HITACHI HD74HC540

HD74HC540/HD74HC541
Octal Buffers/Line Drivers (with 3-state outputs)
Description
The HD74HC540 is an inverting buffer and the HD74HC541 is a non-inverting buffer. The 3-state control
gate operates as a two-input NOR such that if either G 1 or G 2 are high, all eight outputs are in the highimpedance state.
Features
•
•
•
•
•
High Speed Operation: tpd = 11.5 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs
Output Y
G1
G2
A
HD74HC540
HD74HD541
L
L
L
H
L
L
L
H
L
H
H
X
X
Z
Z
X
H
X
Z
Z
X :
Z :
irrelevant
off (high-impedance) state of a 3-state output.
HD74HC540/HD74HC541
Pin Arrangement
HD74HC540
G1
1
20 VCC
A1
2
19 G2
A2
3
18 Y1
A3
4
17 Y2
A4
5
16 Y3
A5
6
15 Y4
A6
7
14 Y5
A7
8
13 Y6
A8
9
12 Y7
GND 10
11 Y8
(Top view)
2
HD74HC540/HD74HC541
HD74HC541
G1
1
20 VCC
A1
2
19 G2
A2
3
18 Y1
A3
4
17 Y2
A4
5
16 Y3
A5
6
15 Y4
A6
7
14 Y5
A7
8
13 Y6
A8
9
12 Y7
GND 10
11 Y8
(Top view)
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage range
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC + 0.5
V
Output voltage
VOUT
–0.5 to VCC + 0.5
V
Output current
I OUT
±35
mA
DC current drai per VCC GND
I CC, I GND
±75
mA
DC input diode current
I IK
±20
mA
DC output diode current
I OK
±20
mA
Power Dissipation per package
PT
500
mW
Storage temperature
Tstg
–65 to +150
°C
3
HD74HC540/HD74HC541
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.3
—
0.3
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
—
0.1 —
—
—
4.5
—
0.4 —
—
—
6.0
—
0.4 —
—
—
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –6 mA
6.0
5.68 —
—
5.63
—
I OH = –7.8 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 6 mA
6.0
—
—
0.26 —
0.33
I OL = 7.8 mA
VIL
Hysteresis voltage VH
Output voltage
VOH
VOL
Test Conditions
V
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Off-state output
current
I OZ
6.0
—
—
±0.5 —
±5.0
µA
Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
4.0
40
µA
Vin = VCC or GND, Iout = 0 µA
4
—
HD74HC540/HD74HC541
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min Typ Max Min
Max
Unit
Test Conditions
Propagation delay t PLH
2.0
—
—
100 —
125
ns
(HD74HC540 only)
time
4.5
—
11
20
—
25
6.0
—
—
17
—
21
t PLH
2.0
—
—
115 —
145
ns
(HD74HC541 only)
t PHL
4.5
—
12
23
—
29
6.0
—
—
20
—
25
Item
Symbol
t PHL
Output enable
t ZH
2.0
—
—
150 —
190
time
t ZL
4.5
—
14
30
—
38
6.0
—
—
26
—
33
Output disable
t HZ
2.0
—
—
150 —
190
time
t LZ
4.5
—
16
30
—
38
6.0
—
—
26
—
33
Output rise/fall
t TLH
2.0
—
—
60
—
75
time
t THL
4.5
—
4
12
—
15
6.0
—
—
10
—
13
—
—
5
10
—
10
Input capacitance
Cin
ns
ns
ns
pF
5
Unit: mm
24.50
25.40 Max
6.30
11
1
7.00 Max
20
10
1.30
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
1
10
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
20
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
12.8
13.2 Max
11
1
10
0.20 ± 0.10
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.27 ± 0.05
0.25 ± 0.04
2.65 Max
7.50
20
0.25
10.40 +– 0.40
1.45
0° – 8°
0.57
0.70 +– 0.30
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DB
Conforms
—
0.52 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
: http:semiconductor.hitachi.com/
Europe
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan)
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.