HITACHI HD74HC623

HD74HC620/HD74HC623
Octal Bus Transceivers (with inverted 3-state outputs)
Octal Bus Transceivers (with 3-state outputs)
Description
This octal bus transceiver is designed for asynchronous two-way communication between data buses. The
control fuction implementation allows for maximum flexibility in timing.
This device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending
upon the logic levels at the enable inputs (GBA and GAB).
The enable inputs can be used to disable the device so that the buses are effectively isolated.
The dual-enable configuration gives these devices the capability to store data by simultaneous enabling of
GBA and GAB. Each output reinforces its input in this transceiver configuration. Thus, when both control
inputs are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of
bus lines (16 in all) will remain at their last states. The 8-bit codes appearing on the two sets of buses will
be identical for the HD74HC623 or coplementary for the HD74HC620.
Features
•
•
•
•
•
High Speed Operation: tpd (Bus to Bus) = 12 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Enable Inputs
Operation
GBA
GAB
HD74HC620
HD74HC623
L
L
B data to A bus
B data to A bus
H
H
A data to B bus
A data to B bus
H
L
Isolation
Isolation
L
H
B data to A bus, A data to B bus
B data to A bus, A data to B bus
HD74HC620/HD74HC623
Pin Arrangement
Enable GAB 1
20 VCC
A1 2
19 Enable GBA
A2 3
18 B1
A3 4
17 B2
A4 5
16 B3
A5 6
15 B4
A6 7
14 B5
A7 8
13 B6
A8 9
12 B7
GND 10
11 B8
(Top view)
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage range
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC + 0.5
V
Output voltage
VOUT
–0.5 to VCC + 0.5
V
Output current
I OUT
±35
mA
DC current drain per VCC GND
I CC, I GND
±75
mA
DC input diode current
I IK
±20
mA
DC output diode current
I OK
±20
mA
Power Dissipation per package
PT
500
mW
Storage temperature
Tstg
–65 to +150
°C
2
HD74HC620/HD74HC623
Block Diagram
HD74HC620
GBA
GAB
VCC
A1
B1
VCC
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
3
HD74HC620/HD74HC623
HD74HC623
GBA
GAB
VCC
A1
B1
VCC
4
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
HD74HC620/HD74HC623
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –6 mA
6.0
5.68 —
—
5.63
—
I OH = –7.8 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 6 mA
6.0
—
—
0.26 —
0.33
I OL = 7.8 mA
VIL
Output voltage
VOH
VOL
Test Conditions
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Off-state output
current
I OZ
6.0
—
—
±0.5 —
±5.0
µA
Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
4.0
40
µA
Vin = VCC or GND, Iout = 0 µA
—
5
HD74HC620/HD74HC623
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
VCC (V) Min Typ Max Min
Max
Unit
Propagation delay t PLH
2.0
—
—
100 —
125
ns
time
4.5
—
12
20
—
25
6.0
—
—
17
—
21
Item
Symbol
t PHL
Output enable
t ZH
2.0
—
—
150 —
190
time
t ZL
4.5
—
12
30
—
38
6.0
—
—
26
—
33
Output disable
t HZ
2.0
—
—
150 —
190
time
t LZ
4.5
—
16
30
—
38
6.0
—
—
26
—
33
Output rise/fall
t TLH
2.0
—
—
60
—
75
time
t THL
4.5
—
4
12
—
15
6.0
—
—
10
—
13
—
—
5
10
—
10
Input capacitance
6
Cin
ns
ns
ns
pF
Test Conditions
Unit: mm
24.50
25.40 Max
6.30
11
1
7.00 Max
20
10
1.30
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
1
10
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
20
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
12.8
13.2 Max
11
1
10
0.20 ± 0.10
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.27 ± 0.05
0.25 ± 0.04
2.65 Max
7.50
20
0.25
10.40 +– 0.40
1.45
0° – 8°
0.57
0.70 +– 0.30
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DB
Conforms
—
0.52 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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