HITACHI 4066

HD74HC4066
Quad Analog Switches/Quad Multiplexers
Description
This switch has low “on” resistance and low “off” leakage. It is a bidirectional switch, thus any analog
input may be used as an output and vice-versa. Also the HD74HC4066 switch contains linearization
circuitry which lowers the “on” resistance and increases switch linearity. The HD74HC4066 device allows
control of up to 12 V (peak) analog signals with digital control signals of the same range. Each switch has
its own control input which disables each switch when low.
Features
• High Speed Operation
• Wide Operating Voltage
• Low Quiescent Supply Current
Function Table
Control
Switch
L
OFF
H
ON
GND ≤ Vin ≤ VCC
GND ≤ Vout ≤ VCC
HD74HC4066
Pin Arrangement
In 1
1
Out 1
2
Out 2
3
14 VCC
In
C
13 Control 1
Out
12 Control 4
In
In 2
Out
C
4
11 In 4
C
Control 2
5
Control 3
6
GND
7
Out
In
C
In
10 Out 4
9
Out 3
8
In 3
Out
(Top view)
Logic Diagram (1/4)
In/Out
Control
2
Out/In
HD74HC4066
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage
VCC
–0.5 to +7.0
V
Control input voltage
VIN
–0.5 to VCC + 0.5
V
Switch I/O voltage
VI/O
–0.5 to VCC + 0.5
V
(VCC)
I CC
+50
mA
(GND)
I GND
–50
mA
Switch I/O current (per pin)
I I/O
±25
mA
Control input diode current
I IK
±20
mA
Switch I/O diode current
I IOK
±20
mA
Power dissipation
PT
500
mW
Storage temperature range
Tstg
–65 to +150
°C
Supply current
3
HD74HC4066
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min
Typ
Max
Min
Max
Unit
2.0
1.5
—
—
1.5
—
V
4.5
3.15
—
—
3.15
—
6.0
4.2
—
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35
—
1.35
6.0
—
—
1.8
—
1.8
2.0
—
2000 5000 —
6250 Ω
VC = VIH
4.5
—
100
200
—
250
Vin = 0 to VCC
6.0
—
60
170
—
210
Iin/out = 1 mA
2.0
—
50
—
—
—
between any two
4.5
—
3
—
—
—
between any two
channels
6.0
—
2
—
—
—
channels
Item
Symbol
Control input voltage VIH
VIL
“ON” resistance
∆ON resistance
RON
∆RON
Test Conditions
V
Ω
VC = VIH, Iin/out = 1 mA
OFF channel
leakage current
(switch off)
I S (OFF)
6.0
—
—
±0.1
—
±1.0
µA
VC = VIL
VIN = VCC, Vout = GND
or, Vin = GND,
Vout = VCC
OFF channel
leakage current
(switch on)
I S (ON)
6.0
—
—
±0.1
—
±1.0
µA
VC = VIH
Vin = VCC or GND
Control input current Iin
6.0
—
—
±0.1
—
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
6.0
—
—
1.0
—
10.0
µA
Vin = VCC or GND
4
I CC
HD74HC4066
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min
Typ
Max
Min
Max
Unit
Test Conditions
Propagation delay
t PLH
2.0
—
—
50
—
65
ns
RL = 10 kΩ
time
t PHT
4.5
—
4
10
—
13
6.0
—
—
9
—
11
2.0
—
—
115
—
145
ns
RL = 1 kΩ
4.5
—
10
23
—
29
6.0
—
—
20
—
25
ns
RL = 1 kΩ
Output enable
t ZH
time
Output disable
t LZ
2.0
—
—
115
—
145
time
t HZ
4.5
—
14
23
—
29
6.0
—
—
20
—
25
Sine wave distortion
4.5
—
0.05
—
—
—
%
RL = 10 kΩ, C L = 50 pF,
f IN = 1 kHz
Band width (–3 dB)
4.5
—
30
—
—
—
MHz
RL = 600 Ω, CL = 50 pF,
20 log 10 Vout/Vin = –3dB
Feedthrouth
attenuation
4.5
—
–50
—
—
—
dB
RL = 600 Ω, CL = 50 pF,
f IN = 1 MHz
Cross talk between
2.0
—
25
—
—
—
mA
RL = 600 Ω, CL = 50 pF,
control input to
4.5
—
60
—
—
—
signal I/O
6.0
—
75
—
—
—
Cross talk between
any two switches
4.5
—
–50
—
—
—
dB
RL = 600 Ω, CL = 50 pF,
f IN = 1 MHz
Maximum control
2.0
—
20
—
—
—
MHz
RL = 1 kΩ, C L = 15 pF,
frequency
4.5
—
30
—
—
—
6.0
—
30
—
—
—
f IN = 1 MHz
Vout = 1/2 (VCC)
Control input
capacitance
Cin
—
5
10
—
10
pF
Switch I/O
capacitance
Cin/out
—
6
—
—
—
pF
Feed through
capacitance
Cin/out
—
0.5
—
—
—
pF
Power dissipation
capacitance
CPD
—
13
—
—
—
pF
5
Unit: mm
19.20
20.32 Max
8
6.30
7.40 Max
14
1.30
7
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.39 Max
2.54 Min 5.06 Max
1
7.62
+ 0.10
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-14
Conforms
Conforms
0.97 g
Unit: mm
10.06
10.5 Max
8
5.5
14
1
0.10 ± 0.10
1.42 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
7
+ 0.20
7.80 – 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DA
—
Conforms
0.23 g
Unit: mm
8.65
9.05 Max
8
1
7
*0.20 ± 0.05
0.635 Max
1.75 Max
3.95
14
+ 0.10
6.10 – 0.30
1.08
*0.40 ± 0.06
0.11
0.14 +– 0.04
0° – 8°
1.27
0.67
0.60 +– 0.20
0.15
0.25 M
*Pd plating
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-14DN
Conforms
Conforms
0.13 g
Unit: mm
4.40
5.00
5.30 Max
14
8
1
7
0.65
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.83 Max
0.07 +0.03
–0.04
*0.22+0.08
–0.07
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-14D
—
—
0.05 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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