NUF8410MN Low Capacitance 8 Line EMI Filter with ESD Protection This device is an 8 line EMI filter array for wireless applications. Greater than −20 dB attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. Features 1 • EMI Filtering and ESD Protection • Integration of 40 Discrete Components • Compliance with IEC61000−4−2 (Level 4) • • • • http://onsemi.com 16 Cd Cd 2 15 Cd > 8 kV (Contact) DFN Package, 1.6 x 4.0 mm Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C Human Body Model = 3B This is a Pb−Free Device* Cd 14 3 Cd Cd 4 13 Cd Cd 5 12 Benefits • Reduces EMI/RFI Emmisions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass • Filter Response Integrated Solution Improves System Reliability 6 11 Cd Cd Cd Cd 10 8 9 EMI Filtering and ESD Protection for Data Lines Wireless Phones Handheld Products Notebook Computers LCD Displays 1 Cd 7 Applications • • • • • Cd 2 3 4 5 6 7 Cd Cd (Top View) MARKING DIAGRAM 16 8 1 DFN CASE 506AC 840 AYW G 1 GND 16 15 14 13 12 11 (Bottom View) 10 840 A Y W G 9 ORDERING INFORMATION Figure 1. Pin Connections *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 0 = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package 1 Device Package Shipping† NUF8410MNT4G DFN16 (Pb−Free) 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF8410MN/D NUF8410MN MAXIMUM RATINGS Parameter Symbol ESD Discharge IEC61000−4−2 Value VPP Unit kV Contact Discharge 8.0 Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Symbol Test Conditions Min Typ VRWM VBR IR = 1.0 mA Leakage Current IR VRWM = 3.3 V Resistance RA IR = 20 mA Capacitance (Notes 1 and 2) Cd Cut−Off Frequency (Note 3) f3dB Above this frequency, appreciable attenuation occurs 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total Line Capacitance is 2 times the Diode Capacitance (Cd). 3. 50 source and 50 load termination. http://onsemi.com 2 Max Unit 5.0 V 8.0 V 6.0 7.0 100 nA 85 100 115 − 8.5 11 pF 250 MHz NUF8410MN TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 −5 −10 S21 (dB) −15 −20 −25 −30 −35 −40 −45 1.0E+6 1.0E+7 1.0E+8 1.0E+9 1.0E+10 FREQUENCY (Hz) 1.6 110 1.4 108 106 1.2 RESISTANCE () NORMALIZED CAPACITANCE Figure 2. Insertion Loss Characteristic 1.0 0.8 0.6 0.4 102 100 98 96 94 0.2 0 104 92 0 1.0 2.0 3.0 4.0 90 −40 5.0 −20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 3. Typical Capacitance Figure 4. Typical Resistance over Temperature http://onsemi.com 3 NUF8410MN PACKAGE DIMENSIONS DFN16 CASE 506AC−01 ISSUE B A D B PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. E 2X 0.15 C TOP VIEW 2X (A3) DIM A A1 A3 b D D2 E E2 e K L 0.15 C (A3) 0.10 C A 16X 0.08 C SEATING PLANE SIDE VIEW A1 C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.20 −−− 0.20 0.40 D2 16X L 1 e 2X 0.25 x 0.40 mm TEST PAD SIZE 8 SOLDERING FOOTPRINT* 4.10 E2 16X K 16 9 16X b NOTE 3 14X 0.50 PITCH 0.10 C A B 0.05 C BOTTOM VIEW 0.50 1.91 16X 0.28 16X 0.51 SCALE 16:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 For additional information, please contact your local Sales Representative. NUF8410MN/D