ONSEMI MURB1660CTT4

MURB1660CT
Preferred Device
SWITCHMODEt
Power Rectifier
D2PAK Power Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters, and as free wheeling diodes.
ULTRAFAST RECTIFIER
16 AMPERES, 600 VOLTS
Features
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http://onsemi.com
Package Designed for Power Surface Mount Applications
Ultrafast 60 Nanosecond Recovery Times
175°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
High Temperature Glass Passivated Junction
High Voltage Capability to 600 V
Low Leakage Specified @ 150°C Case Temperature
Short Heat Sink Tab Manufactured − Not Sheared!
Similar in Size to Industrial Standard TO−220 Package
Pb−Free Packages are Available
1
4
3
D2PAK
CASE 418B
STYLE 3
4
1
3
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings:
Machine Model, C >400 V
Human Body Model, 3B >8000 V
MAXIMUM RATINGS (Per Leg)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600
V
Average Rectified Forward Current
(Rated VR, TC = 150°C) Total Device
IF(AV)
8.0
16
A
MARKING DIAGRAM
AY WW
U1660G
AKA
A
Y
WW
U1660
G
AKA
= Assembly Location
= Year
= Work Week
= Specific Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
Device
MURB1660CT
Package
Shipping†
D2PAK
50 Units/Rail
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 150°C)
IFM
16
A
MURB1660CTG
D2PAK
(Pb−Free)
50 Units/Rail
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
100
A
MURB1660CTT4
D2PAK
800/Tape & Reel
D2PAK
(Pb−Free)
800/Tape & Reel
Operating Junction and Storage Temperature
Range
MURB1660CTT4G
TJ, Tstg
−65 to
+175
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 7
1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MURB1660CT/D
MURB1660CT
THERMAL CHARACTERISTICS (Per Leg)
Symbol
Value
Unit
Maximum Thermal Resistance, Junction−to−Case
Rating
RqJC
2.0
°C/W
Maximum Thermal Resistance, Junction−to−Ambient (Note 1)
RqJA
50
°C/W
TL
260
°C
Symbol
Max
Unit
Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 8.0 Amp, TC = 150°C)
(iF = 8.0 Amp, TC = 25°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, TC = 150°C)
(Rated dc Voltage, TC = 25°C)
iR
Maximum Reverse Recovery Time
(IF = 1.0 Amp, di/dt = 50 Amp/ms)
(IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp)
trr
V
1.20
1.50
mA
500
10
ns
60
50
1. See Chapter 7 for mounting conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
10 K
20
1.0 K
400
I R, REVERSE CURRENT (A)
μ
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
100
50
TJ = 150°C
10
25°C
5.0
2.0
100°C
1.0
TJ = 150°C
10
100°C
2.0
1.0
0.4
25°C
0.1
0.04
0.3
0.1
100
40
0.01
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
100
200
vF, INSTANTANEOUS VOLTAGE (V)
RATED VR APPLIED
RqJC = 2°C/W
8.0
DC
7.0
6.0
5.0
4.0
SQUARE WAVE
3.0
2.0
1.0
0
140
150
500
600
Figure 2. Typical Reverse Current, Per Leg
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
I F(AV), AVERAGE FORWARD CURRENT (AMPS)
10
400
VR, REVERSE VOLTAGE (V)
Figure 1. Typical Forward Voltage, Per Leg
9.0
300
180
160
170
TC, CASE TEMPERATURE (°C)
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
SQUARE WAVE
DC
TJ = 175°C
0
Figure 3. Current Derating, Case, Per Leg
1
2
3
4
5
6
7
8
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Power Dissipation, Per Leg
http://onsemi.com
2
9
10
1.0
D = 0.5
0.5
0.2
P(pk)
0.1
0.1
0.05
0.01
0.05
ZqJC(t) = r(t) RqJC
D curves apply for power
pulse train shown
read time at T1
t1
t2
Duty Cycle, D = t1/t2TJ(pk) − TC = P(pk) ZqJC(t)
SINGLE PULSE
0.02
0.01
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
t, TIME (ms)
Figure 5. Thermal Response
1K
C, CAPACITANCE (pF)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MURB1660CT
300
TJ = 25°C
100
30
10
1
10
VR, REVERSE VOLTAGE (V)
Figure 6. Typical Capacitance, Per Leg
http://onsemi.com
3
100
100
200
500
1K
MURB1660CT
PACKAGE DIMENSIONS
D2PAK
CASE 418B−04
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D 3 PL
0.13 (0.005)
H
M
T B
M
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
VARIABLE
CONFIGURATION
ZONE
N
R
P
U
L
M
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MURB1660CT/D