MURS360BT3 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com Features •Small Compact Surface Mountable Package with J-Bend Leads •Rectangular Package for Automated Handling •High Temperature Glass Passivated Junction •This is a Pb-Free Device ULTRAFAST RECTIFIERS 3 AMPERES 600 VOLTS Mechanical Characteristics •Case: Epoxy, Molded •Epoxy Meets UL 94 V-O @ 0.125 in •Weight: 95 mg (approximately) •Finish: All External Surfaces Corrosion Resistant and Terminal SMB CASE 403A Leads are Readily Solderable •Lead and Mounting Surface Temperature for Soldering Purposes: MARKING DIAGRAM 260°C Max. for 10 Seconds •Polarity: Polarity Band Indicates Cathode Lead •ESD Rating: Human Body Model (HBM) 3B Machine Model (MM) C AYWW B36BG G MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current IF(AV) 3.0 @ TL = 105°C A Non- Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 100 A TJ *65 to +175 °C Operating Junction Temperature B36B = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Device Package Shipping† MURS360BT3G SMB (Pb-Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 June, 2007 - Rev. 1 1 Publication Order Number: MURS360BT3/D MURS360BT3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) Symbol Value Unit RqJL RqJA 14 71 °C/W 1. Mounted with minimum recommended pad size, PC Board FR4. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 2) (iF = 3.0 A, TJ = 25°C) (iF = 3.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr Typ Max 0.83 1.25 1.05 95 3.0 150 Unit V mA ns 75 50 50 ns 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. 10 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) TYPICAL CHARACTERISTICS 125°C 150°C 25°C 1 0.1 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) 10 125°C 150°C 1 0.1 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 0.1 Ir, REVERSE CURRENT (mA) Ir, REVERSE CURRENT (mA) 25°C 150°C 0.01 125°C 0.001 0.0001 25°C 0.00001 1 0.1 150°C 0.01 125°C 0.001 0.0001 0.000001 25°C 0.00001 0 100 200 300 400 500 600 0 Vr, REVERSE VOLTAGE (V) 100 200 300 400 500 Vr, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 600 MURS360BT3 TYPICAL CHARACTERISTICS 70 5 C, CAPACITANCE (pF) 60 IF(AV), AVERAGE FORWARD CURRENT (A) TJ = 25°C f = 1 MHz 50 40 30 20 10 0 4 Square 3 2 1 0 0 20 40 60 80 100 65 75 85 95 105 115 125 135 Vr, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Capacitance Figure 6. Current Derating, Lead 3 145 155 4 PF(AV), AVERAGE POWER DISSIPATION (W) RqJA = 71°C/W RqJA = 120°C/W No Heatsink dc 2 dc 1 Square Wave 0 Square Wave TJ = 150°C 3 dc 2 1 0 0 25 50 75 100 125 150 0 1 2 3 TA, AMBIENT TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Current Derating, Ambient Figure 8. Typical Forward Power Dissipation 4 Square Wave PF(AV), AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) dc TJ = 150°C dc 3 2 1 0 0 1 2 3 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 9. Maximum Forward Power Dissipation http://onsemi.com 3 4 4 MURS360BT3 100 50% Duty Cycle R(t) (°C/W) 10 20% 10% 5% 2% 1 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (s) 1 Figure 10. Thermal Response, Junction-to-Ambient http://onsemi.com 4 10 100 1000 MURS360BT3 PACKAGE DIMENSIONS SMB DO-214AA CASE 403A-03 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. E b DIM A A1 b c D E HE L L1 D MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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