HD74HCT125/HD74HCT126 Quad. Bus Buffer Gates (with 3-state outputs) ADE-205-545 (Z) 1st. Edition Sep. 2000 Description The HD74HCT125, HD74HCT126 require the 3-state control input C to be taken high to put the output into the high impedance condition, whereas the HD74HCT125, HD74HCT126 requires the control input to be low to put the output into high impedance. Features • • • • • • LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility High Speed Operation: tpd (A to Y) = 12 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 4.5 to 5.5 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Input C Output Y HCT125 HCT126 A HD74HCT125 HD74HCT126 H L X Z Z L H L L L L H H H H Notes: X: Irrelevant Z: Off (High-impedance) state of a 3-state output. HD74HCT125/HD74HCT126 Pin Arrangement HD74HCT125 1C 1 14 VCC 1A 2 13 4C 1Y 3 12 4A 2C 4 11 4Y 2A 5 10 3C 2Y 6 9 3A GND 7 8 3Y (Top view) HD74HCT126 1C 1 14 VCC 1A 2 13 4C 1Y 3 12 4A 2C 4 11 4Y 2A 5 10 3C 2Y 6 9 3A GND 7 8 3Y (Top view) 2 HD74HCT125/HD74HCT126 Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V Output current I OUT ±35 mA DC current drain per VCC, GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C DC Characteristics Ta = –40 to +85°C Ta = 25°C Test Conditions Item Symbol Min Typ Max Min Max Unit VCC (V) Input voltage VIH 2.0 — — — V 4.5 to 5.5 VIL — — 0.8 — 0.8 V 4.5 to 5.5 VOH 4.4 — — 4.4 — V 4.5 Vin = VIH or VIL I OH = –20 µA 4.18 — — 4.13 — 4.5 I OH = –6 mA — — 0.1 — 0.1 — — 0.26 — 0.33 Output voltage VOL 2.0 V 4.5 Vin = VIH or VIL I OL = 20 µA 4.5 I OL = 6 mA Off-state output current I OZ — — ±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL, Vout = VCC or GND Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND Quiescent supply current I CC — — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA 3 HD74HCT125/HD74HCT126 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Test Conditions Min Typ Max Min Max Unit VCC (V) Propagation delay t PHL — 12 20 — 25 ns 4.5 time t PLH — 12 20 — 25 Output enable t ZL — 12 30 — 38 time t ZH — 12 30 — 38 Output disable t LZ — 15 30 — 38 time t HZ — 15 30 — 38 Output rise/fall t TLH — 4 12 — 15 time t THL — 4 12 — 15 Input capacitance Cin — 5 10 — 10 Item 4 Symbol 4.5 ns 4.5 4.5 ns 4.5 4.5 ns 4.5 4.5 pF — HD74HCT125/HD74HCT126 Package Dimensions Unit: mm 19.20 20.32 Max 8 6.30 7.40 Max 14 1.30 7 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 2.39 Max 7.62 2.54 Min 5.06 Max 1 + 0.10 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Mass (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 8 5.5 14 1 0.10 ± 0.10 1.42 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 7 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-14DA — Conforms 0.23 g 5 HD74HCT125/HD74HCT126 Unit: mm 8.65 9.05 Max 8 1 7 *0.20 ± 0.05 0.635 Max 1.75 Max 3.95 14 + 0.10 6.10 – 0.30 1.08 0.11 0.14 +– 0.04 0° – 8° 1.27 *0.40 ± 0.06 + 0.67 0.60 – 0.20 0.15 0.25 M Hitachi Code JEDEC EIAJ Mass (reference value) *Pd plating FP-14DN Conforms Conforms 0.13 g Unit: mm 4.40 5.00 5.30 Max 14 8 1 7 0.65 1.0 0.13 M 6.40 ± 0.20 0.10 *Dimension including the plating thickness Base material dimension 6 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.83 Max 0.07 +0.03 –0.04 *0.22+0.08 –0.07 0.20 ± 0.06 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-14D — — 0.05 g HD74HCT125/HD74HCT126 Cautions 1. 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However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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