High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) FH16 Series FH16 Series Variation 0.3mm pitch 60 contact 0.3mm pitch 80 contact 0.3mm pitch 90 contact 0.4mm pitch 80 contact 0.5mm pitch 50 contact 0.5mm pitch 64 contact ■Features 1. High Density FPC Connector [Conventional product (FH12 series)] 0.5mm pitch 30 contact The FH16 series is a fine pitch, zero insertion force (ZIF), right angle, bottom contact, connector compatible with flexible printed circuits (FPC) with a pitch of 0.3mm, 0.4mm, and 0.5mm and a recommended thickness of 0.295mm for single-sided or 0.306mm for double-sided. The FH16 provides a higher pin Excellent Serviceability with Flip-Lock Design count given the same amount of board space than other manufacturers of similar product. With a large selection in pin density, the FH16 series greatly improves design flexibility. FH16 : 0.3mm pitch 60, 80, and 90 contacts Flip-lock type FH16M : 0.4mm pitch 80 and 96 contacts FH16H : 0.5mm pitch 50 contacts FH16P : 0.5mm pitch 64 contacts 2. Easy mounting on PCB FH16 supports 0.3mm pitch cable but only requires a 0.6mm pitch pad layout on the PCB. The FH16’s staggered pin design allows the mounting lead area to be twice as wide as the FPC contact area making it easier to place the connector on the board given the fine pitch of the contacts. 3. User Friendly Flip-Lock Design The flip-lock (one-touch rotating type) ZIF structure secures the FPC connection with a single and light force. This design helps simplify assembly and repair work. When locking the FPC, the audible click assures the assembly worker of a steady FPC connection resulting in improved customer service. Mechanism to prevent FPC from escape and oblique mating 4. Prevents FPC from escape and oblique mating The FH16 series with its recommended FPC dimensions prevents the FPC from escape and oblique mating thereby securing a steady connection. 5. Compatible with Automatic Assembly Tooling Embossed tape packaging allows for automatic placement onto the PCB. ■Applications Notebook computers, printers, PDAs, digital cameras and other compact devices for interconnecting the main circuit board with the LCD,PDP(Plasma Display),HDD or other device. Hard Disk-Drive PCB Notebook PC HDD PDP 66 PCB PCB ■Product Specifications Pitch Ratings Current rating 0.3mm 0.15A Voltage rating 3 0V AC 0.4mm 0.5mm 0.3A 50V AC 0.4A Operating Temperature Range: –40ç to +70ç Storage Temperature Range: –10ç to +50ç Operating Relative Humidity: Relative humidity 90% max Storage Relative Humidity: Relative humidity 90% max 60V AC (not dewed) Note1 (not dewed) Note2 Applicable cable t=0.30 ±0.05, Tin-lead plating (Note 3) Item Specification Conditions 100V DC 1. Insulation Resistance 500M ohms min. 0.3mm pitch: 090V AC 2. Withstanding Voltage No flashover or insulation breakdown. 3. Contact Resistance 4. Durability 0.4mm pitch: 150V AC 0.5mm pitch: 200V AC 150m ohms max. 1mA *Including FPC conductor resistance. 150m ohms max. 20 cycles (Insertion/withdrawal) No damage, cracks, or parts dislocation. No electrical discontinuity of 1µs or more 5. Vibration Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. Contact resistance: 150m ohms max. No damage, cracks, or parts dislocation. No electrical discontinuity of 1µs or more 6. Shock Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis. Contact resistance: 150m ohms max. No damage, cracks, or parts dislocation. 7. Humidity (Steady state) 8. Temperature cycle Contact resistance: 150m ohms max. 96 hours at temperature of 40ç and humidity of 90% to 95% Insulation resistance: 50M ohms min. No damage, cracks, or parts dislocation. Contact resistance: 150m ohms max. Temperature: – 40 Insulation resistance: 50M ohms min. Time Soldering heat → +15 to 35ç → +85ç → +15ç to 35ç : 30 minutes → 5 minutes max. → 30 minutes → 5 minutes max. No damage, cracks, or parts dislocation. 9. Resistance to applied for one minute 5 cycles No deformation of components affecting performance. Reflow: At the recommended temperature profile Manual soldering: 350±5ç for 3 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers nonconducting condition of installed connectors in storage, shipment or during transportation. Note 3: When FPC is gold plated, the connector contacts should be also gold plated: Select the (05) specification. ■Materials Part Material Finish Polyamide Insulator Color : Beige LCP UL94V-0 Color : Dark brown PPS Contact Remarks Tin-lead plating Phosphor bronze ––––––– Gold plating ■Ordering Information FH 16 – 64S – 0.5 SHW (05) q w e r t y q Series name : FH w Series No. : 16 e Number of contacts : 50, 60, 64, 80, 90, and 96 contacts r Contact pitch : 0.3mm, 0.4mm, 0.5mm t Terminal Shape : SHW(SMT horizontal staggered row mount type) y Plating Specification : No symbol : Tin-lead plating (05) : gold plating 67 BConnector Operating Instructions, precautions and recommendations Operation Precautions 1.FPC Termination procedure. Connector installed on the board. 1) Fully insert the FPC parallel to mounting surface, with the exposed conductive traces facing down. 1) Remove and dispose the pick-and-place insert. Positioning point 2) Rotate down the actuator until firmly closed. It is critical that the inserted FPC is not moved and remains fully inserted. Should the FPC be moved, open the actuator and repeat the process, starting with Step 1 above. 2) The connector will assure reliable performance when the actuator is open to 120° maximum (see fig.1) Do not exceed this angle, as this may cause permanent damage to the connector. Fig.1 120° 3) Do NOT push/pull actuator. Any damage to actuator will require replacement of the entire connector. 2.FPC Removal 1) Lift up the actuator. 2) Carefully remove the FPC. 68 ■Connector Dimensions A B Q C 0.12 R Mark 4.9 10 0.12 R D 3 5.5 6.5 Suction Parts for Automatic Mounting E 6.6 7.4 FPC Conductive Surface Unit: mm Number of FPC contacts Contact Pitch 60 0.3 Part Number CL No. A B C D E Q R FH16-60S-0.3SHW 586-0620-2 FH16-80S-0.3SHW 586-0613-7 80 0.3 21.9 17.7 17.4 17.4 18.35 0.3 0.6 27.9 23.7 23.4 23.4 24.35 0.3 0.6 FH16-90S-0.3SHW 586-0697-7 90 FH16M-80S-0.4SHW 586-0675-4 80 0.3 30.9 26.7 26.4 26.4 27.35 0.3 0.6 0.4 36.1 31.6 31.2 31.2 32.25 0.4 0.8 FH16M-96S-0.4SHW 586-0715-7 96 0.4 42.5 38.0 37.6 37.6 38.65 0.4 0.8 FH16H-50S-0.5SHW 586-0676-7 50 0.5 29.4 24.5 24.0 24.0 25.55 0.5 1.0 FH16P-64S-0.5SHW 586-0649-4 64 0.5 36.0 31.5 31.0 31.0 32.15 0.5 1.0 NOTE: Embossed tape reel packaging (1,000 pieces/reel). Order by number of reels. 69 BRecommended PCB layout and metal mask dimensions B±0.05 C±0.05 R±0.05 1.7±0.1 3.95±0.1 1.7±0.1 Q±0.05 W (PCB) X (Metal mask) Mark side R±0.05 W (PCB) X (Metal mask) D±0.05 * Recommended metal mask thickness: t=0.15 BFPC recommended dimensions 0.3 +0.04 _0.03 0.1±0.05 0.07±0.07 4 MIN 3 MIN 2.65±0.2 1.4±0.1 1.3±0.1 1.4±0.1 0.8 R0 .2 R0 .2 +0.04 _0.03 1.8±0.1 2 0. ( 0.5 ) .2 R0 R Q±0.02 0.1±0.05 2 B±0.03 S±0.07 0.3±0.05 +0.04 0.3 _0.03 R±0.02 S±0.07 F±0.05 G±0.1 H±0.1 1 * Forced film material shall be polyamide + thermal hardened additives. 2 Conductor width shall be 0.1±0.05 if FPC has plating bars. FPC, Land, Metal Mask Dimension Table 70 Number of FPC contacts Contact Pitch Part Number CL No. FH16-60S-0.3SHW 586-0620-2 60 0.3 FH16-80S-0.3SHW 586-0613-7 80 FH16-90S-0.3SHW 586-0697-7 90 FH16M-80S-0.4SHW 586-0675-4 FH16M-96S-0.4SHW 586-0715-7 B Unit: mm C D F G H Q R S W X 17.7 17.4 17.4 18.3 18.8 20.3 0.3 0.6 0.3 0.3±0.03 0.25±0.03 0.3 23.7 23.4 23.4 24.3 24.8 26.3 0.3 0.6 0.3 0.3±0.03 0.25±0.03 0.3 26.7 26.4 26.4 27.3 27.8 29.3 0.3 0.6 0.3 0.3±0.03 0.25±0.03 80 0.4 31.6 31.2 31.2 32.2 32.7 34.2 0.4 0.8 0.3 0.3±0.03 0.25±0.03 96 0.4 38.0 37.6 37.6 38.6 39.1 40.6 0.4 0.8 0.3 0.3±0.03 0.25±0.03 FH16H-50S-0.5SHW 586-0676-7 50 0.5 24.5 24.0 24.0 25.5 25.5 27.5 0.5 1.0 0.5 0.6±0.10 00.5±0.05 FH16P-64S-0.5SHW 586-0649-4 64 0.5 31.5 31.0 31.0 32.1 32.6 34.1 0.5 1.0 0.3 0.6±0.10 00.5±0.05 BPackaging Specification ●Embossed Carrier Tape Dimensions 4 2 12 6.8 0.5 1.75 .5 J 1.7 10 K M L Ø1 Flat surface for placement with Automatic equipment 1.5 4.9 7 Unreeling direction Unit: mm Inserted Connector Number of Contacts J K L M T FH16-60S-0.3SHW 60 44 40.4 20.2 22.3 44.5 FH16-80S-0.3SHW 80 44 40.4 20.2 28.3 44.5 FH16-90S-0.3SHW 90 44 40.4 20.2 31.3 44.5 FH16M-80S-0.4SHW 80 56 52.4 26.2 36.6 56.5 FH16M-96S-0.4SHW 96 56 52.4 26.2 43.0 56.5 FH16H-50S-0.5SHW 50 44 40.4 20.2 29.9 44.5 FH16P-64S-0.5SHW NOTE: 1,000 pieces per reel. 64 56 52.4 26.2 36.6 56.5 ●Reel Dimensions T End portion Blank portion (10 pocket min.) Mounting portion Embossed carrier tape Ø 80 Ø370 Ø13 2 Lead portion (400mm min.) Blank portion Top cover tape (10 pocket min.) 71 BRecommended Temperature Profile 5 sec. max. 250 240ç Temperature (ç) 200 200ç 160ç 150 150ç 100 50 25ç (30 sec.) (60 sec.) (20 to 30 sec.) 60 to 90 sec. 0 Start 60 Preheating Time (sec.) 72 120 Soldering 180 HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 45mm∞80mm∞1.6mm thick Land dimensions :Contact Pitch 0.3mm, 0.4mm 0.3mm∞1.7mm Contact Pitch 0.5mm 0.6mm∞1.7mm Metal mask :Contact Pitch 0.3mm, 0.4mm 0.25mm∞1.7mm∞0.15mm thick Contact Pitch 0.5mm 0.5mm∞1.7mm∞0.15mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. BFH16 Series FPC Construction (Recommended Specifications) 1. Using Single-Sided FPC Material Name Covering layer film Material Thickness (µm) Polyamide 1 mil 25 Cover adhesive 25 Surface treatment Tin-lead plating Copper foil Cu 5 1oz 35 Base adhesive Base film 25 Polyamide 1 mil 25 Reinforcement material adhesive Heat-hardened adhesive Stiffener 30 Polyamide 7 mil 175 Total 295 2. Using Double-Sided FPC Material Name Covering layer film Material Thickness (µm) Polyamide 1 mil 25 25 Cover adhesive Surface treatment Tin-lead plating Through hole copper Cu Copper foil Cu 5 15 1/2 oz 18 18 Base adhesive Polyamide 1 mil Base film 25 18 Base adhesive Cu Copper foil 1/2 oz 18 25 Cover adhesive Cover layer film Polyamide 1 mil 25 Reinforcement material adhesive Heat-hardened adhesive Stiffener 50 Polyamide 1 mil 100 Total 299 Note : To prevent release of the lock due to FPC bending, please do not use copper foil on the rear side. 3. Precautions 1. This specification is a recommendation for the construction of the FH16 Series FPC (t=0.3 ±0.05). 2. The FH16 Series are connectors for thin FPC which is beginning to be used in cameras and other miniature equipment. Stiffener is not required for double-sided FPC which will be reflected in FPC cost reduction. Please note that in the case of single-sided FPC, stiffener is required, but the thickness dimension can be created easily. For details about the construction, please contact the FPC manufacturer. FPC Manufactures' Contact List Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division 5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan TEL:+81 3 5462 4191 FAX:+81 3 5462 4882 Fujikura Ltd. Electronics Global Marketing Department 1-5-1, Kiba, Koto-ku, Tokyo, Japan TEL:+81 3 5606 1165 FAX:+81 3 5606 1530 NOK Corporation Sales Division Overseas Business Department 1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan TEL:+81 3 3432 6976/8415 FAX:+81 3 3432 3919 73