HITACHI HD74HC173

HD74HC173
4-bit D-type Register (with 3-state Outputs)
Description
The four D type Flip-Flops operate synchronously from a common clock. The 3-state outputs allow the
device to be used in bus organized systems. The outputs are placed in the 3-stage mode when either of the
output disable pins are in the logic high level.
The input disable allows the flip-flops to remain in their present states without having to disrupt the clock.
If either of the 2 input disables are taken to a logic high level, the Q outputs are fed back to the inputs,
forcing the flip-flops to remain in the same state. Clearing is enabled by taking the clear input to a logic
high level. The data outputs change state on the positive going edge of the clock.
Features
•
•
•
•
•
High Speed Operation: tpd (Clock to Q) = 14 ns typ (CL = 50 pF)
High Output Current: Fanout of 10 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs
Data Enable
Clear
Clock
G1
G2
Data D
Output Q
H
X
X
X
X
L
L
L
X
X
X
Q0
L
H
X
X
Q0
L
X
H
X
Q0
L
L
L
L
L
L
L
L
H
H
Note: When either M or N (or both) is (are) high the output is disabled to the high-impedance state;
however sequential operation of the flip-flops is not affected.
HD74HC173
Pin Arrangement
Output
Control
Output
M 1
16 VCC
Output
Control Clear
15 Clear
1Q 3
1Q
1D
14 1D
2Q 4
2Q
2D
13 2D
3Q 5
3Q
3D
12 3D
4Q 6
4Q
4D
11 4D
CK Data
Enable
10 G2
N 2
Clock 7
9 G1
GND 8
Data
Input
Data
Enable
Input
(Top view)
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage range
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC + 0.5
V
Output voltage
VOUT
–0.5 to VCC + 0.5
V
DC current drain per pin
I OUT
±35
mA
DC current drain per VCC, GND
I CC, I GND
±75
mA
DC input diode current
I IK
±20
mA
DC output diode current
I OK
±20
mA
Power dissipation per package
PT
500
mW
Storage temperature
Tstg
–65 to +150
°C
2
HD74HC173
Block Diagram
1D
D
C
C
2D
D
C
C
3D
D
C
C
4D
D
C
C
Q
R
Q
Q
R
VCC
2Q
VCC
Q
Q
R
1Q
Q
Q
R
VCC
Q
3Q
VCC
4Q
G1
G2
Clock
Clear
Control M
Control N
3
HD74HC173
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Input voltage
VIH
2.0
1.5 —
—
1.5
—
V
4.5
3.15 —
—
3.15
—
6.0
4.2 —
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35 —
1.35
6.0
—
—
1.8
—
1.8
2.0
1.9 2.0 —
1.9
—
4.5
4.4 4.5 —
4.4
—
6.0
5.9 6.0 —
5.9
—
4.5
4.18 —
—
4.13
—
I OH = –6 mA
6.0
5.68 —
—
5.63
—
I OH = –7.8 mA
2.0
—
0.0 0.1
—
0.1
4.5
—
0.0 0.1
—
0.1
6.0
—
0.0 0.1
—
0.1
4.5
—
—
0.26 —
0.33
I OL = 6 mA
6.0
—
—
0.26 —
0.33
I OL = 7.8 mA
VIL
Output voltage
VOH
VOL
Test Conditions
V
V
V
Vin = VIH or VIL I OH = –20 µA
Vin = VIH or VIL I OL = 20 µA
Off-state output
current
I OZ
6.0
—
—
±0.5 —
±5.0
µA
Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
6.0
—
—
±0.1 —
±1.0
µA
Vin = VCC or GND
Quiescent supply
current
I CC
6.0
—
—
4.0
40
µA
Vin = VCC or GND, Iout = 0 µA
4
—
HD74HC173
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Item
Symbol
VCC (V) Min Typ Max Min
Max
Unit
Maximum clock
f max
2.0
—
—
5
—
4
MHz
4.5
—
—
27
—
21
6.0
—
—
32
—
25
Propagation delay t PLH
2.0
—
—
175 —
220
time
4.5
—
14
35
—
44
6.0
—
—
30
—
37
2.0
—
—
150 —
190
4.5
—
14
30
—
38
6.0
—
—
26
—
33
t ZH
2.0
—
—
150 —
190
t ZL
4.5
—
12
30
—
38
6.0
—
—
26
—
33
t HZ
2.0
—
—
150 —
190
t LZ
4.5
—
12
30
—
38
6.0
—
—
26
—
33
2.0
100 —
—
125
—
4.5
20
4
—
25
—
6.0
17
–
—
21
—
2.0
90
—
—
115
—
4.5
18
0
—
23
—
6.0
15
—
—
20
—
2.0
5
—
—
5
—
4.5
5
–2
—
5
—
6.0
5
—
—
5
—
2.0
80
—
—
100
—
4.5
16
4
—
20
—
6.0
14
—
—
17
—
frequency
t PHL
t PHL
Enable time
Disable time
Setup time
Removal time
Hold time
Pulse width
t su
t rem
th
tw
Output rise/fall
t TLH
2.0
—
—
60
—
75
time
t THL
4.5
—
4
12
—
15
6.0
—
—
10
—
13
—
—
5
10
—
10
Input capacitance
Cin
Test Conditions
ns
Clock to Q
ns
Clear to Q
ns
ns
ns
ns
ns
ns
ns
pF
5
Unit: mm
19.20
20.00 Max
1
7.40 Max
9
6.30
16
8
1.3
0.48 ± 0.10
2.54 Min 5.06 Max
2.54 ± 0.25
0.51 Min
1.11 Max
7.62
+ 0.13
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
1
8
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
16
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
9.9
10.3 Max
9
1
8
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
0.15
*0.22 ± 0.03
0.20 ± 0.03
1.27
0.11
0.14 +– 0.04
1.75 Max
3.95
16
0.10
6.10 +– 0.30
1.08
0° – 8°
0.67
0.60 +– 0.20
0.25 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-16DN
Conforms
Conforms
0.15 g
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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