NL27WZ125 Dual Buffer with 3-State Outputs The NL27WZ125 is a high performance dual noninverting buffer operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • • http://onsemi.com Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3−State OE Input is Active−Low Replacement for NC7WZ125 Chip Complexity = 72 FETs These Devices are Pb−Free and are RoHS Compliant MARKING DIAGRAM 8 M0 M G G US8 US SUFFIX CASE 493 1 M0 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT OE1 1 A1 8 2 Y2 7 3 GND 6 4 5 VCC OE2 Y1 Pin Function 1 OE1 2 A1 3 Y2 4 GND 5 A2 6 Y1 7 OE2 8 VCC A2 FUNCTION TABLE Output Input Figure 1. Pinout (Top View) A1 OE1 EN 1 A2 OE2 L L L H H H X Z ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 2. Logic Symbol April, 2012 − Rev. 8 An L X = Don’t Care n = 1, 2 Y1 Y2 © Semiconductor Components Industries, LLC, 2012 Yn OEn 1 Publication Order Number: NL27WZ125/D NL27WZ125 MAXIMUM RATINGS Symbol Value Units DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage Output in High Impedance State Output in HIGH or LOW State −0.5 to +7.0 −0.5 to VCC + 0.5 IIK DC Input Diode Current, VI < GND −50 mA IOK DC Output Diode Current, VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range VCC Parameter V ±100 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias +150 °C JA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR VESD Moisture Sensitivity Level 1 Flammability Rating − Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V > 2000 > 200 N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC Supply Voltage Operating Data Retention Only 1.65 1.5 5.5 5.5 V VI Input Voltage (Note 5) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 °C t/V Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 20 10 5 ns/V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. DEVICE ORDERING INFORMATION Device Order Number NL27WZ125USG Package Type Shipping† US8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NL27WZ125 DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = 100 A IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIL IOL = 100 A IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 Input Leakage Current VIN = 5.5V or GND IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current IOZ 3−State Output Leakage IIN Condition TA = 255C VCC (V) Typ −555C 3 TA 3 1255C Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.52 2.1 2.4 2.7 2.5 4.0 Units V 0.25 VCC 0.3 VCC VCC−0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 ±0.1 ±1.0 A 0 1.0 10 A VIN = 5.5V or GND 5.5 1.0 10 A VIN = VIL or VIH 0V ≤ VOUT ≤ 5.5 V 2.3 to 5.5 ±0.5 ±5 A 0.08 0.20 0.22 0.28 0.38 0.42 2.3 2.7 3.0 3.0 4.5 AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) Symbol tPLH tPHL Parameter Propagation Delay AN to YN (Figures 3 and 4) tOSLH tOSHL Output to Output Skew (Note 6) tPZH tPZL Output Enable Time (Figures 5, 6 and 7) tPHZ tPLZ TA = 255C VCC (V) Min RL = 1 M, CL = 15 pF 1.8 ± 0.15 2.5 ± 0.2 RL = 1 M, CL = 15 pF RL = 500 , CL = 50 pF Max Min Max Units 2.0 1.0 12 7.5 2.0 1.0 13 8 ns 3.3 ± 0.3 0.8 1.2 5.2 5.7 0.8 1.2 5.5 6.0 RL = 1 M, CL = 15 pF RL = 500 , CL = 50 pF 5.0 ± 0.5 0.5 0.8 4.5 5.0 0.5 0.8 4.8 5.3 RL = 500 , CL = 50 pF 3.3 ± 0.3 1.0 1.0 RL = 500 , CL = 50 pF 5.0 ± 0.5 0.8 0.8 Condition Output Enable Time (Figures 5, 6 and 7) Typ −555C 3 TA 3 1255C 1.8 ± 0.15 2.5 ± 0.2 3.0 1.8 14 8.5 3.0 1.8 15 9.0 3.3 ± 0.3 1.2 6.2 1.2 6.5 5.0 ± 0.5 0.8 5.5 0.8 5.8 1.8 ± 0.15 2.5 ± 0.2 2.5 1.5 12 8.0 2.5 1.5 13 8.5 3.3 ± 0.3 0.8 5.7 0.8 6.0 5.0 ± 0.5 0.3 4.7 0.3 5.0 ns ns ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 3 NL27WZ125 CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Condition Typical Units Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 7.0 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 18 27 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B OE = GND VCC 90% 50% INPUT 50% 10% 10% tPHL CL * GND RL tPLH VOH OUTPUT Y OUTPUT *Includes all probe and jig capacitance. A 1 MHz square input wave is recommended for propagation delay tests. 50% 50% VOL Figure 3. Switching Waveform Figure 4. TPLH or TPHL VCC 50% 50% OE 0V tPZH tPHZ VCC VOH − 10% 50% On ≈0V tPZL tPLZ ≈ VCC 50% On VOL + 10% GND Figure 5. AC Output Enable and Disable Waveform 2 INPUT VCC R1 = 500 VCC INPUT OUTPUT CL = 50 pF OUTPUT CL = 50 pF RL = 500 RL = 250 A 1 MHz square input wave is recommended for propagation delay tests. A 1 MHz square input wave is recommended for propagation delay tests. Figure 6. TPZL or TPL Figure 7. TPZH or TPHZ http://onsemi.com 4 NL27WZ125 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER− LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC DIM A B C D F G H J K L M N P R S U V INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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