FCX605 120V NPN SILICON HIGH VOLTAGE DARLINGTON TRANSISTOR SUMMARY VCEO=120V; VCE(sat)= 1V; IC= 1A DESCRIPTION This new NPN Darlington transistor provides users with very efficeint performance combining low VCE (sat) and very high Hfe to give extremely low on state losses at 120V operation. This makes it deal for use in a variety of efficient driving functions including motors, lamps relays and solenoids and will also benefit circuits requiring high output current switching. SOT 89 FEATURES • Low Saturation Voltage • Hfe min 2K @ 1A • IC= 1A Continuous • SOT89 package with Plot 1W • Specification is also available in Eline and SOT223 package outlines C B APPLICATIONS E • Various driving functions - Lamps - Motors - Relays and solenoids • High output current switches E C ORDERING INFORMATION DEVICE REEL SIZE (inches) FCX605TA 7 TAPE WIDTH (mm) QUANTITY PER REEL 12mm embossed 1000 units DEVICE MARKING 605 ISSUE 2 - SEPTEMBER 2005 1 C B Top View FCX605 ABSOLUTE MAXIMUM RATINGS. PARAMETER SYMBOL LIMIT NPN UNIT Collector-Base Voltage V CBO 140 V Collector-Emitter Voltage V CEO 120 V Emitter-Base Voltage V EBO 10 V Peak Pulse Current I CM 4 A Continuous Collector Current IC 1 A Power Dissipation at TA=25°C (a) Linear Derating Factor PD 1 8 W mW/°C Power Dissipation at TA=25°C (b) Linear Derating Factor PD 2.8 22 W mW/°C Operating and Storage Temperature Range T j :T stg -55 to +150 °C THERMAL RESISTANCE PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) R θJA 125 °C/W Junction to Ambient (b) R θJA 45 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t⭐5 secs. ISSUE 2 - SEPTEMBER 2005 2 FCX605 ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated). PARAMETER SYMBOL MIN. Collector-Base Breakdown Voltage V (BR)CBO Collector-Emitter Breakdown Voltage TYP. MAX. UNIT CONDITIONS. 140 V I C =100A V (BR)CEO 120 V I C =10mA* Emitter-Base Breakdown Voltage V (BR)EBO 10 V I E =100A Collector Cut-Off Current I CBO 100 nA V CB =10V 10 µA V CB = 120V Tamb = 100°C Emitter Cut-Off Current I EBO 0.1 µA V EB = 8V Collector Emitter Cut-Off Current I CES 10 µA V CES =120V Collector-Emitter Saturation Voltage V CE(sat) Base-Emitter Saturation Voltage 1 V 1.5 V I C =250mA, I B = 0.25mA* I C =1A, I B =1mA* V BE(sat) 1.8 V I C =1A, I B = 1mA* Base-Emitter Turn-On Voltage V BE(on) 1.7 V I C = 1A, V CE = 5V* Static Forward Current Transfer Ratio h FE Transition Frequency fT Input Capacitance C ibo Output Capacitance 2K 5K 2K 0.5 I C = 50mA, V CE = 5V* I C =500mA, V CE = 5V* I C =1A, V CE = 5V* I C =2A, V CE = 5V* 100K 150 MHz I C =100mA, V CE =10V f=20MHz 90 pF V CB =500mV, f=1MHz C obo 15 pF V CB =10V, f=1MHz Turn-On Time t (on) 0.5 µs I C =500mA, V CE =10V I B1 =I B2 =0.5mA Turn-Off Time t (off) 1.6 µs I C =500mA, V CE =10V I B1 =I B2 =0.5mA *Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤ 2% Nb. Spice parameter data is available upon request for this device. ISSUE 2 - SEPTEMBER 2005 3 FCX605 NPN TYPICAL CHARACTERISTICS 1.8 -55 C +25 C +100 C +175 C 1.4 2.5 hFE - Gain normalised to 1 Amp VCE(sat) - (Volts) 1.6 1.2 IC/IB=100 1.0 0.8 0.6 0.4 0.2 0 0.01 1 10 VCE=5V 2.0 1.5 1.0 0.5 0.001 0.01 0.1 1 IC - Collector Current (Amps) IC - Collector Current (Amps) VCE(sat) v IC hFE v IC 2.2 2.2 -55 C +25 C +100 C +175 C 2.0 1.8 1.8 1.6 1.4 1.2 IC/IB=100 1.0 1.6 1.4 1.2 1.0 0.8 0.8 0.6 0.6 0.4 0.01 10 -55 C +25 C +100 C 2.0 VBE - (Volts) VBE(sat) - (Volts) 0.1 -55 C +25 C +100 C 0.1 1 VCE=5V 0.4 10 0.01 IC - Collector Current (Amps) 0.1 1 10 IC - Collector Current (Amps) VBE(sat) v IC VBE(on) v IC Single Pulse Test at Tamb=25 C IC - Collector Current (Amps) 10 1.0 D.C. 1s 100ms 10ms 1.0ms 100µs 0.1 ZT X6 04 ZTX605 0.01 1 10 100 1000 VCE - Collector Voltage (Volts) Safe Operating Area ISSUE 2 - SEPTEMBER 2005 4 FCX605 PACKAGE DIMENSIONS PAD LAYOUT DETAILS 2.4 4.0 1.5 1.2 1.0 3.2 1.2 SOT89 pattern. PACKAGE DIMENSIONS Millimeters Inches DIM Millimeters Inches DIM Min Max Min Max Min Max Min Max A 1.40 1.60 0.550 0.630 e 1.40 1.50 0.055 0.059 b 0.38 0.48 0.015 0.019 E 3.75 4.25 0.150 0.167 b1 - 0.53 - 0.021 E1 - 2.60 - 0.102 b2 1.50 1.80 0.060 0.071 G 2.90 3.00 0.114 0.118 c 0.28 0.44 0.011 0.017 H 2.60 2.85 0.102 0.112 © Zetex Semiconductors plc 2005 Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Zetex Semiconductors plc Zetex Technology Park Chadderton, Oldham, OL9 9LL United Kingdom Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 [email protected] Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 [email protected] These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 2 - SEPTEMBER 2005 5