VICOR B352F110T24

PRELIMINARY
V•I Chip Bus Converter Module
B352F110T24
BCM
V•I Chip – BCM
Bus Converter Module
TM
• 352 V to 11.0 V V•I Chip Converter
• Typical efficiency 95%
• 240 Watt (360 Watt for 1 ms)
• 125°C operation
• High density – up to 876 W/in3
• <1 µs transient response
• Small footprint – 210 W/in2
• >2.6 million hours MTBF
• Low weight – 0.5 oz (14 g)
• No output filtering required
©
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 21.8 A
K = 1/32
Rout = 15.0 mΩ max
• ZVS/ZCS isolated sine
amplitude converter
Product Description
Actual size
Absolute Maximum Ratings
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>95%), narrow input range Sine Amplitude
Converter (SAC) operating from a 330 to 365 Vdc
primary bus to deliver an isolated low voltage secondary.
The off-line BCM provides an isolated 10.3 -11.4 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 876 W/in3 in
a V•I Chip package compatible with standard pick-andplace and surface mount assembly processes. The V•I
Chip package provides flexible thermal management
through its low Junction-to-Case and Junction-to-Board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction to case and junction to lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Parameter
+In to -In
Values
Unit
-1.0 to 400
Vdc
+In to -In
500
Vdc
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
Notes
For 100 ms
-0.5 to 16.0
Vdc
Isolation voltage
4,242
Vdc
Output current
24.1
A
Continuous
Peak output current
32.7
A
For 1 ms
Input to Output
Output power
240
W
Continuous
Peak output power
360
W
For 1 ms
Case temperature
Operating junction temperature(1)
Storage temperature
208
°C
During reflow
-40 to 125
°C
T - Grade
-55 to 125
°C
M - Grade
-40 to 150
°C
T - Grade
-65 to 150
°C
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
352
Bus Converter
Module
F
Input Voltage
Designator
Configuration
(Figure 15)
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
110
T
Output Voltage
Designator
(=VOUT x10)
24
Output Power
Designator
(=POUT/10)
Product Grade Temperatures (°C)
Grade
Storage
Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
B352F110T24
Rev. 1.1
Page 1 of 13
PRELIMINARY
Specifications
V•I Chip Bus Converter Module
Input (Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Input voltage range
Input dV/dt
Input undervoltage turn-on
Input undervoltage turn-off
Input overvoltage turn-on
Input overvoltage turn-off
Input quiescent current
Inrush current overshoot
Input current
Input reflected ripple current
No load power dissipation
Internal input capacitance
Internal input inductance
Recommended external input capacitance
330
352
365
1
325
Vdc
V/µs
Vdc
Vdc
Vdc
Vdc
mA
A
Adc
mA p-p
W
µF
nH
µF
275
370
395
1.2
0.2
0.7
610
4.9
0.25
5
2
7.0
Note
PC low
Using test circuit in Figure 25; See Figure 1
Using test circuit in Figure 25; See Figure 4
200 nH maximum source inductance; See Figure 25
Input Waveforms
Figure 1— Inrush transient current at full load and 352 Vin with PC
enabled
Figure 2— Output voltage turn-on waveform with PC enabled at full load
and 352 Vin
Figure 3— Output voltage turn-on waveform with input turn-on at full
load and 352 Vin
Figure 4— Input reflected ripple current at full load and 352 Vin
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 2 of 13
PRELIMINARY
Specifications
V•I Chip Bus Converter Module
(continued)
Output (Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
10.3
9.99
0
0
Output voltage
Output power
Rated DC current
Peak repetitive power
Current share accuracy
Efficiency
Half load
Full load
Internal output inductance
Internal output capacitance
Load capacitance
Output overvoltage setpoint
Output ripple voltage
No external bypass
5
94.5
94.7
Max
Unit
Note
11.4
11.1
240
24.1
Vdc
Vdc
W
Adc
360
W
10
%
No load
Full load
330 - 365 VIN
POUT≤240 W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
See Parallel Operation on page 9
95.6
95.8
1.1
31
1,000
11.6
240
10 µF bypass capacitor
Short circuit protection set point
Average short circuit current
Effective switching frequency
Line regulation
K
Load regulation
ROUT
Transient response
Voltage overshoot
Response time
Recovery time
Output overshoot
Input turn-on
PC enable
Output turn-on delay
From application of power
From release of PC pin
%
%
nH
µF
µF
Vdc
See Figure 5
See Figure 5
Effective value
300
mV p-p
See Figures 7 and 9
mV p-p
Adc
A
MHz
See Figure 8
Module will shut down
14
30.0
3.3
0.12
3.5
3.7
0.0309
1/32
0.0316
11.0
15.0
Fixed, 1.75 MHz per phase
VOUT = K•VIN at no load
mΩ
46
200
1
mV
ns
µs
100% load step; See Figures 10 and 11
See Figures 10 and 11
See Figures 10 and 11
0
0
mV
mV
No output filter; See Figure 3
No output filter; See Figure 2
800
250
ms
ms
No output filter; See Figure 3
No output filter
Output Waveforms
Power Dissipation
Efficiency vs. Output Power
13
98
12
Power Dissipation (W)
100
Efficiency (%)
96
94
92
90
88
86
84
11
10
9
8
7
6
5
4
82
3
80
0
24
48
72
96
120
144
168
192
216
240
0
24
48
72
Output Power (W)
120
144
168
192
216
240
Output Power (W)
Figure 6—Power dissipation as a function of output power
Figure 5— Efficiency vs. output power at 352 Vin
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 3 of 13
PRELIMINARY
Specifications
(continued)
V•I Chip Bus Converter Module
Figure 7— Output voltage ripple at full load and 352 Vin; without any
external bypass capacitor.
Figure 8—Output voltage ripple at full load and 352 Vin with 10 µF
ceramic external bypass capacitor and 20 nH of distribution inductance.
Ripple vs. Output Power
236
Output Ripple (mV)
216
196
176
156
136
116
96
76
56
0
20
40
60
80
100 120 140 160 180 200 220 240
Output Power (W)
Figure 9— Output voltage ripple vs. output power at 352 Vin without any
external bypass capacitor.
Figure 10— 0 -21.8 A load step with 2 µF input capacitor and no
output capacitor.
Figure 11— 21.8- 0 A load step with 2 µF input capacitance.
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 4 of 13
PRELIMINARY
Specifications
(continued)
V•I Chip Bus Converter Module
General
Parameter
Min
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Typ
Max
Unit
Note
2.6
Mhrs
25°C, GB
500
Vdc
pF
MΩ
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low Voltage Directive
See mechanical drawing, Figures 15
4,242
10
cTÜVus
CE Mark
Mechanical parameters
Weight
Dimensions
Length
Width
Height
0.50 / 14
oz / g
1.26 / 32
0.87 / 22
0.25 / 6,2
in / mm
in / mm
in / mm
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
4.8
2.4
5.0
2.5
2.5
2.5
250
20
5.2
Vdc
Vdc
Vdc
mA
ms
µs
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Enable delay time
Disable delay time
2.4
Figure 12— VOUT at full load vs. PC disable
vicorpower.com
2.6
2.9
Note
Source only
See Figure 12, time from PC low to output low
Figure 13— PC signal during fault
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 5 of 13
PRELIMINARY
Pin/Control Functions
V•I Chip Bus Converter Module
+IN/-IN – DC Voltage Input Ports
The V•I Chip input voltage range should not be exceeded. An internal
under/over voltage lockout-function prevents operation outside of the
normal operating input range. The BCM turns ON within an input voltage
window bounded by the “Input under-voltage turn-on” and “Input overvoltage turn-off” levels, as specified. The V•I Chip may be protected
against accidental application of a reverse input voltage by the addition
of a rectifier in series with the positive input, or a reverse rectifier in
shunt with the positive input located on the load side of the input fuse.
The connection of the V•I Chip to its power source should be
implemented with minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed with a RC
damper to retain low source impedance and stable operation. With an
interconnect inductance of 200 nH, the RC damper may be 2 µF in series
with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may be
used in place of the series RC bypass.
4
3
2
+Out
B
B
C
C
D
D
+In
E
E
-Out
1
A
A
F
G
H
TM
H
J
RSV
J
K
PC
K
+Out
-Out
L
L
M
M
N
N
P
P
R
R
T
T
PC – Primary Control
-In
Bottom View
The Primary Control port is a multifunction node that provides the
following functions:
Enable/Disable – If the PC port is left floating, the BCM output is
enabled. Once this port is pulled lower than 2.4 Vdc with respect to
–In, the output is disabled. This action can be realized by employing
a relay, opto-coupler, or open collector transistor. Refer to Figures 13, 12 and 13 for the typical Enable/Disable characteristics. This port
should not be toggled at a rate higher than 1 Hz. The PC port should
also not be driven by or pulled up to an external voltage source.
Primary Auxiliary Supply – The PC port can source up to 2.4 mA at
5.0 Vdc. The PC port should never be used to sink current.
Alarm – The BCM contains circuitry that monitors output overload,
input over voltage or under voltage, and internal junction
temperatures. In response to an abnormal condition in any of the
monitored parameters, the PC port will toggle. Refer to Figure 13
for PC alarm characteristics.
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
Figure 14—BCM pin configuration
TM and RSV – Reserved for factory use.
+OUT/-OUT – DC Voltage Output Ports
Two sets of contacts are provided for the +Out port. They must be
connected in parallel with low interconnect resistance. Similarly, two sets
of contacts are provided for the –Out port. They must be connected in
parallel with low interconnect resistance. Within the specified operating
range, the average output voltage is defined by the Level 1 DC behavioral
model of Figure 22. The current source capability of the BCM is rated in
the specifications section of this document.
The low output impedance of the BCM reduces or eliminates the need
for limited life aluminum electrolytic or tantalum capacitors at the input
of POL converters.
Total load capacitance at the output of the BCM should not exceed the
specified maximum. Owing to the wide bandwidth and low output
impedance of the BCM, low frequency bypass capacitance and
significant energy storage may be more densely and efficiently provided
by adding capacitance at the input of the BCM.
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 6 of 13
PRELIMINARY
Mechanical Drawings (continued)
V•I Chip Bus Converter Module
6,2
0.25
22,0
0.87
15,99
0.630
3,01
0.118
3,01
0.118
(4) PL. 7,10
0.280
OUTPUT
INPUT
24,00
0.945
16,00
0.630 15,35
0.604
CL
INPUT
OUTPUT
32,0
1.26
8,56
0.337
(3) X 1.22
0.48
12,94
0.509
8,00
0.315
14,94
0.588
16,94
0.667
22,54
0.887
C
L
TOP VIEW (COMPONENT SIDE)
BOTTOM VIEW
NOTES:
1- DIMENSIONS ARE mm/[INCH].
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE.
Figure 15— BCM J-Lead mechanical outline; Onboard mounting
3,26
0.128
3,26
0.128
15,74
0.620
0,51
TYP
0.020
1,38
0.054 TYP
(2) X 8,94
0.352
(6) X
7,48
(8) X 0.295
+OUT
1,60
0.063
+IN
-OUT1
TM
RSV
PC
22,54
(2) X 0.887
(2) X16,94
0.667
(2) X14,94
0.588
12,94
(2) X 0.509
11,48
(2) X 0.452
(2) X 24,00
0.945
+OUT2
(2) X 16,00
0.630
-IN
-OUT2
8,00
(2) X 0.315
RECOMMENDED LAND PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
1- DIMENSIONS ARE mm/[INCH].
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
Figure 16— BCM PCB land layout information
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 7 of 13
PRELIMINARY
Configuration Options
V•I Chip Voltage Transformation Module
Standard(1)
(Figure 17)
Standard with 0.25"
heatsink
Effective power Density
876 W/in3
440 W/in3
Junction-board
Thermal Resistance
2.4 °C/W
2.4 °C/W
Junction-Case
Thermal Resistance
1.1 °C/W
N/A
Junction-Ambient
Thermal Resistance 300LFM
6.8 °C/W
5.0 °C/W
CONFIGURATION
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
22.0
0.87
32.0
1.26
6.3
0.25
STANDARD MOUNT
Figure 18—Hole location for push pin heatsink relative to VIC
Figure 17—Onboard mounting – package F
Thermal
Symbol
Parameter
Min
Typ
Max
Unit
Note
125
130
0.61
1.1
2.1
6.5
5.0
135
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Junction temperature
RθJC
RθJB
RθJA
RθJA
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-board thermal impedance
Junction-to-ambient (1)
Junction-to-ambient (2)
Notes:
(1) B352F110T24 surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) B352F110T24 with a 0.25"H Heatsink surface mounted on FR4 board, 300 LFM.
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 8 of 13
PRELIMINARY
Application Note
V•I Chip Bus Converter Module
Parallel Operation
The BCM will inherently current share when operated in an array. Arrays
may be used for higher power or redundancy in an application.
CASE 2—Conduction to the PCB
Current sharing accuracy is maximized when the source and load
impedance presented to each BCM within an array are equal.
The low thermal resistance Junction-to-board, RθJB, allows use of the
PCB to exchange heat from the V•I Chip, including convection from the
PCB to the ambient or conduction to a cold plate.
The recommended method to achieve matched impedances is to
dedicate common copper planes within the PCB to deliver and return the
current to the array, rather than rely upon traces of varying lengths. In
typical applications the current being delivered to the load is larger than
that sourced from the input, allowing traces to be utilized on the input
side if necessary. The use of dedicated power planes is, however,
preferable.
For example, with a V•I Chip surface mounted on a 2" x 2" area of a
multi-layer PCB, with an aggregate 8 oz of effective copper weight, the
total Junction-to-Ambient thermal resistance, RθJA, is 6.5°C/W in 300
LFM air flow (see Thermal section, page 8). Given a maximum junction
temperature of 125°C and 11 W dissipation at 240 W of output power,
a temperature rise of 72°C allows the V•I Chip to operate at rated
output power at up to 53°C ambient temperature.
The BCM power train and control architecture allow bi-directional power
transfer, including reverse power processing from the BCM output to its
input. Reverse power transfer is enabled if the BCM input is within its
operating range and the BCM is otherwise enabled. The BCM’s ability to
process power in reverse improves the BCM transient response to an
output load dump.
The high efficiency of the V•I Chip results in relatively low power
dissipation and correspondingly low generation of heat. The heat
generated within internal semiconductor junctions is coupled with low
effective thermal resistances, RθJC and RθJB, to the V•I Chip case and the
PCB allowing thermal management flexibility to adapt to specific
application requirements (Figure 19).
Output Power (W)
Thermal Management
240
CASE 1 Convection via heatsink to air.
0
The total Junction-to-Ambient thermal resistance, RθJA, of a surface
mounted V•I Chip with a 0.25"heatsink is 5°C/W in 300 LFM air flow
(Figure 21). At full rated output power of 240 W, the heat generated by
the BCM is approximately 11 W (Figure 6). Therefore, the junction
temperature rise to ambient is approximately 53°C. Given a maximum
junction temperature of 125°C, a temperature rise of 53°C allows the
V•I Chip to operate at rated output power at up to 72°C ambient
temperature. At 100 W of output power, operating ambient
temperature extends to 103°C.
-40
-20
0
20
40
60
80
100
120
140
Operating Junction Temperature (°C)
Figure 20— Thermal derating curve
BCM with 0.25'' Heatsink
10
9
Tja
8
7
6
θJC = 1.1°C/W
5
4
θJB = 2.1°C/W
3
0
100
200
300
400
500
600
Airflow (LFM)
Figure 19—Thermal resistance
Figure 21—Junction-to-ambient thermal resistance of BCM with 0.25"
Heatsink
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 9 of 13
PRELIMINARY
Application Note (continued)
V•I Chip Bus Converter Module
The thermal resistance of the PCB to the surrounding environment in
proximity to V•I Chips may be reduced by low profile heat sinks surface
mounted to the PCB.The PCB may also be coupled to a cold plate by low
thermal resistance standoff elements as a means of achieving effective
cooling for an array of V•I Chips, without a direct interface to their case.
CASE 3—Combined direct convection to the air and conduction to the PCB.
Parallel use of the V•I Chip internal thermal resistances (including Junctionto-Case and Junction-to-board) in series with external thermal resistances
provides an efficient thermal management strategy as it reduces total
thermal resistance. This may be readily estimated as the parallel network of
two pairs of series configured resistors.
V•I Chip Bus Converter Level 1 DC Behavioral Model for 352 V to 11.0 V, 240 W
ROUT
IOUT
+
+
11.0 mΩ
1/32 • Iout
VIN
+
+
–
IQ
14 mA
1/32 • Vin
V•I
VOUT
–
K
–
–
©
Figure 22—This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip Bus Converter Level 2 Transient Behavioral Model for 352 V to 11.0 V, 240 W
0.22 nH
ROUT
IOUT
L IN = 5 nH
+
11.0 mΩ
RCIN
32 mΩ
CIN
VIN
Lout = 1.1 nH
V•I
1/32 • Iout
+
+
–
0.25µF
IQ
14 mA
RCOUT
1.1 mΩ
+
0.2 mΩ
1/32 • Vin
COUT
31 µF
VOUT
–
K
–
–
©
Figure 23—This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 10 of 13
PRELIMINARY
Application Note (continued)
V•I Chip Bus Converter Module
Input Impedance Recommendations
To take full advantage of the BCM capabilities, the impedance presented
to its input terminals must be low from DC to approximately 5 MHz. The
source should exhibit low inductance (less than 100 nH) and should have a
critically damped response. If the interconnect inductance exceeds 100 nH,
the BCM input pins should be bypassed with an RC damper (e.g., 2 µF in
series with 0.3 ohm) to retain low source impedance and stable
operations. Given the wide bandwidth of the BCM, the source response is
generally the limiting factor in the overall system response.
Anomalies in the response of the source will appear at the output of the
BCM multiplied by its K factor. The DC resistance of the source should be
kept as low as possible to minimize voltage deviations. This is especially
important if the BCM is operated near low or high line as the over/under
voltage detection circuitry could be activated.
Input Fuse Recommendations
V•I Chips are not internally fused in order to provide flexibility in
configuring power systems. However, input line fusing of V•I Chips must
always be incorporated within the power system. A fast acting fuse should
be placed in series with the +IN port.
Applying the BCM
BCM
Vin = 330-365 Vdc
NP
NS
K=NS / NP
Vout = (Vin•K) – (Iout•Rout)
= 10.3-11.4 Vdc @ No load
= 9.99-11.1 Vdc @ Full load
BCM
NP
NS
B352F110T24
K = 1/32
Iout = 21.8 A @ 11.0 V
Rout = 11.0 mΩ
K=NS / NP
BCM
NP
NS
Paralleling
K=NS / NP
BCMs automatically current share
when connected in parallel.
No interconnections required.
Isolation Barrier
Standoff Voltage = 4,242 Vdc
Figure 24—The BCM provides an isolated output proportional to its input. It is easily parallelable to create high power arrays and/or for N+M redundancy.
Input reflected ripple
measurement point
F1
1A
Fuse
+Out
+In
+
Enable/Disable Switch
-Out
C1
2 µF
R2
2 kΩ
electrolytic
SW1
TM
RSV
PC
BCM
D1
-In
K
Ro
R3
0.1 mΩ
+Out
-Out
Load
C3
10 µF
–
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
Figure 25—BCM test circuit
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V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 11 of 13
PRELIMINARY
V•I Chip Bus Converter Module
V•I Chip soldering recommendations
Removal and rework
V•I Chip modules are intended for reflow soldering processes. The
following information defines the processing conditions required for
successful attachment of a V•I Chip to a PCB. Failure to follow the
recommendations provided can result in aesthetic or functional failure
of the module.
V•I Chip modules can be removed from PCBs using special tools such
as those made by Air-Vac. These tools heat a very localized region of
the board with a hot gas while applying a tensile force to the
component (using vacuum). Prior to component heating and removal,
the entire board should be heated to 80-100ºC to decrease the
component heating time as well as local PCB warping. If there are
adjacent moisture-sensitive components, a 125ºC bake should be used
prior to component removal to prevent popcorning. V•I Chip modules
should not be expected to survive a removal operation.
Storage
V•I Chip modules are currently rated at MSL 5. Exposure to ambient
conditions for more than 48 hours requires a 24 hour bake at 125ºC to
remove moisture from the package.
Solder paste stencil design
239
Solder paste is recommended for a number of reasons, including
overcoming minor solder sphere co-planarity issues as well as simpler
integration into overall SMD process.
63/37 SnPb, either no-clean or water-washable, solder paste should be
used. Pb-free development is underway.
The recommended stencil thickness is 6 mils. The apertures should be
0.9-0.9:1.
Joint Temperature, 220ºC
Case Temperature, 208ºC
183
165
degC
91
Pick and place
Modules should be placed within ±5 mils.to maintain placement
position, the modules should not be subjected to acceleration greater
than 500 in/sec2 prior to reflow.
16
Soldering Time
Figure 26—Thermal profile diagram
Reflow
There are two temperatures critical to the reflow process; the solder
joint temperature and the module’s case temperature. The solder joint’s
temperature should reach at least 220ºC, with a time above liquidus
(183ºC) of ~30 seconds.
The module’s case temperature must not exceed 208 ºC at anytime
during reflow.
Because of the ΔT needed between the pin and the case, a forced-air
convection oven is preferred for reflow soldering. This reflow method
generally transfers heat from the PCB to the solder joint. The module’s
large mass also reduces its temperature rise. Care should be taken to
prevent smaller devices from excessive temperatures. Reflow of
modules onto a PCB using Air-Vac-type equipment is not recommended
due to the high temperature the module will experience.
Inspection
The solder joints should conform to IPC 12.2
• Properly wetted fillet must be evident.
Figure 27— Properly reflowed V•I Chip J-Lead
• Heel fillet height must exceed lead thickness plus solder thickness.
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 12 of 13
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper
application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended
to the original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING, BUT
NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this
warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping
instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges
incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within
the terms of this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's
Intellectual Property Department.
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Vicor Express: [email protected]
Technical Support: [email protected]
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 1.1
11/05