HD74HC640/HD74HC643 Octal Bus Transceivers (with 3-state outputs) ADE-205-517 (Z) 1st. Edition Sep. 2000 Description Each device has an active enable G and a direction control input, DIR. when DIR is high, data flows from the A inputs to the B outputs. When DIR is low, data flows from the B inputs to the A outputs. The HD74HC640 transfers inverted data from one bus to other and the HD74HC643 transfers inverted data from the A bus to the B bus and true data from the B bus to the A bus. Features • • • • • High Speed Operation: tpd = 12 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Control Inputs Operation G DIR HD74HC640 HD74HC643 L L B data to A bus B data to A bus L H A data to B bus A data to B bus H X Isolation Isolation HD74HC640/HD74HC643 Pin Arrangement HD74HC640 DIR 1 20 VCC A1 2 19 Enable G A2 3 18 B1 A3 4 17 B2 A4 5 16 B3 A5 6 15 B4 A6 7 14 B5 A7 8 13 B6 A8 9 12 B7 GND 10 11 B8 (Top View) 2 HD74HC640/HD74HC643 HD74HC643 DIR 1 20 VCC A1 2 19 Enable G A2 3 18 B1 A3 4 17 B2 A4 5 16 B3 A5 6 15 B4 A6 7 14 B5 A7 8 13 B6 A8 9 12 B7 GND 10 11 B8 (Top View) Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V Output current I OUT ±35 mA DC current drain per VCC , GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power Dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C 3 HD74HC640/HD74HC643 Block Diagram HD74HC640 G DIR VCC A B VCC To 7 Other Inverters 4 To 7 Other Inverters HD74HC640/HD74HC643 HD74HC643 G DIR VCC A B VCC To 7 Other Inverters To 7 Other Inverters 5 HD74HC640/HD74HC643 DC Characteristics Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — 2.0 — — 0.3 — 0.3 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 — 0.1 — — — 4.5 — 0.4 — — — 6.0 — 0.4 — — — 2.0 1.9 2.0 — 1.9 — 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — I OH = –6 mA 6.0 5.68 — — 5.63 — I OH = –7.8 mA 2.0 — 0.0 0.1 — 0.1 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 I OL = 6 mA 6.0 — — 0.26 — 0.33 I OL = 7.8 mA VIL Hysteresis voltage VH Output voltage VOH VOL Test Conditions V V V V Vin = VIH or VIL I OH = –20 µA Vin = VIH or VIL I OL = 20 µA Off-state output current I OZ 6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL, Vout = VCC or GND Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply current I CC 6.0 — — 4.0 40 µA Vin = VCC or GND, Iout = 0 µA 6 — HD74HC640/HD74HC643 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C VCC (V) Min Typ Max Min Max Unit Propagation delay t PLH 2.0 — — 90 — 115 ns time 4.5 — 12 18 — 23 6.0 — — 15 — 20 Item Symbol t PHL Output enable t ZH 2.0 — — 230 — 290 time t ZL 4.5 — 15 46 — 58 6.0 — — 39 — 49 Output disable t HZ 2.0 — — 215 — 270 time t LZ 4.5 — 17 43 — 54 6.0 — — 37 — 46 Output rise/fall t TLH 2.0 — — 60 — 75 time t THL 4.5 — 4 12 — 15 6.0 — — 10 — 13 — — 5 10 — 10 Input capacitance Cin Test Conditions ns ns ns pF 7 HD74HC640/HD74HC643 Package Dimensions Unit: mm 24.50 25.40 Max 1 7.00 Max 11 6.30 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 7.62 2.54 Min 5.08 Max 0.89 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Mass (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension 8 Hitachi Code JEDEC EIAJ Mass (reference value) FP-20DA — Conforms 0.31 g HD74HC640/HD74HC643 Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M Hitachi Code JEDEC EIAJ Mass (reference value) *Dimension including the plating thickness Base material dimension FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-20DA — — 0.07 g 9 HD74HC640/HD74HC643 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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