CS5201−1 1.0 A Adjustable Linear Regulator The CS5201−1 linear regulator provides 1.0 A with an output voltage accuracy of ±1.0 %. The device uses two external resistors to set the output voltage within a 1.25 V to 5.5 V range. This regulator is intended for use as a post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages less than 1.2 V at 1.0 A output current. Device protection includes overcurrent and thermal shutdown. The CS5201 is pin compatible with the LT1086 family of linear regulators. The regulator is available in TO−220, surface mount D2, and SOT−223 packages. http://onsemi.com TO−220−3 T SUFFIX CASE 221A 1 2 3 D2PAK−3 DP SUFFIX CASE 418AB Features • • • • • • Pb−Free Package is Available Output Current to 1.0 A Output Accuracy to ±1.0% Overtemperature Dropout Voltage (typical) 1.0 V @ 1.0 A Fast Transient Response Fault Protection ♦ Current Limit ♦ Thermal Shutdown 5.0 V 12 Tab = VOUT Pin 1. Ad 2. VO 3. VI 3 1 23 SOT−223 ST SUFFIX CASE 318E ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEVICE MARKING INFORMATION VIN VOUT 3.3 V @ 1.0 A CS5201−1 124 W 1.0% Adj 10 mF 5.0 V See general marking information in the device marking section on page 7 of this data sheet. 0.1 mF 5.0 V Tant 200 W 1.0% 22 mF 5.0 V Figure 1. Applications Diagram © Semiconductor Components Industries, LLC, 2006 September, 2006 − Rev. 8 1 Publication Order Number: CS5201−1/D CS5201−1 MAXIMUM RATINGS Parameter Supply Voltage, VCC Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1) Reflow (SMD styles only) (Note 2) ESD Damage Threshold (Human Body Model) Value Unit 7.0 V −40 to +70 °C 150 °C −60 to +150 °C 260 Peak 230 Peak °C °C 2.0 kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 second maximum. 2. 60 second maximum above 183°C. ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 1.0 A) Characteristic Test Conditions Min Typ Max Unit 1.241 (−1.0%) 1.254 1.266 (+1.0%) V Adjustable Output Voltage Reference Voltage (Notes 3 and 4) VIN − VOUT = 1.5 V; VAdj = 0 V 10 mA ≤ IOUT ≤ 1.0 A Line Regulation 1.5 V ≤ VIN − VOUT ≤ 5.75 V; IOUT = 10 mA − 0.02 0.20 % Load Regulation (Notes 3 and 4) VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 1.0 A − 0.04 0.40 % Dropout Voltage (Note 5) IOUT = 1.0 A − 1.0 1.2 V Current Limit VIN − VOUT = 3.0 V; TJ ≥ 25°C 1.1 3.1 − A Minimum Load Current (Note 6) VIN = 7.0 V, VAdj = 0 V − 0.6 2.0 mA Adjust Pin Current VIN − VOUT = 3.0 V; IOUT = 10 mA − 50 100 mA Thermal Regulation (Note 7) 30 ms Pulse, TA = 25°C − 0.002 0.020 %/W Ripple Rejection (Note 7) f = 120 Hz; IOUT = 1.0 A; VIN − VOUT = 3.0 V; VRIPPLE = 1.0 VPP − 80 − dB Thermal Shutdown (Note 8) − 150 180 210 °C Thermal Shutdown Hysteresis (Note 8) − − 25 − °C 3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to temperature changes must be taken into account separately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. 6. The minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum load requirement. 7. Guaranteed by design, not 100% tested in production. 8. Thermal shutdown is 100% functionally tested in production. PACKAGE PIN DESCRIPTION Package Pin Number TO−220 D2PAK SOT−223 Pin Symbol 1 1 1 Adj 2 2 2 VOUT 3 3 3 VIN Function Adjust pin (low side of the internal reference). Regulated output voltage (case). Input voltage. http://onsemi.com 2 CS5201−1 VOUT VIN Output Current Limit Thermal Shutdown − + Error Amplifier Bandgap Reference Adj Figure 2. Block Diagram TYPICAL PERFORMANCE CHARACTERISTICS 1.00 0.10 0.08 0.95 Output Voltage Deviation (%) TCASE = 0°C VDROPOUT (V) TCASE = 25°C 0.90 0.85 TCASE = 125°C 0.80 0.06 0.04 0.02 0.00 −0.02 −0.04 −0.06 −0.08 −0.10 0.75 0 200 400 600 800 −0.12 1000 Figure 3. Dropout Voltage vs. Output Current Figure 4. Reference Voltage vs. Temperature 0.65 Minimum Load Current (mA) Output Voltage Deviation (%) 10 20 30 40 50 60 70 80 90 100 110 120 130 TJ (°C) 0.100 0.075 0.050 TCASE = 25°C 0.025 TCASE = 125°C 0.000 0 IOUT (mA) 1 TCASE = 0°C 0.55 TCASE = 125°C 0.50 0.45 CIN = COUT = 22 mF Tantalum TCASE = 0°C 0 TCASE = 25°C 0.60 0.40 2 1 2 3 4 5 6 Output Current (A) VIN − VOUT (V) Figure 5. Load Regulation vs. Output Current Figure 6. Minimum Load Current vs. VIN − VOUT http://onsemi.com 3 7 CS5201−1 85 70 IO = 10 mA 75 Ripple Rejection (dB) Adjust Pin Current (mA) 65 60 55 50 45 Load Step (mA) 55 TCASE = 25°C IOUT = 1.0 A (VIN − VOUT) = 3.0 V VRIPPLE = 1.0 VPP CAdj = 0.1 mF 45 35 25 0 15 101 10 20 30 40 50 60 70 80 90 100 110 120 130 103 104 105 Frequency (Hz) Figure 7. Adjust Pin Current vs. Temperature Figure 8. Ripple Rejection vs. Frequency 300 3.5 200 3.3 106 3.1 100 2.9 0 VOUT = 3.3 V −100 COUT = CIN = 22 mF Tantalum CAdj = 0.1 mF −200 2.7 2.5 2.3 2.1 1000 1.9 500 0 102 Temperature (°C) ISC (A) Voltage Deviation (mV) 40 65 1.7 0 1 2 3 4 5 6 7 8 9 1.5 10 1.0 1.5 2.0 2.5 3.0 3.5 Time (mS) VIN − VOUT (V) Figure 9. Transient Response Figure 10. Short Circuit Current vs. VIN − VOUT 4.0 APPLICATIONS INFORMATION The CS5201−1 linear regulator provides adjustable voltages at currents up to 1.0 A. The regulator is protected against overcurrent conditions and includes thermal shutdown. The CS5201−1 has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section. A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R2 that adds to the 1.25 V across R1 and sets the overall output voltage. The adjust pin current (typically 50 mA) also flows through R2 and adds a small error that should be taken into account if precise adjustment of VOUT is necessary. The output voltage is set according to the formula: Adjustable Operation VOUT + VREF The CS5201−1 has an output voltage range of 1.25 V to 5.5 V. An external resistor divider sets the output voltage as shown in Figure 11. The regulator maintains a fixed 1.25 V (typical) reference between the output pin and the adjust pin. ) R2Ǔ ǒR1 R1 ) IAdj R2 The term IAdj × R2 represents the error added by the adjust pin current. http://onsemi.com 4 CS5201−1 R1 is chosen so that the minimum load current is at least 2.0 mA. R1 and R2 should be the same type, e.g. metal film for best tracking overtemperature. While not required, a bypass capacitor from the adjust pin to ground will improve ripple rejection and transient response. A 0.1 mF tantalum capacitor is recommended for “first cut” design. Type and value may be varied to obtain optimum performance vs. price. fail−safe operation is required. One possible clamp circuit is illustrated in Figure 12; however, the design of clamp circuitry must be done on an application by application basis. Care must be taken to ensure the clamp actually protects the design. Components used in the clamp design must be able to withstand the short circuit condition indefinitely while protecting the IC. EXTERNAL SUPPLY VIN VIN C1 VOUT VOUT CS5201−1 Adj VREF IAdj CAdj R1 C2 VIN VOUT VAdj R2 Figure 11. Resistor Divider Scheme VOUT Short Circuit Protection Figure 12. Short Circuit Protection Circuit for High Voltage Application. The CS5201−1 linear regulator has an absolute maximum specification of 7.0 V for the voltage difference between VIN and VOUT. However, the IC may be used to regulate voltages in excess of 7.0 V. The main considerations in such a design are power−up and short circuit capability. In most applications, ramp−up of the power supply to VIN is fairly slow, typically on the order of several tens of milliseconds, while the regulator responds in less than one microsecond. In this case, the linear regulator begins charging the load as soon as the VIN to VOUT differential is large enough that the pass transistor conducts current. The load at this point is essentially at ground, and the supply voltage is on the order of several hundred millivolts, with the result that the pass transistor is in dropout. As the supply to VIN increases, the pass transistor will remain in dropout, and current is passed to the load until VOUT reaches the point at which the IC is in regulation. Further increase in the supply voltage brings the pass transistor out of dropout. The result is that the output voltage follows the power supply ramp−up, staying in dropout until the regulation point is reached. In this manner, any output voltage may be regulated. There is no theoretical limit to the regulated voltage as long as the VIN to VOUT differential of 7.0 V is not exceeded. However, the possibility of destroying the IC in a short circuit condition is very real for this type of design. Short circuit conditions will result in the immediate operation of the pass transistor outside of its safe operating area. Over−voltage stresses will then cause destruction of the pass transistor before overcurrent or thermal shutdown circuitry can become active. Additional circuitry may be required to clamp the VIN to VOUT differential to less than 7.0 V if Stability Considerations The output compensation capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response, and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet provides this information. A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the CS5201−1 the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by: DV + DI ESR For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close to the load as possible for the best results. http://onsemi.com 5 CS5201−1 Protection Diodes Calculating Power Dissipation and Heatsink Requirements When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS5201−1 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 13 is recommended. IN4002 (Optional) VIN CS5201−1 C1 Adj 1. 2. 3. 4. VOUT VOUT VIN The CS5201−1 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate Heatsink is used. The case is connected to VOUT on the CS5201−1, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: R1 C2 These four are related by the Equation TJ + TA ) P D R2 CAdj Output Voltage Sensing Since the CS5201−1 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For the adjustable regulator, the best load regulation occurs when R1 is connected directly to the output pin of the regulator as shown in Figure 14. If R1 is connected to the load, RC is multiplied by the divider ratio and the effective resistance between the regulator and the load becomes. (2) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A Heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction−to−case, RqJC (°C/W) 2. Thermal Resistance of the case to Heatsink, RqCS (°C/W) 3. Thermal Resistance of the Heatsink to the ambient air, RqSA (°C/W) These are connected by the Equation: where RC = conductor parasitic resistance. VIN VIN VOUT CS5201−1 R1 Adj (1) PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ ) R2Ǔ ǒR1 R1 RC RqJA The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: Figure 13. Protection Diode for Large Output Capacitors RC Maximum Ambient Temperature TA (°C) Power dissipation PD (Watts) Maximum junction temperature TJ (°C) Thermal resistance junction to ambient RqJA (°C/W) Conductor Parasitic Resistance RLOAD R2 Figure 14. Grounding Scheme for Adjustable Output Regulator to Minimize Parasitic Resistance Effects RqJA + RqJC ) RqCS ) RqSA http://onsemi.com 6 (3) CS5201−1 grease used?), and the contact area between the Heatsink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper Heatsink selected. For further discussion on Heatsink selection, see application note “Thermal Management,” document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com. The value for RqJA is calculated using Equation (3) and the result can be substituted in Equation (1). The value for RqJC is 3.5°C/W for a given package type based on an average die size. For a high current regulator such as the CS5201−1 the majority of the heat is generated in the power transistor section. The value for RqSA depends on the Heatsink type, while RqCS depends on factors such as package type, Heatsink interface (is an insulator and thermal ORDERING INFORMATION Type* Package Shipping † 1.0 A, Adj. Output TO−220−3, STRAIGHT 50 Units / Rail CS5201−1GDP3 1.0 A, Adj. Output D2PAK−3 50 Units / Rail CS5201−1GDPR3 1.0 A, Adj. Output D2PAK−3 750 / Tape & Reel CS5201−1GST3 1.0 A, Adj. Output SOT−223 80 Units / Rail CS5201−1GSTR3 1.0 A, Adj. Output SOT−223 2500 / Tape & Reel CS5201−1GSTR3G 1.0 A, Adj. Output SOT−223 (Pb−Free) 2500 / Tape & Reel Device CS5201−1GT3 *Consult your local sales representative for fixed output voltage versions. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS D2PAK−3 DP SUFFIX CASE 418AB TO−220−3 T SUFFIX CASE 221A SOT−223 ST SUFFIX CASE 318E CS ALYW 201−1 5201−1 AWLYWW CS 5201−1 AWLYWW 1 1 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week PACKAGE THERMAL DATA Parameter TO−220−3 D2PAK−3 SOT−223 Unit RqJC Typical 3.5 3.5 15 °C/W RqJA Typical 50 10−50* 156 °C/W * Depending on thermal properties of substrate. RqJA = RqJC + RqCA http://onsemi.com 7 CS5201−1 PACKAGE DIMENSIONS TO−220−3 T SUFFIX CASE 221A−08 ISSUE AA −T− F −B− 4 Q C T S A U 1 2 3 −Y− SEATING PLANE H K L R V G J N D 3 PL 0.25 (0.010) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U V INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.025 0.035 0.139 0.155 0.100 BSC −−− 0.280 0.012 0.045 0.500 0.580 0.045 0.060 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 0.045 −−− MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.64 0.89 3.53 3.93 2.54 BSC −−− 7.11 0.31 1.14 12.70 14.73 1.15 1.52 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 1.15 −−− Y D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O For D2PAK Outline and Dimensions − Contact Factory http://onsemi.com 8 CS5201−1 PACKAGE DIMENSIONS SOT−223 ST SUFFIX CASE 318E−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A F INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 4 S 1 2 B 3 D L G J C 0.08 (0003) M H MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 K SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CS5201−1/D