Revised June 2005 FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch General Description Features FSUSB22 is a low power high bandwidth switch specially designed for applications of the switching of high speed USB 2.0 signals in handset and consumer applications such as cell phone, digital camera, and notebook with hubs or controllers of limited USB I/O. The wide bandwidth (750MHz) of this switch allows signals to pass with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal interference. It is compatible with USB2.0 Hi-Speed standard. ■ 40dB OFF Isolation at 250MHz ■ 40dB non-adjacent channel crosstalk at 250MHz ■ 4.5: typical On Resistance (RON) ■ 3dB bandwidth: 750MHz ■ Low power consumption (1uA max) ■ Control input: TTL compatible ■ Bidirectional operation ■ USB Hi-Speed and Full Speed signaling capability Applications • Cell phone, PDA, digital camera, and notebook Ordering Code: Order Package Number Number FSUSB22BQX Package Description MLP016E 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm FSUSB22QSC MQA16 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide FSUSB22QSCX_NL (Note 1) MQA16 Pb-Free 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide FSUSB22MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide FSUSB22MTCX_NL (Note 1) MTC16 Pb-Free 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS500899 www.fairchildsemi.com FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch January 2005 FSUSB22 Analog Symbol Connection Diagrams Pin Assignments for QSOP and TSSOP Pin Descriptions Pad Assignments for DQFN Pin Name Description OE Bus Switch Enable S Select Input A Bus A B1–B2 Bus B Truth Table S OE Function X H Disconnect L L A B1 H L A B2 www.fairchildsemi.com 2 Supply Voltage (VCC) DC Switch Voltage (VS) DC Input Voltage (VIN) (Note 3) DC Input Diode Current (lIK) VIN 0V Recommended Operating Conditions (Note 4) 0.5V to 4.6V 0.5V to VCC 0.05V 0.5V to 4.6V 50 mA DC Output (IOUT) Sink Current Power Supply Operating (VCC) 128 mA 0V to VCC Output Voltage (VOUT) 0V to VCC Input Rise and Fall Time (tr, tf) r100 mA 65qC to 150 qC DC VCC/GND Current (ICC /IGND) Storage Temperature Range (TSTG) 3.0V to 3.6V Input Voltage (VIN) Switch Control Input 0 ns/V to 5 ns/V Switch I/O ESD 0 ns/V to DC 40 qC to 85 qC Free Air Operating Temperature (TA) Human Body Model 4kV Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 3: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 4: Unused control inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VCC (V) Parameter TA Min 40 qC to 85 qC Typ (Note 5) Max 1.2 Units Conditions 18 mA VIK Clamp Diode Voltage VIH HIGH Level Input Voltage 3.0 - 3.6 VIL LOW Level Input Voltage 3.0 - 3.6 0.8 V II Input Leakage Current 3.6 r1.0 PA 0 d VIN d 3.6V IOFF OFF-STATE Leakage Current 3.6 r1.0 PA 0 d A, B d VCC RON Switch On Resistance 7.0 : 3.0 2.0 3.0 (Note 6) V IIN V 5.0 3.0 4.5 6.5 : VIN 0.8V ION 8 mA VIN 3.0V ION 8 mA 0.8V, VIN 'RON Delta RON 3.0 0.3 : VIN RFLAT(ON) On Resistance Flatness (Note 7) 3.0 1.0 : IOUT ICC Quiescent Supply Current 3.6 PA VIN Note 5: Typical values are at VCC 3.0V and TA 1.0 0V - 1.5V, ION 8 mA 8 mA VCC or GND, IOUT 0 25qC Note 6: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B) pins. Note 7: Flatness is defined as the difference between the maximum and minimum value On Resistance over the specified range of conditions. 3 www.fairchildsemi.com FSUSB22 Absolute Maximum Ratings(Note 2) FSUSB22 AC Electrical Characteristics Symbol VCC (V) Parameter TA Min 40qC to 85qC Typ (Note 8) Max Units Figure Number Conditions tON Turn ON Time S-to-Bus B 3.0 to 3.6 4.5 6.0 ns Figures 5, 6 tOFF Turn OFF Time S-to-Bus B 3.0 to 3.6 2.5 4.0 ns Figures 5, 6 tPD Propagation Delay 3.0 to 3.6 0.25 OIRR Non-Adjacent OFF-Isolation 3.0 to 3.6 XTALK Non-Adjacent Channel Crosstalk 3.0 to 3.6 BW 3dB Bandwidth 3.0 to 3.6 Note 8: Typical values are at VCC 3.3V and T A ns CL 30.0 dB f 38.0 dB RL 50:, f 250MHz Figure 8 750 MHz RL 50: Figure 9 tSK(O) tSK(P) Figure 10 250MHz, RL 50: Figure 7 25qC USB Related AC Electrical Characteristics Symbol 10 pF Parameter VCC TA (V) Min 40qC to 85qC Typ Max (Note 9) Units Figure Conditions Number Channel-to-Channel Skew 3.0 to 3.6 0.051 ns CL 10 pF Figures 10, 11 Skew of Opposite Transition 3.0 to 3.6 0.020 ns CL 10 pF Figures 10, 11 3.0 to 3.6 0.210 ns of the Same Output TJ Total Jitter RL tR Note 9: Typical values are at VCC Capacitance 3.3V and T A 50:, CL tF 10 pF 750ps at 480 Mbps 25qC (Note 10) Symbol TA Parameter 40qC to 85qC Typ Units Conditions CIN Control Pin Input Capacitance 2.5 pF VCC 0V CON A/B ON Capacitance 12.0 pF VCC 3.3V, OE COFF Port B OFF Capacitance 4.5 pF VCC and OE Note 10: Typical values are at VCC 3.3V and TA 25qC FIGURE 1. Gain vs. Frequency www.fairchildsemi.com 4 0V 3.3V FSUSB22 FIGURE 2. OFF Isolation FIGURE 3. Crosstalk FIGURE 4. RON 5 www.fairchildsemi.com FSUSB22 AC Loading and Waveforms Note: Input driven by 50: source terminated in 50 : Note: CL includes load and stray capacitance Note: Input PRR 1.0 MHz, t W 500 ns FIGURE 5. AC Test Circuit FIGURE 6. AC Waveforms FIGURE 7. OFF Isolation Test FIGURE 8. Crosstalk Test FIGURE 9. Bandwidth Test www.fairchildsemi.com 6 FSUSB22 AC Loading and Waveforms (Continued) FIGURE 10. Propagation Delay Pulse Skew tSK(P) Output Skew tSK(O) FIGURE 11. Skew Test 7 www.fairchildsemi.com FSUSB22 Tape and Reel Specification Tape Format for DQFN Package Designator BQX Tape Number Cavity Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) www.fairchildsemi.com 8 Cover Tape FSUSB22 Physical Dimensions inches (millimeters) unless otherwise noted 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E 9 www.fairchildsemi.com FSUSB22 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Package Number MQA16 www.fairchildsemi.com 10 FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16 Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 11 www.fairchildsemi.com