HD74HC244 Octal Buffers/Line Drivers/Line Receivers (with noninverted 3-state outputs) Description The HD74HC244 is a non-inverting buffer and has two active low enables (1G and 2G). Each enable independently controls 4 buffers. This device does not have schmitt trigger inputs. Features • • • • • High Speed Operation: tpd = 11 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Inputs Output G A Y H X Z L H H L L L Notes H: high level L: low level X: irrelevant Z: off (high-impedance) state of a 3-state output HD74HC244 Pin Arrangement 1G1 1 20 VCC 1A1 2 19 2G 2Y4 3 18 1Y1 1A2 4 17 2A4 2Y3 5 16 1Y2 1A3 6 15 2A3 2Y2 7 14 1Y3 1A4 8 13 2A2 2Y1 9 12 1Y4 GND 10 11 2A1 (Top view) Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V DC current drain per pin I OUT ±35 mA DC current drain per VCC, GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power Dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C 2 HD74HC244 Logic Diagram To three other 7 inverters One of 8 inverters VCC Input A Y Strobe G 3 HD74HC244 DC Characteristics Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — 2.0 — — 0.5 — 0.5 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 1.9 2.0 — 1.9 — 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — I OH = –6 mA 6.0 5.68 — — 5.63 — I OH = –7.8 mA 2.0 — 0.0 0.1 — 0.1 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 I OL = 6 mA 6.0 — — 0.26 — 0.33 I OL = 7.8 mA VIL Output voltage VOH VOL Test Conditions V V V Vin = VIH or VIL I OH = –20 µA Vin = VIH or VIL I OL = 20 µA Off-state output current I OZ 6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL, Vout = VCC or GND Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply current I CC 6.0 — — 4.0 40 µA Vin = VCC or GND, Iout = 0 µA 4 — HD74HC244 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C VCC (V) Min Typ Max Min Max Unit Propagation delay t PHL 2.0 — — 90 — 115 ns time 4.5 — 12 18 — 23 6.0 — — 15 — 20 2.0 — — 90 — 115 4.5 — 10 18 — 23 6.0 — — 15 — 20 2.0 — — 150 — 190 4.5 — 11 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 12 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 16 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 19 30 — 38 6.0 — — 26 — 33 Item Symbol t PLH Output enable t ZL time t ZH Output disable t LZ time t HZ Output rise/fall t TLH 2.0 — — 60 — 75 time t THL 4.5 — 4 12 — 15 6.0 — — 10 — 13 — — 5 10 — 10 Input capacitance Cin Test Conditions ns ns ns ns ns ns pF 5 Unit: mm 24.50 25.40 Max 6.30 11 1 7.00 Max 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 2.54 Min 5.08 Max 0.89 7.62 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Weight (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DA — Conforms 0.31 g Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-20DA — — 0.07 g Cautions 1. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.