B048F040T20 B048F040M20 V•I BCMTM Bus Converter • 48 V to 4 V V•I ChipTM Converter • Typical efficiency 94% • 200 Watt (300 Watt for 1 ms) • 125°C operation (TJ) • High density – 169 A/in3 • <1 µs transient response • Small footprint – 40 A/in2 • Low weight – 0.5 oz (15 g) © • 3.5 million hours MTBF • No output filtering required • ZVS / ZCS isolated Sine Amplitude Converter Product Description Vin = 38 - 55 V Vout = 3.17 - 4.58 V Iout = 50 A K = 1/12 Rout = 3.6 mΩ max Absolute Maximum Ratings The V•I Chip Bus Converter Module is a high efficiency (>94%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 3.17 V to 4.58 V secondary. The BCM may be used to power non-isolated POL converters or as an independent 3.17 – 4.58 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced—or eliminated—resulting in savings of board area, materials and total system cost. The BCM achieves a current density of 169 A/in3 in a V•I Chip package compatible with standard pick-andplace and surface mount assembly process. The V•I Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments. Parameter +In to -In Values Unit -1.0 to 60 Vdc Notes +In to -In 100 Vdc PC to -In -0.3 to 7.0 Vdc +Out to -Out -0.5 to 12 Vdc 2,250 Vdc 58 A Continuous 75.0 A For 1 ms Isolation voltage Output current Peak output current For 100 ms Input to output Output power 200 W Continuous Peak output power 300 W For 1 ms 225 °C During reflow MSL 5 -40 to 125 °C T-Grade Case temperature Operating junction temperature (1) Storage temperature -55 to 125 °C M-Grade -40 to 125 °C T-Grade -65 to 125 °C M-Grade Note: (1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator. Part Numbering B 048 Bus Converter Module F 800-735-6200 T Output Voltage Designator (=VOUT x10) Input Voltage Designator Configuration F = J-lead T = Through hole vicorpower.com 040 V•I Chip Bus Converter Module 20 Output Power Designator (=POUT /10) Product Grade Temperatures (°C) Grade Storage Operating (TJ) T -40 to125 -40 to125 M -65 to 125 -55 to 125 B048F040T20 Rev. 2.5 Page 1 of 12 Specifications V•I Chip Bus Converter Module Input (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Input voltage range Input dV/dt Input undervoltage turn-on Input undervoltage turn-off Input overvoltage turn-on Input overvoltage turn-off Input quiescent current Inrush current overshoot Input current Input reflected ripple current No load power dissipation Internal input capacitance Internal input inductance Recommended external input capacitance Min Typ Max Unit 38 48 55 1 37.4 Vdc V/µs Vdc Vdc Vdc Vdc mA A Adc mA p-p W µF nH µF 32.6 55.0 59.0 2.9 3.7 4.6 114 3.9 1.9 5 47 4.8 Note PC low Using test circuit in Figure 20; See Figure 1 Using test circuit in Figure 20; See Figure 4 200 nH maximum source inductance; See Figure 20 Input Waveforms Figure 1 — Inrush transient current at full load and 48 Vin with PC enabled Figure 2 — Output voltage turn-on waveform with PC enabled at full load and 48 Vin Figure 3 — Output voltage turn-on waveform with input turn-on at full load and 48 Vin Figure 4 — Input reflected ripple current at full load and 48 Vin vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 2 of 12 Specifications (continued) V•I Chip Bus Converter Module Output (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Min Typ 3.17 2.99 0 0 0 Output voltage Output power Rated DC current Peak repetitive power Current share accuracy Efficiency Half load Full load Internal output inductance Internal output capacitance Load capacitance Output overvoltage setpoint Output ripple voltage No external bypass 47 µF bypass capacitor Short circuit protection set point Average short circuit current Effective switching frequency Line regulation K Load regulation ROUT Transient response Voltage overshoot Response time Recovery time Output overshoot Input turn-on PC enable Output turn-on delay From application of power From release of PC pin 5 93.8 93.5 Max Unit Note 4.58 4.42 200 172 58 Vdc Vdc W W Adc 300 W 10 % No load Full load 44 - 55 VIN 38 - 55 VIN POUT ≤ 200 W Max pulse width 1ms, max duty cycle 10%, baseline power 50% See Parallel Operation on Page 10 94.8 94.5 1.1 255 9,100 4.6 216 8 305 59.8 2.40 0.77 2.55 2.70 0.0825 1/12 0.0842 2.8 3.6 % % nH µF µF Vdc See Figure 5 See Figure 5 Effective value Module will shut down mVp-p mVp-p Adc A MHz See Figures 7 and 9 See Figure 8 Module will shut down Fixed, 1.3 MHz per phase VOUT = K•VIN at no load mΩ 110 200 1 mV ns µs 100% load step; See Figures 10 and 11 See Figures 10 and 11 See Figures 10 and 11 0 0 mV mV No output filter; See Figure 3 No output filter; See Figure 2 215 75 ms ms No output filter; See Figure 3 No output filter Output Waveforms Efficiency vs. Output Power Power Dissipation 96 14 Power Dissipation (W) Efficiency (%) 94 92 90 88 86 84 82 12 10 8 6 4 2 0 20 40 60 80 100 120 140 160 180 200 0 20 40 80 100 120 140 160 180 200 Output Power (W) Output Power (W) Figure 5 — Efficiency vs. output power vicorpower.com 60 Figure 6 — Power dissipation as a function of output power 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 3 of 12 Specifications (continued) V•I Chip Bus Converter Module Figure 8 — Output voltage ripple at full load and 48 Vin with 47 µF ceramic external bypass capacitor and 20 nH of distribution inductance. Figure 7 — Output voltage ripple at full load and 48 Vin without any external bypass capacitor. Ripple vs. Output Power Output Ripple (mVpk-pk) 220 200 180 160 140 120 100 80 0 20 40 60 80 100 120 140 160 180 200 Output Power (W) Figure 9 — Output voltage ripple vs. output power at 48 Vin without any external bypass capacitor. Figure 10 — 0 -50 A load step with 100 µF input capacitor and no output capacitor. Figure 11 — 50- 0 A load step with 100 µF input capacitor and no output capacitor. vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 4 of 12 Specifications (continued) V•I Chip Bus Converter Module General Parameter Min MTBF MIL-HDBK-217F Isolation specifications Voltage Capacitance Resistance Typ Max Unit Note 3.5 Mhrs 25°C, GB 3,000 Vdc pF MΩ Input to output Input to output Input to output UL /CSA 60950-1, EN 60950-1 Low voltage directive 2,250 10 cTÜVus CE Mark RoHS Agency approvals Mechanical Weight Dimensions Length Width Height Thermal Over temperature shutdown Thermal capacity Junction-to-case thermal impedance (RθJC) Junction-to-board thermal impedance (RθJB) See Mechanical Drawings, Figures 15 – 18 0.53/15 oz /g 1.28/ 32,5 0.87 / 22 0.265 / 6,73 in / mm in / mm in / mm 125 130 9.3 1.1 2.1 135 °C Ws /°C °C / W °C / W Junction temperature Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Min Typ Max 5.2 Unit Note Primary control (PC) DC voltage 4.8 5.0 Module disable voltage 2.4 2.5 Module enable voltage Current limit 2.4 Vdc Vdc 2.5 2.6 Vdc 2.5 2.9 mA Enable delay time 75 ms Disable delay time 30 µs See Figure 12, time from PC low to output low Figure 13 — PC signal during fault Figure 12 — VOUT at full load vs. PC disable vicorpower.com Source only 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 5 of 12 Pin / Control Functions V•I Chip Bus Converter Module +In / -In – DC Voltage Input Ports The V•I Chip input voltage range should not be exceeded. An internal under / over voltage lockout function prevents operation outside of the normal operating input range. The BCM turns on within an input voltage window bounded by the “Input under-voltage turn-on” and “Input over-voltage turn-off” levels, as specified. The V•I Chip may be protected against accidental application of a reverse input voltage by the addition of a rectifier in series with the positive input, or a reverse rectifier in shunt with the positive input located on the load side of the input fuse. The connection of the V•I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be 47 µF in series with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. PC – Primary Control The Primary Control port is a multifunction node that provides the following functions: Enable / Disable – If the PC port is left floating, the BCM output is enabled. Once this port is pulled lower than 2.4 Vdc with respect to –In, the output is disabled. This action can be realized by employing a relay, opto-coupler, or open collector transistor. Refer to Figures 1-3, 12 and 13 for the typical enable / disable characteristics. This port should not be toggled at a rate higher than 1 Hz. The PC port should also not be driven by or pulled up to an external voltage source. 4 3 2 +Out B B C C D D +In E E -Out 1 A A F G H TM H J RSV J K PC K +Out -Out L L M M N N P P R R -In T T Bottom View Signal Name +In –In TM RSV PC +Out –Out Designation A1-E1, A2-E2 L1-T1, L2-T2 H1, H2 J1, J2 K1, K2 A3-D3, A4-D4, J3-M3, J4-M4 E3-H3, E4-H4, N3-T3, N4-T4 Primary Auxiliary Supply – The PC port can source up to 2.4 mA at 5.0 Vdc. The PC port should never be used to sink current. Alarm – The BCM contains circuitry that monitors output overload, input over voltage or under voltage, and internal junction temperatures. In response to an abnormal condition in any of the monitored parameters, the PC port will toggle. Refer to Figure 13 for PC alarm characteristics. Figure 14 — BCM pin configuration TM and RSV – Reserved for factory use. +Out / -Out – DC Voltage Output Ports Two sets of contacts are provided for the +Out port. They must be connected in parallel with low interconnect resistance. Similarly, two sets of contacts are provided for the –Out port. They must be connected in parallel with low interconnect resistance. Within the specified operating range, the average output voltage is defined by the Level 1 DC behavioral model of Figure 21. The current source capability of the BCM is rated in the specifications section of this document. The low output impedance of the BCM reduces or eliminates the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters. Total load capacitance at the output of the BCM should not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the BCM, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the BCM. vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 6 of 12 Mechanical Drawings V•I Chip Bus Converter Module BOTTOM VIEW TOP VIEW ( COMPONENT SIDE ) NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com Figure 15 — BCM J-Lead mechanical outline; Onboard mounting RECOMMENDED LAND PATTERN ( COMPONENT SIDE SH OWN ) NOTES: mm 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 3. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com Figure 16 — BCM PCB land layout information vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 7 of 12 Mechanical Drawings (continued) V•I Chip Bus Converter Module TOP VIEW ( COMPONENT SIDE ) BOTTOM VIEW NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com Figure 17 — BCM through-hole mechanical outline NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] RECOMMENDED HOLE PATTERN ( COMPONENT SIDE SHOWN ) 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com Figure 18 — BCM through-hole PCB layout information vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 8 of 12 Configuration Options V•I Chip Bus Converter Module 2.95±0.07 ø (2) PL [0.116±0.003] NON-PLATED THROUGH HOLE SEE NOTE 1. NOTES: 1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF COPPER. ALL PCB LAYERS. 2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555]. THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING. AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS. (4.37) 0.172 (11.37) 0.448 3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY; ACTUAL LAND PATTERN MAY DIFFER. DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS. (mm) 4. DIMENSION ARE inch . (36.50) 1.437 (18.25) 0.719 DOTTED LINE INDICATES VIC POSITION SEE NOTE 3 (7.00) 0.276 (2.510) 0.099 (31.48) 1.240 (39.50) 1.555 SEE NOTE 2. HEAT SINK PUSH-PIN HOLE PATTERN ( TOP SIDE SHOWN ) SEE NOTE 3 Figure 19 — Hole location for push pin heat sink relative to V•I Chip vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 9 of 12 Application Note V•I Chip Bus Converter Module Parallel Operation The BCM will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to each BCM within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. The BCM power train and control architecture allow bi-directional power transfer, including reverse power processing from the BCM output to its input. Reverse power transfer is enabled if the BCM input is within its operating range and the BCM is otherwise enabled. The BCM’s ability to process power in reverse improves the BCM transient response to an output load dump. Input Impedance Recommendations To take full advantage of the BCM capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance (less than 100 nH) and should have a critically damped response. If the interconnect vicorpower.com 800-735-6200 inductance exceeds 100 nH, the BCM input pins should be bypassed with an RC damper (e.g., 47 µF in series with 0.3 ohm) to retain low source impedance and stable operations. Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the BCM is operated near low or high line as the over/under voltage detection circuitry could be activated. Input Fuse Recommendations V•I Chips are not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of V•I Chips must always be incorporated within the power system. A fast acting fuse should be placed in series with the +In port. Application Notes For BCM and V•I Chip application notes on soldering, thermal management, board layout, and system design click on the link below: http://www.vicorpower.com/technical_library/application_information/chips/ V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 10 of 12 Application Note (continued) V•I Chip Bus Converter Module Input reflected ripple measurement point F1 6A Fuse +Out +In + Enable/Disable Switch -Out C1 47 µF TM RSV PC R2 2 kΩ electrolytic SW1 D1 -In K Ro Source inductance should be no more than 200 nH. If source inductance is greater than 200 nH, additional bypass capacitance may be required. R3 10 mΩ BCM Load C3 47 µF +Out Notes: R3 may be ESR of C3 or a separate damping resistor. – -Out C3 should be placed close to the load. D1 power good indicator will dim when a module fault is detected. Figure 20 — BCM test circuit V•I Chip Bus Converter Level 1 DC Behavioral Model for 48 V to 4 V, 200 W ROUT IOUT + + 2.8 mΩ 1/12 • Iout VIN V•I + + – IQ 81 mA 1/12 • Vin VOUT – K – – © Figure 21 — This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation. V•I Chip Bus Converter Level 2 Transient Behavioral Model for 48 V to 4 V, 200 W 0.23 nH ROUT IOUT L IN = 5 nH + 2.8 mΩ RCIN 1.3 mΩ CIN VIN Lout V• I 1/12 • Iout + + – 1.9 µF IQ 81 mA RCOUT 0.96 mΩ 1.1 nH + 0.7 mΩ 1/12 • Vin COUT 255 µF VOUT – K – – © Figure 22 — This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or without external filtering elements. vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 Page 11 of 12 Warranty Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the original purchaser only. EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Vicor will repair or replace defective products in accordance with its own best judgement. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes all risks of such use and indemnifies Vicor against all damages. Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to change without notice. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intellectual Property Department. The products described on this data sheet are protected by the following U.S. Patents Numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and 6,984,965 Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Customer Service: [email protected] Technical Support: [email protected] vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F040T20 Rev. 2.5 9/09