step-Down Regulator
VIN(MIN) = 2.7V, VIN(MAX) =20V, VOUT(MIN) = Fixed 1.1V to 5.5V,
IQ = 720nA, ISD = 400nA, 3mm × 3mm DFN-10, MSOP-10 Packages
LTC3108/
LTC3108-1
Ultralow Voltage Step-Up Converter and Power Manager
VIN(MIN) = 0.02V, VIN(MAX) = 1V, VOUT(MIN) = Fixed 2.35V to 5V,
IQ = 6µA, ISD <1µA, 3mm × 4mm DFN-12, SSOP-16 Packages
LTC3109
Auto-Polarity, Ultralow Voltage Step-Up Converter and Power
Manager
VIN(MIN) = 0.03V, VIN(MAX) = 1V, VOUT(MIN) = Fixed 2.35V to 5V,
IQ = 7µA, ISD <1µA, 4mm × 4mm QFN-20, SSOP-20 Packages
LTC3588-1
Piezo Electric Energy Harvesting Power Supply
VIN(MIN) = 2.7V, VIN(MAX) = 20V, VOUT(MIN) = Fixed 1.8V to 3.6V,
IQ = 950nA, ISD 450nA, 3mm × 3mm DFN-10, MSOP-10E Packages
LTC4070
Li-Ion/Polymer Low Current Shunt Battery Charger System
VIN(MIN) = 450nA to 50mA, VFLOAT + 4.0V, 4.1V, 4.2V, IQ = 300nA,
2mm × 3mm DFN-8, MSOP-8 Packages
3129f
28 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/3129
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/3129
LT 0213 • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2013